Integrated current sensor with magnetic flux concentrators

Patent metadata

Field	Value
Publication number	US-11422167-B2
Application number	US-202016932299-A
Country	US
Kind code	B2
Filing date	Jul 17, 2020
Priority date	Jul 17, 2020
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

A packaged current sensor includes a lead frame, an integrated circuit, an isolation spacer, a first magnetic concentrator, and a second magnetic concentrator. The lead frame includes a conductor. The isolation spacer is between the lead frame and the integrated circuit. The first magnetic concentrator is aligned with the conductor. The second magnetic concentrator is aligned with the conductor.

First claim

What is claimed is:

1. A packaged current sensor, comprising:
a lead frame comprising a conductor;
an integrated circuit;
a dielectric material between the lead frame and the integrated circuit; and
a magnetic concentrator that overlaps the conductor.

2. The packaged current sensor of claim 1 , wherein the integrated circuit includes a Hall effect sensor, and the Hall effect sensor overlaps the magnetic concentrator.

3. The packaged current sensor of claim 2 , wherein:
the magnetic concentrator is a first magnetic concentrator;
the packaged current sensor includes a second magnetic concentrator; and
the Hall effect sensor overlaps a space between the first magnetic concentrator and the second magnetic concentrator.

4. The packaged current sensor of claim 3 , wherein the Hall effect sensor overlaps a respective first edge of the first magnetic concentrator and second edge of the second magnetic concentrator.

5. The packaged current sensor of claim 2 , wherein the Hall effect sensor is aligned with the magnetic concentrator.

6. The packaged current sensor of claim 3 , wherein:
the conductor comprises a first linear segment, a second linear segment, and a bent segment electrically coupled between the first and second linear segments;
the first magnetic concentrator overlaps the first linear segment;
the second magnetic concentrator overlaps the second linear segment;
the Hall effect sensor is configured to generate a first signal based on a first magnetic flux at the first magnetic concentrator and a second magnetic flux at the second magnetic concentrator; and
the integrated circuit is configured to generate a second signal representing a current in the conductor based on the first signal.

7. The packaged current sensor of claim 1 wherein the integrated circuit comprises:
a first Hall effect sensor that overlaps a first edge of the magnetic concentrator; and
a second Hall effect sensor that overlaps a second edge of the magnetic concentrator opposite the first edge.

8. The packaged current sensor of claim 7 , wherein:
the magnetic concentrator is a first magnetic concentrator;
the packaged current sensor comprises a second magnetic concentrator; and
the integrated circuit comprises:
a third Hall effect sensor that overlaps a third edge of the second magnetic concentrator; and
a fourth Hall effect sensor that overlaps a fourth edge of the second magnetic concentrator opposite the third edge.

9. The packaged current sensor of claim 8 , wherein:
the conductor comprises:
a current input leg; and
a current output leg; and

the first magnetic concentrator overlaps the current input leg; and
the second magnetic concentrator overlaps the current output leg.

10. The packaged current sensor of claim 9 , wherein the first magnetic concentrator is aligned with the current input leg, and the second magnetic concentrator is aligned with the current output leg.

11. The packaged current sensor of claim 8 , wherein the first magnetic concentrator and the second magnetic concentrator are electroplated onto the integrated circuit.

12. The packaged current sensor of claim 7 , wherein the first Hall effect sensor is aligned with the first edge, and the second Hall effect sensor is aligned with the second edge.

13. The packaged current sensor of claim 8 , wherein the third Hall effect sensor is aligned with the third edge, and the fourth Hall effect sensor is aligned with the fourth edge.

14. The packaged current sensor of claim 1 , wherein the magnetic concentrator includes a circular disk of soft magnetic material or a polygonal disk of soft magnetic material.

15. The packaged current sensor of claim 1 , wherein the magnetic concentrator is aligned with the conductor.

16. A current sensor, comprising:
a lead frame comprising a conductor, the conductor including a current input segment, a current output segment, and a bent segment electrically coupled between the current input and output segments;
an integrated circuit comprising a Hall effect sensor;
an isolation spacer between the lead frame and the integrated circuit;
a first magnetic concentrator that overlaps the current input segment; and
a second magnetic concentrator that overlaps the current output segment.

17. The current sensor of claim 16 , wherein the second magnetic concentrator overlaps the Hall effect sensor.

18. The current sensor of claim 16 , wherein:
the Hall effect sensor is a first Hall effect sensor that overlaps a first edge of the first magnetic concentrator; and
the integrated circuit includes a second Hall effect sensor that overlaps a second edge of the first magnetic concentrator opposite the first edge.

19. The current sensor of claim 18 , wherein:
the integrated circuit includes a third Hall effect sensor that overlaps a third edge of the second magnetic concentrator.

20. The current sensor of claim 19 , wherein:
the integrated circuit includes a fourth Hall effect sensor that overlaps a fourth edge of the second magnetic concentrator opposite the third edge.

21. The current sensor of claim 20 , wherein the integrated circuit includes a summation circuit having a first input, a second input, a third input, a fourth input, and a measurement output, the first input coupled to a first output of the first Hall effect sensor, the second input coupled to a second output of the second Hall effect sensor, the third input coupled to a third output of the third Hall effect sensor, and the fourth input coupled to a fourth output of the fourth Hall effect sensor, the summation circuit is configured to:
receive a first signal via the first input;
receive a second signal via the second input;
receive a third signal via the third input;
receive a fourth signal via the fourth input;
generate a fifth signal representing a measurement of a current in the conductor, the fifth signal generated based on: (a) a first difference between the first and second signals; and (b) a second difference between the third and fourth signals; and
provide the fifth signal at the measurement output.

22. The current sensor of claim 16 , wherein each of the first magnetic concentrator and the second magnetic concentrator includes a circular disk of soft magnetic material.

23. The current sensor of claim 16 , wherein each of the first magnetic concentrator and the second magnetic concentrator includes a polygonal disk of soft magnetic material.

24. The current sensor of claim 16 , wherein the first magnetic concentrator is aligned with the current input segment, and the second magnetic concentrator is aligned with the current output segment.

25. The current sensor of claim 16 , wherein the first magnetic concentrator is aligned.

26. The current sensor of claim 16 , wherein the isolation spacer includes a dielectric material.

27. A current sensor, comprising:
a lead frame comprising a conductor, the conductor including a current input segment, a current output segment, and a bent segment electrically coupled between the current input and output segments;
an integrated circuit including a first Hall effect sensor, a second Hall effect sensor, a third Hall effect sensor, and a fourth Hall effect sensor;
an isolation spacer between the lead frame and the integrated circuit; and
a first magnetic concentrator and a second magnetic concentrator on the integrated circuit, the first magnetic con

Assignees

• Texas Instruments Inc

Inventors

• Lee Dok Won
• Bito Jo
• Green Keith Ryan

Classifications

• H10W70/458

  of insulating layers on leadframes · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• G01R15/202 Primary

  using Hall-effect devices (Hall elements in arrangements for measuring electrical power G01R21/08) · CPC title