Method for manufacturing coil, coil and electronic device
US-2020365320-A1 · Nov 19, 2020 · US
Method for manufacturing coil, coil and electronic device
US11417463B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11417463-B2 |
| Application number | US-201716643361-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 5, 2017 |
| Priority date | Aug 30, 2017 |
| Publication date | Aug 16, 2022 |
| Grant date | Aug 16, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a coil, comprising: (a) bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; (b) cutting a coil pattern on a second side of the metal sheet by a laser transmission to form the coil running through the two first and second sides of the metal sheet; (c) bonding the second side of the metal sheet onto an adhesive tape; (d) transmitting the laser transmission through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate; (e) removing the adhesive layer to expose the coil pattern on the first side of the metal sheet; and (d) forming an encapsulation layer on the patterned coil to encapsulate the first side of the coil. 2. The method of claim 1 , wherein the adhesive layer is made from polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, an acrylic adhesive, a photoresist, parylene, polyamide or polyurethane. 3. The method of claim 1 , wherein the laser-transmitting substrate is made of laser-transmitting glass or laser-transmitting sapphire. 4. The method of claim 1 , wherein the adhesive tape is a UV tape, and an adhesive tape frame is further disposed at each of two ends of the UV tape. 5. The method of claim 1 , wherein the encapsulation layer is made from polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, an acrylic adhesive, a photoresist, parylene, polyamide or polyurethane. 6. The method of claim 1 , wherein the encapsulation layer is formed on the patterned coil by means of whirl coating, spray coating, dispensing, printing or vapor deposition. 7. The method of claim 1 , wherein the cutting further comprises cutting the metal sheet by the laser to form an external pad. 8. The method of claim 1 , wherein the metal sheet is made of a copper foil.
Assignees
Inventors
Classifications
- H01F41/045Primary
Trimming · CPC title
- H01F27/2847Primary
Sheets; Strips (H01F27/2866 takes precedence) · CPC title
Printed circuit coils · CPC title
- H01F41/04Primary
for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title
Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11417463B2 cover?
- Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal shee…
- Who is the assignee on this patent?
- Goertek Inc
- What technology area does this patent fall under?
- Primary CPC classification H01F41/045. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).