Test board and test apparatus including a multi-type fluid supplier for testing electronic apparatuses having semiconductor devices

US11422158B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11422158-B2
Application numberUS-202016943632-A
CountryUS
Kind codeB2
Filing dateJul 30, 2020
Priority dateDec 6, 2019
Publication dateAug 23, 2022
Grant dateAug 23, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A test board and a test apparatus having the same are disclosed. The test board includes a base plate including a connector and a plurality of mounting areas in a matrix shape having a mounting row in a first direction and a mounting column in a second direction, a plurality of test units arranged on the mounting areas of the base plate and a test object is mounted in each of the mounting areas, and a fluid supplier disposed on the base plate and supplying a test fluid to each of the test units having a test temperature and a supplementary fluid to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the test objects is substantially below the test temperature.

First claim

Opening claim text (preview).

What is claimed is: 1. A test board for mounting a plurality of test objects, comprising: a base plate including at least a connector and a plurality of mounting areas in a matrix shape having at least a mounting row in a first direction and at least a mounting column in a second direction substantially perpendicular to the first direction; a plurality of test units arranged on the mounting areas of the base plate, respectively, and a test object is mounted in each of the mounting areas for an operational test; and a fluid supplier including a main fluid line and a supplementary fluid line, wherein the fluid supplier is disposed on the base plate and supplies a test fluid via the main fluid line to each of the test units for the operational test having a test temperature and a supplementary fluid via the supplementary fluid line to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the plurality of test objects is substantially below the test temperature, wherein the supplementary fluid line is disposed on the base plate and extends in the first direction alternately with the mounting row, wherein the main fluid line is disposed on the base plate and extends in the second direction, wherein each of the test units includes: a mounting frame arranged in the mounting area of the base plate and holding the test object; and a socket arranged on the base plate and is connected to the connector such that the test object is combined with the socket and is connected to the connector via the socket in the operational test, and wherein the mounting frame includes: a support plate on the base plate; and a pair of holding members arranged on peripheral portions of the support plate and are spaced apart in the first direction such that the holding members are shaped into a slender bar extending in the second direction and the test object is mounted on the holding members. 2. The test board of claim 1 , wherein the support plate is configured to have a size larger than the test object such that the support plate is partially exposed at an end portion to dissipate an operational heat of the test object. 3. A test board for mounting a plurality of test objects, comprising: a base plate including at least a connector and a plurality of mounting areas in a matrix shape having at least a mounting row in a first direction and at least a mounting column in a second direction substantially perpendicular to the first direction; a plurality of test units arranged on the mounting areas of the base plate, respectively, and a test object is mounted in each of the mounting areas for an operational test; and a fluid supplier including a main fluid line and a supplementary fluid line, wherein the fluid supplier is disposed on the base plate and supplies a test fluid via the main fluid line to each of the test units for the operational test having a test temperature and a supplementary fluid via the supplementary fluid line to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the plurality of test objects is substantially below the test temperature, wherein the supplementary fluid line is disposed on the base plate and extends in the first direction alternately with the mounting row such that the supplementary fluid is supplied onto the test object in the second direction from the supplementary fluid line as a slant flow slanted with respect to the test object, wherein the main fluid line is disposed on the base plate and extends in the second direction such that the test fluid is supplied onto the test object in the first direction from the main fluid line as a horizontal flow substantially horizontal with respect to the test object, and wherein each of the test units includes: a mounting frame arranged in the mounting area of the base plate and holding the test object; and a socket arranged on the base plate and is connected to the connector such that the test object is combined with the socket and is connected to the connector via the socket in the operational test. 4. The test board of claim 3 , wherein the supplementary fluid line includes: a supply line body disposed at a rear portion of the socket with a height higher than the socket and is shaped into a continuous line extending in the first direction; and a plurality of injectors slantly arranged at a side surface of the supply line body toward the test objects such that the supplementary fluid is injected onto the test objects from the injectors at a slant angle. 5. The test board of claim 3 , wherein the supplementary fluid line includes: a plurality of supply blocks discontinuously positioned at each rear side of the sockets corresponding to each mounting frame with a height higher than the socket and are spaced apart from each other by a same gap distance in the first direction; and a plurality of injectors slantly arranged at a side surface of each of the supply blocks toward the test objects such that the supplementary fluid is injected onto the test objects from the injectors at a slant angle. 6. The test board of claim 3 , wherein the main fluid line includes: an inlet line body arranged on the base plate in parallel with the mounting frame in a shape of a slender member extending in the second direction and supplying the test fluid onto the test objects; and an outlet line body spaced apart from the inlet line body on the base plate in the first direction in a shape of a slender member continuously extending in the second direction and discharging the test fluid from the test objects to generate a horizontal flow from the inlet line body to the outlet line body. 7. The test board of claim 6 , wherein the main fluid line further includes at least a flow compensator arranged on the base plate between the inlet line body and the outlet line body and extending in the second direction such that the flow compensator is interposed between the neighboring mounting columns in parallel with the inlet line body and the outlet line body to control a speed of the horizontal flow. 8. The test board of claim 7 , wherein the flow compensator includes a slender body extending in the second direction and is positioned between the neighboring columns, and a plurality of orifices penetrating through the slender body such that a cross-sectional area of each orifice decreases in the first direction. 9. The test board of claim 3 , wherein the test object includes an array circuit board having a plurality of circuit boards connected to each other, a plurality of electronic apparatuses under test mounted on the array circuit board and connected to the array circuit board, and a temperature sensor arranged on the array circuit board and detecting a surface temperature of the test object. 10. The test board of claim 9 , further comprising a fluid controller obtaining the temperature difference and controlling the supplementary fluid to flow onto the test object until the surface temperature of the test object reaches the test temperature. 11. The test board of claim 10 , wherein the fluid controller includes: a detection controller controlling the temperature sensor to detect the actual temperature of each test object; a temperature operator calculating a temperature difference between the actual temperature and the test temperature of the operational test and obtaining the temperature difference of each test object; an object selector selecting a particular test object as a temperature-deviated test object when the temperature differenc

Assignees

Inventors

Classifications

  • Chambers or ovens; Tanks · CPC title

  • Environmental or reliability testing, e.g. burn-in or validation tests (of individual semiconductors G01R31/2642; of printed circuits boards G01R31/2817; of IC's G01R31/2855) · CPC title

  • related to temperature · CPC title

  • G01R1/44Primary

    Modifications of instruments for temperature compensation · CPC title

  • Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863) · CPC title

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What does patent US11422158B2 cover?
A test board and a test apparatus having the same are disclosed. The test board includes a base plate including a connector and a plurality of mounting areas in a matrix shape having a mounting row in a first direction and a mounting column in a second direction, a plurality of test units arranged on the mounting areas of the base plate and a test object is mounted in each of the mounting areas…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01R31/2874. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).