Method of deriving appropriate cutting conditions for cutting polarizing plate

Patent metadata

Field	Value
Publication number	US-11415734-B2
Application number	US-201916958946-A
Country	US
Kind code	B2
Filing date	Jun 21, 2019
Priority date	Jun 22, 2018
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

A method of deriving an appropriate condition for cutting a polarizing plate, the method including: (a) preparing a polarizing plate including an adhesive layer and having a cut surface; (b) providing the polarizing plate so that one end of the polarizing plate adjoins a guide unit; (c) moving the polarizing plate on the guide unit; (d) measuring frictional force applied between the polarizing plate and the guide unit while moving the polarizing plate; and (e) deriving the appropriate condition for cutting the polarizing plate based on the measured value of the frictional force and a predetermined adhesive agent leakage determination criterion based on the frictional force.

First claim

The invention claimed is:

1. A method of deriving an appropriate cutting condition for cutting a polarizing plate, the method comprising:
(a) preparing a polarizing plate including an adhesive layer, wherein the polarizing plate has a cut surface;
(b) providing the polarizing plate so that one end of the polarizing plate adjoins a guide unit;
(c) moving the polarizing plate on the guide unit;
(d) measuring frictional force applied between the polarizing plate and the guide unit while moving the polarizing plate; and
(e) deriving the appropriate cutting condition for cutting the polarizing plate based on the measured value of the frictional force and a predetermined adhesive agent leakage determination criterion based on the frictional force.

2. The method of claim 1 , wherein the appropriate cutting condition includes a cutting angle formed between one of two surfaces of the polarizing plate and the cut surface of the polarizing plate.

3. The method of claim 1 , wherein step (b) includes adjusting a size of a curl formed at one end of the polarizing plate.

4. The method of claim 1 , wherein a protective film layer is positioned on one of two surfaces of the polarizing plate, and a release film layer is positioned on the other of the two surfaces of the polarizing plate.

5. The method of claim 1 , wherein step (c) moves the polarizing plate in a first direction toward which one of two surfaces of the polarizing plate is directed or a second direction toward which the other of the two surfaces of the polarizing plate is directed.

6. The method of claim 5 , wherein step (e) includes calculating a difference between a frictional force measured when the polarizing plate moves in the first direction and a frictional force measured when the polarizing plate moves in the second direction and comparing the difference with the determination criterion.

7. The method of claim 6 , wherein step (e) derives the appropriate cutting condition for cutting the polarizing plate when it is determined that the adhesive agent does not leak from the polarizing plate based on the calculated difference between the values of the frictional force and the determination criterion.

Assignees

• Lg Chemical Ltd
• Shanjin Optoelectronics Suzhou Co Ltd

Inventors

• Lee Moon Chan
• Park Jeong Ho
• Lee Jin Soo
• Shin Bu Gon

Classifications

• B29D11/00932

  Combined cutting and grinding thereof · CPC title

• G02B5/30 Primary

  Polarising elements (light-modulating devices with active elements G02F1/00) · CPC title

• B29D11/00644 Primary

  polarizing · CPC title

• B29D11/00951

  Measuring, controlling or regulating · CPC title

• G02B5/3033 Primary

  in the form of a thin sheet or foil, e.g. Polaroid · CPC title