High and/or low energy system coupler

US11415451B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11415451-B2
Application numberUS-201916371119-A
CountryUS
Kind codeB2
Filing dateApr 1, 2019
Priority dateApr 1, 2019
Publication dateAug 16, 2022
Grant dateAug 16, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Devices, systems, and methods for interacting instrumentation with high and/or low energy systems are disclosed. In some illustrative embodiments, a sensor assembly for level measurement of high and/or low energy systems may comprise an instrumentation head to determine a level of media in a tank; a coupler including a body having a mounting end for connection to equipment of a high or low energy system and a receiving end for receiving connection of the instrumentation head, a coaxial hardline extending between the mounting and receiving ends and including a conduction tip arranged near the mounting end; and a sealing system including a first seal section disposed between the conduction tip and the receiving end of the body.

First claim

Opening claim text (preview).

The invention claimed is: 1. A sensor assembly for level measurement of high and/or low energy systems, the sensor assembly comprising: an instrumentation head to determine a level of media in a tank; a coupler including a body having a mounting end for connection to equipment of a high or low energy system and a receiving end for receiving connection of the instrumentation head, a coaxial hardline extending between the mounting end and the receiving end and including a conduction tip arranged near the mounting end, wherein the body includes a mount receiver at the mounting end formed to receive a bushing assembly to engage a connector with the conduction tip; and a sealing system including a first seal section disposed between the conduction tip and the receiving end of the body. 2. The sensor assembly of claim 1 , wherein the first seal section includes a fused seam between a sleeve of the coaxial hardline and the body of the coupler. 3. The sensor assembly of claim 1 , wherein the first seal section includes a fused seam between a sleeve of the coaxial hardline and an extension tube of the conduction tip. 4. The sensor assembly of claim 1 , wherein a gasket is disposed between the bushing assembly and the body and forms at least a portion of a second seal section of the sealing system. 5. The sensor assembly of claim 4 , wherein another gasket is disposed between the bushing assembly and the connector and forms at least another portion of the second seal section. 6. The sensor assembly of claim 1 , wherein the mount receiver defines a receptacle for receiving at least a portion of the bushing assembly and the receptacle includes interior threads for receiving a fastener of the bushing assembly. 7. The sensor assembly of claim 6 , wherein the connector penetrates through the bushing assembly and the bushing assembly fills the receptacle to reduce empty space at the mounting end. 8. The sensor assembly of claim 7 , wherein the coaxial hardline includes an inner conductor, an outer conductor, and an insulator between the inner conductor and the outer conductor. 9. The sensor assembly of claim 8 , wherein the insulator comprises at least one of MgO, Al 2 O 3 , and SiO 2 . 10. The sensor assembly of claim 6 , wherein the bushing assembly includes a ceramic bushing defining a cavity therein for receiving a head of the connector. 11. The sensor assembly of claim 10 , wherein a gasket forming at least a portion of a second seal section of the sealing system is disposed between the head and the bushing, the head positioned between the gasket and the conduction tip. 12. The sensor assembly of claim 6 , wherein the mount receiver includes an endwall surface defining a base of the receptacle having an opening communicating with a passageway containing the coaxial hardline, wherein the conduction tip terminates within the passageway. 13. The sensor assembly of claim 12 , wherein the coaxial hardline does not extend through the endwall surface. 14. The sensor assembly of claim 1 , wherein the mount receiver is formed as an extension from a base portion of the body, the base portion having a solid core for providing structural support to the sensor assembly, the solid core having a through passageway into which the coaxial hardline extends, wherein the first seal section includes a fused seam formed between the mount receiver and a sleeve of the coaxial hardline to seal the passageway against leakage. 15. The sensor assembly of claim 1 , wherein the body defines a cavity through which the coaxial hardline extends, wherein the cavity is filled with an insulation material. 16. The sensor assembly of claim 1 , wherein the coaxial hardline is a 50 ohm impedance hardline. 17. The sensor assembly of claim 7 , wherein the connector engages the conduction tip when the bushing assembly is installed from the mounting end of the coupler. 18. The sensor assembly of claim 1 , wherein the sealing system includes a second seal section disposed between the conduction tip and the mounting end of the body of the coupler. 19. The sensor assembly of claim 18 , wherein the second seal section includes at least one gasket.

Assignees

Inventors

Classifications

  • using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated · CPC title

  • Radar or analogous systems specially adapted for specific applications (electromagnetic prospecting or detecting of objects, e.g. near-field detection, G01V3/00) · CPC title

  • Coupling devices having more than two ports (H01P5/04 takes precedence) · CPC title

  • G01F23/284Primary

    Electromagnetic waves · CPC title

  • Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver · CPC title

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What does patent US11415451B2 cover?
Devices, systems, and methods for interacting instrumentation with high and/or low energy systems are disclosed. In some illustrative embodiments, a sensor assembly for level measurement of high and/or low energy systems may comprise an instrumentation head to determine a level of media in a tank; a coupler including a body having a mounting end for connection to equipment of a high or low ener…
Who is the assignee on this patent?
Abb Schweiz Ag
What technology area does this patent fall under?
Primary CPC classification G01F23/284. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).