Implementing embedded wire repair for PCB constructs

Patent metadata

Field	Value
Publication number	US-11412612-B2
Application number	US-201916508945-A
Country	US
Kind code	B2
Filing date	Jul 11, 2019
Priority date	Jul 26, 2018
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

First claim

What is claimed is:

1. A structure for implementing embedded wire repair for printed circuit board (PCB) constructs comprising:
a printed circuit board (PCB);
the printed circuit board (PCB) having a repair wire layer within a PCB stack with reference planes on opposite sides of the repair wire layer;
an appropriate plated through hole (PTH) forming a repair connection using the repair wire layer when a repair connection is required, wherein the repair connection enables controlled impedance with the reference planes disposed at a fixed distance from the repair wire layer.

2. The structure as recited in claim 1 wherein the repair wire layer includes an embedded isolated internal conductor.

3. The structure as recited in claim 2 wherein the repair wire layer includes the isolated internal conductor separated from plated through holes (PTHs) in the PCB stack.

4. The structure as recited in claim 1 wherein the repair wire layer includes an embedded isolated conductive wire mesh.

5. The structure as recited in claim 1 wherein the repair wire layer includes an embedded isolated twisted-pair mesh.

6. The structure as recited in claim 1 wherein said repair wire layer includes an embedded isolated embroidered wire mesh.

7. The structure as recited in claim 1 wherein the repair connection provides enhanced channel performance over repair work at a surface level of the PCB stack.

8. The structure as recited in claim 1 wherein the repair wire layer includes an electrically conductive mesh formed of a selected material from a group including copper, copper plated with nickel, and aluminum.

9. The structure as recited in claim 1 wherein the repair wire layer includes multiple individual embedded wires isolated from all other wiring layers with respective individual embedded wires routed to respective plated through holes (PTHs) in the PCB stack.

Assignees

• IBM

Inventors

• Connor Samuel
• Benefield Stuart B
• Doyle Matthew S
• Kuczynski Joseph
• Jackson Jonathan

Classifications

• H05K3/0047

  Drilling of holes · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2203/163

  Monitoring a manufacturing process · CPC title

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• H05K2201/09681

  Mesh conductors, e.g. as a ground plane · CPC title