Holey graphene mesh and solvent-free manufacturing and composites thereof

US11413850B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11413850-B2
Application numberUS-202017099312-A
CountryUS
Kind codeB2
Filing dateNov 16, 2020
Priority dateJul 20, 2017
Publication dateAug 16, 2022
Grant dateAug 16, 2022

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  1. Title

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  5. First independent claim

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Abstract

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Systems, methods, and devices of the various embodiments provide for the creation of holey graphene meshes (HGMs) and composite articles including HGMs. Various embodiments provide solvent-free methods for creating arrays of holes on holey graphene-based articles formed from dry compression (such as films, discs, pellets), thereby resulting in a HGM. In further embodiments, a HGM can used as part of a composite, such as by: 1) embedding a HGM into another matrix material such as carbon, polymer, metals, metal oxides, etc; and/or (2) the HGM serving as a matrix by filling the holes of the HGM or functionalizing the HGM body with another one or more materials. In various embodiments, HGM can also be made as a composite itself by creating holes on dry-compressed articles pre-embedded with one or more other materials.

First claim

Opening claim text (preview).

What is claimed is: 1. A holey graphene mesh, comprising: a holey graphene structure having a thickness defined between a first surface of the holey graphene structure and a second surface of the holey graphene structure, the holey graphene structure having a pattern array of holes of a same hole shape formed in the first surface of the holey graphene structure without the use of a solvent, each of the holes extending from the first surface of the holey graphene structure toward the second surface of the holey graphene structure in a same direction. 2. The holey graphene mesh of claim 1 , wherein the holey graphene structure is comprised of holey graphene and at least one other material. 3. The holey graphene mesh of claim 2 , wherein the other material is Ruthenium, Platinum, Ferric Oxide, Titanium Dioxide, Silicon, or Epoxy. 4. The holey graphene mesh of claim 1 , wherein the first surface of the holey graphene structure has a hole density of at least 20%, wherein the hole density is a ratio of hole area to total area of the first surface of the holey graphene structure. 5. The holey graphene mesh of claim 1 , wherein the same hole shape is circular or square. 6. The holey graphene mesh of claim 5 , wherein the pattern array of holes is such that each of the array of holes has a diameter of about 114 μm and a center-to-center hole distance of about 310 μm. 7. The holey graphene mesh of claim 6 , wherein the pattern array of holes is such that each of the array of holes has a hole depth equal to the thickness. 8. The holey graphene mesh of claim 1 , further comprising at least one additional material filling the array of holes. 9. The holey graphene mesh of claim 8 , wherein the additional material is Ruthenium, Platinum, Ferric Oxide, Titanium Dioxide, Silicon, or Epoxy. 10. The holey graphene mesh of claim 1 , wherein the same hole shape is circular, the pattern array of holes is such that each of the array of holes has a hole depth equal to the thickness, and the pattern array of holes is such that a center-to-center hole distance between adjacent holes of the array of holes is the same throughout the pattern array of holes. 11. The holey graphene mesh of claim 1 , wherein the pattern array of holes is such that at least two holes of the array of holes have different hole depths. 12. The holey graphene mesh of claim 1 , wherein the holey graphene structure is a dry compressed holey graphene structure. 13. The holey graphene mesh of claim 1 , wherein holes occurring in the holey graphene structure itself are of a first size at or below a first hole diameter and each of the array of holes are of second size at or above a second hole diameter, and wherein the first hole diameter is smaller than the second hole diameter. 14. The holey graphene mesh of claim 13 , wherein the first hole diameter is less than 100 nanometers and the second hole diameter is greater than 100 nanometers. 15. The article of claim 13 , wherein the holey graphene structure is a dry compressed holey graphene sheet. 16. The article of claim 15 , wherein holes occurring in the dry compressed holey graphene sheet itself are of a first size at or below a first hole diameter and each of the array of holes are of second size at or above a second hole diameter, and wherein the first hole diameter is less than 100 nanometers and the second hole diameter is greater than 1 micrometer. 17. An article, comprising: a holey graphene mesh, comprising a holey graphene structure having a thickness defined between a first surface of the holey graphene structure and a second surface of the holey graphene structure, the holey graphene structure having a pattern array of holes of a same hole shape formed in the first surface of the holey graphene structure without the use of a solvent, each of the holes extending from the first surface of the holey graphene structure toward the second surface of the holey graphene structure in a same direction. 18. The article of claim 17 , further comprising at least one additional material filling the array of holes. 19. The article of claim 18 , wherein the article is an energy storage device. 20. The article of claim 17 , wherein the same hole shape is circular, the pattern array of holes is such that each of the array of holes has a hole depth equal to the thickness, and the pattern array of holes is such that a center-to-center hole distance between adjacent holes of the array of holes is the same throughout the pattern array of holes.

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What does patent US11413850B2 cover?
Systems, methods, and devices of the various embodiments provide for the creation of holey graphene meshes (HGMs) and composite articles including HGMs. Various embodiments provide solvent-free methods for creating arrays of holes on holey graphene-based articles formed from dry compression (such as films, discs, pellets), thereby resulting in a HGM. In further embodiments, a HGM can used as pa…
Who is the assignee on this patent?
Nasa
What technology area does this patent fall under?
Primary CPC classification B32B9/007. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).