Exposed wire-bonding for sensing liquid and water in electronic devices

Patent metadata

Field	Value
Publication number	US-11422104-B2
Application number	US-202016854688-A
Country	US
Kind code	B2
Filing date	Apr 21, 2020
Priority date	Sep 6, 2019
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.

First claim

What is claimed is:

1. An electronic device, comprising:
a housing defining an internal volume;
a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment, the pressure sensor assembly comprising:
a structure at least partially enclosing a sensor volume;
a pressure sensor affixed to a die disposed in the sensor volume; and
an exposed moisture detection conductor positioned inside the sensor volume and exposed to the ambient environment.

2. The electronic device of claim 1 , further comprising a processor connected to the exposed moisture detection conductor, the processor detecting a change in at least one of a resistance, a capacitance, or an inductance of a circuit including the exposed moisture detection conductor.

3. The electronic device of claim 1 , further comprising an array of exposed moisture detection conductors positioned in the sensor volume.

4. The electronic device of claim 1 , wherein the exposed moisture detection conductor comprises a wire loop.

5. The electronic device of claim 1 , wherein the exposed moisture detection conductor is bonded to a pad of the die.

6. A pressure sensor assembly, comprising:
a structure at least partially enclosing a sensor volume;
a pressure sensor affixed to a die disposed in the sensor volume; and
an exposed moisture detection conductor positioned inside the sensor volume and exposed to an environment outside the sensor volume.

7. The pressure sensor assembly of claim 6 , wherein the pressure sensor assembly detects the presence of a liquid in the sensor volume by detecting a change in a resistance of a circuit including the exposed moisture detection conductor.

8. The pressure sensor assembly of claim 6 , wherein pressure sensor assembly detects the presence of the liquid by detecting a change in at least one of a capacitance or an inductance of a circuit including the exposed moisture detection conductor.

9. The pressure sensor assembly of claim 6 , further comprising an array of exposed moisture detection conductors positioned in the sensor volume.

10. The pressure sensor assembly of claim 6 , wherein the exposed moisture detection conductor comprises a wire loop.

11. The pressure sensor assembly of claim 6 , further comprising a gel at least partially occupying the sensor volume.

12. The pressure sensor assembly of claim 11 , wherein the exposed moisture detection conductor is at least partially disposed in the gel and protrudes from the gel by at least 100 microns.

13. The pressure sensor assembly of claim 6 , wherein:
the structure comprises a wall of conductive material at least partially surrounding the sensor volume; and
the exposed electrical conductor and the wall are electrically connected.

14. The pressure sensor assembly of claim 6 , wherein the structure comprises:
a ceramic material at least partially surrounding the sensor volume; and
a conductive contact electrically connected to the exposed electrical conductor.

15. The pressure sensor assembly of claim 6 , wherein the exposed electrical conductor comprises a metallic wire coated with a corrosion resistant material.

Assignees

• Apple Inc

Inventors

• Han Caleb C
• Boozer Brad G
• Macneil David
• Arndt Gregory B
• O'Brien Patrick E
• Solasi Roham
• Jiang Tongbi T
• Balasubramanian Ashwin
• Lee William S
• Bhattacharyya Manoj K
• Liang Jiahui
• Horiuchi James G
• Gider Savas

Classifications

• G01N27/228

  Circuits therefor (measuring capacitance per se G01R27/26) · CPC title

• G01N27/226

  Construction of measuring vessels; Electrodes therefor · CPC title

• G01N27/048

  for determining moisture content of the material · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F1/1684

  Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 · CPC title