Display apparatus and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11417640-B2
Application number	US-202016915026-A
Country	US
Kind code	B2
Filing date	Jun 29, 2020
Priority date	Jul 23, 2015
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

A display apparatus includes: a transparent substrate; a panel substrate; a light emitting diode disposed between the transparent substrate and the panel substrate; an insulation layer covering side surfaces of the light emitting diode; a first connection electrode electrically connected to the light emitting diode and disposed on the insulation layer between the insulation layer and the panel substrate; a second connection electrode on the panel substrate; and an electrode connector electrically connecting the first connection electrode to the second connection electrode, wherein the first connection electrode has an overlapping portion overlapping with the light emitting diode and a non-overlapping portion laterally extending from the overlapping portion on the insulation layer.

First claim

What is claimed is:

1. A display apparatus comprising:
a light emitting diode part;
a thin film transistor (TFT) panel unit; and
an anisotropic conductive film disposed between the light emitting diode part and the TFT panel unit,
wherein the light emitting diode part comprises a support substrate, an electrode disposed on the support substrate, and light emitting diodes disposed on the electrode,
wherein the light emitting diodes comprise blue light emitting diodes, green light emitting diodes, and red light emitting diodes,
wherein the support substrate comprises a first bonding portion disposed on the electrode to bond the blue light emitting diodes, a second bonding portion disposed on the electrode to bond the green light emitting diodes, and a third bonding portion disposed on the electrode to bond the red light emitting diodes.

2. The display apparatus of claim 1 ,
wherein the TFT panel unit comprises a TFT drive circuit.

3. The display apparatus of claim 2 ,
wherein the TFT drive circuit is a circuit for driving an active matrix.

4. The display apparatus of claim 2 ,
wherein the TFT drive circuit is a circuit for driving a passive matrix.

5. The display apparatus of claim 1 ,
wherein the anisotropic conductive film comprises an adhesive organic insulation material and conductive particles dispersed therein.

6. The display apparatus of claim 5 ,
wherein the anisotropic conductive film exhibits conductivity in a thickness direction and an insulation property in a plane direction.

7. The display apparatus of claim 1 ,
wherein the support substrate is selected from the group consisting of a sapphire substrate, a gallium nitride substrate, a glass substrate, a silicon carbide substrate, a silicon substrate, and a metal substrate of a ceramic substrate.

8. The display apparatus of claim 1 ,
wherein the support substrate is a flexible substrate.

9. The display apparatus of claim 7 ,
wherein the support substrate comprises a plurality of conductive patterns formed on an upper surface thereof configured to be electrically connected to the light emitting diodes.

10. The display apparatus of claim 8 ,
wherein the support substrate comprises a plurality of conductive patterns formed on an upper surface thereof configured to be electrically connected to the light emitting diodes.

11. The display apparatus of claim 9 ,
wherein one of the plurality of conductive patterns is electrically connected to an external power source.

12. The display apparatus of claim 9 ,
wherein the light emitting diodes are form an array of flip-chip type light emitting diodes or an array of vertical type light emitting diodes on the support substrate.

13. The display apparatus of claim 1 ,
wherein each of the blue light emitting diodes is not disposed at a location corresponding to the second bonding portion or the third bonding portion.

14. The display apparatus of claim 13 ,
wherein the light emitting diodes are disposed relative to each other at a distance on the support substrate at least twice a width of the light emitting diodes.

15. The display apparatus of claim 1 ,
wherein the light emitting diode part further comprises an insulation layer surrounding each of the light emitting diodes.

16. The display apparatus of claim 15 ,
wherein the light emitting diode part further comprises a light blocking part on the support substrate.

17. The display apparatus of claim 16 ,
wherein the insulation layer is formed to partially cover the light blocking part.

18. The display apparatus of claim 16 ,
wherein the light blocking part surrounds each of the light emitting diodes.

19. The display apparatus of claim 16 ,
wherein the light blocking part is formed between the light emitting diodes.

20. The display apparatus of claim 12 ,
wherein each of the light emitting diodes comprises:
an n-type semiconductor layer;
a p-type semiconductor layer;
an active layer interposed between the n-type semiconductor layer and the p-type semiconductor layer;
an n-type electrode coupled to the n-type semiconductor layer; and
a p-type electrode coupled to the p-type semiconductor layer.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Takeya Motonobu
• Kim Young Hyun

Classifications

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7414

  the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support · CPC title

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title