Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module
US-10798824-B2 · Oct 6, 2020 · US
Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment
US11407202B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11407202-B2 |
| Application number | US-201917266476-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2019 |
| Priority date | Aug 6, 2018 |
| Publication date | Aug 9, 2022 |
| Grant date | Aug 9, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1 A is composed of a copper layer 10 A and a stainless steel layer 20 A, in which thickness of the roll-bonded laminate 1 A is 0.02 mm to 0.4 mm, hardness of the copper layer 10 A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1 A is 6 N/20 mm or more.
First claim
Opening claim text (preview).
The invention claimed is: 1. A roll-bonded laminate composed of a copper layer and a stainless steel layer, wherein thickness of the roll-bonded laminate is 0.02 mm to 0.4 mm, hardness of the copper layer is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate is 6 N/20 mm or more. 2. The roll-bonded laminate according to claim 1 , wherein thickness of the copper layer is 0.01 mm to 0.38 mm, and thickness of the stainless steel layer is 0.01 mm to 0.38 mm. 3. The roll-bonded laminate according to claim 1 , wherein hardness of the stainless steel layer is 180 Hv or higher. 4. The roll-bonded laminate according to claim 1 , wherein 180° peel strength of the roll-bonded laminate is 8 N/20 mm or more. 5. The roll-bonded laminate according to claim 1 , which has a bi-layer structure composed of the copper layer and the stainless steel layer. 6. The roll-bonded laminate according to claim 1 , wherein the stainless steel layer is partially removed. 7. The roll-bonded laminate according to claim 1 , wherein the stainless steel layer is partially removed and the copper layer is exposed at a site where the stainless steel layer is removed. 8. The roll-bonded laminate according to claim 1 , wherein the copper layer is partially removed. 9. The roll-bonded laminate according to claim 1 , wherein the copper layer is partially removed and the stainless steel layer is exposed at a site where the copper layer is removed. 10. A heat radiation reinforcement member for electronic equipment comprising the roll-bonded laminate according to claim 1 .
Assignees
Inventors
Classifications
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
Fe-base has 0.01-1.7% carbon [i.e., steel] · CPC title
- B23K20/04Primary
by means of a rolling mill · CPC title
- B32B15/015Primary
the said other metal being copper or nickel or an alloy thereof · CPC title
Stainless steel · CPC title
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Frequently asked questions
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- What does patent US11407202B2 cover?
- This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1 A is composed of a copper layer 10 A and a stainless steel layer 20 A, in which thickness of the roll-bonded laminate 1 A is 0.02 mm to 0.4 mm, hardness of the copper layer 10 A is 70 Hv or highe…
- Who is the assignee on this patent?
- Toyo Kohan Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K20/04. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 09 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).