Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11417469-B2
Application number	US-202117144191-A
Country	US
Kind code	B2
Filing date	Jan 8, 2021
Priority date	Jan 24, 2020
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

A multilayer ceramic electronic component includes a multilayer body and a protective layer provided at least on a first main surface or a second main surface of the multilayer body, in which the protective layer includes a carbon material, has a carbon content of about 70 atm % or more determined through exclusion of hydrogen, oxygen, and halogen contents, and has a sp3 percentage of about 10% or more as an index of C—C bond type.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of ceramic layers that are stacked and a plurality of internal electrode layers each stacked on the plurality of ceramic layers and including a first main surface and a second main surface on opposite sides in a height direction, a first end surface and a second end surface on opposite sides in a longitudinal direction perpendicular or substantially perpendicular to the height direction, and a first side surface and a second side surface on opposite sides in a width direction perpendicular or substantially perpendicular to the height and longitudinal directions;
a first external electrode on the multilayer body;
a second external electrode on the multilayer body; and
a protective layer at least on the first main surface or the second main surface of the multilayer body; wherein
the protective layer includes a carbon material with a carbon content of about 70 atm % or more determined through exclusion of hydrogen, oxygen, and halogen contents, and a sp3 percentage of about 10% or more as an index of C—C bond type.

2. The multilayer ceramic electronic component according to claim 1 , wherein the protective layer is provided on each of the first main surface and the second main surface.

3. The multilayer ceramic electronic component according to claim 1 , wherein
the first external electrode is provided on a portion of the first main surface or a portion of the second main surface;
the second external electrode is provided on a portion of the first main surface or a portion of the second main surface; and
the protective layer is provided on a portion of the multilayer body between the first external electrode on a portion of the first main surface or a portion of the second main surface and the second external electrode on a portion of the first main surface or a portion of the second main surface.

4. The multilayer ceramic electronic component according to claim 1 , wherein
the first external electrode is provided on a portion of the first main surface or a portion of the second main surface;
the second external electrode is provided on a portion of the first main surface or a portion of the second main surface;
the protective layer is provided at an interface between the first external electrode and the multilayer body and extends over a portion of the multilayer body in which the first external electrode is not provided; and
the protective layer is provided at an interface between the second external electrode and the multilayer body and extends over a portion of the multilayer body in which the second external electrode is not provided.

5. The multilayer ceramic electronic component according to claim 1 , wherein the protective layer has an area ratio of about 20% or more with respect to the first main surface or the second main surface.

6. The multilayer ceramic electronic component according to claim 1 , wherein the protective layer has a thickness of about 0.1 μm or more.

7. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body has a thickness of about 10 μm or more and about 200 μm or less.

8. The multilayer ceramic electronic component according to claim 1 , wherein the protective layer includes diamond-like carbon.

9. The multilayer ceramic electronic component according to claim 1 , wherein no other protective layer to increase strength is included inside the multilayer body.

10. The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of ceramic layers is made of a dielectric ceramic mainly including BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZnO 3 .

11. The multilayer ceramic electronic component according to claim 10 , wherein each of the plurality of ceramic layers includes at least one of a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound as a subcomponent.

12. The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of ceramic layers has a thickness of about 0.4 μm or more and about 10 μm or less.

13. The multilayer ceramic electronic component according to claim 1 , wherein the protective layer is disposed only on the second main surface.

14. The multilayer ceramic electronic component according to claim 1 , wherein the plurality of internal electrode layers include first internal electrode layers extending to the first end surface, and second internal electrode layers extending to the second end surface.

15. The multilayer ceramic electronic component according to claim 14 , wherein the first external electrode is disposed on the first end surface and electrically connected to the first internal electrode layers, and the second external electrode is provided on the second end surface and electrically connected to the second internal electrode layers.

16. The multilayer ceramic electronic component according to claim 1 , wherein
the first external electrode includes first and second foundation layers and a first plating layer; and
the second external electrode includes third and fourth foundation layers and a second plating layer.

17. The multilayer ceramic electronic component according to claim 16 , wherein
the first foundation layer covers a portion of the first main surface adjacent to the first end surface;
the second foundation layer covers a portion of the second main surface adjacent to the first end surface;
the third foundation layer covers a portion of the first main surface adjacent to the second end surface; and
the fourth foundation layer covers a portion of the second main surface adjacent to the second end surface.

18. The multilayer ceramic electronic component according to claim 17 , wherein each of the first, second, third, and fourth foundation layers is defined by a sputtered electrode.

19. The multilayer ceramic electronic component according to claim 1 , wherein the sputtered electrode includes at least one of Ni, Cr, and Cu.

20. The multilayer ceramic electronic component according to claim 18 , wherein the sputtered electrode has a thickness of about 50 nm or more and about 130 nm or less.

Assignees

• Murata Manufacturing Co

Inventors

• Nishimura Ryo

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title