Semiconductor device, manufacturing method thereof, display device, and electronic device

Patent metadata

Field	Value
Publication number	US-11404285-B2
Application number	US-202017064730-A
Country	US
Kind code	B2
Filing date	Oct 7, 2020
Priority date	Feb 18, 2016
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

The field-effect mobility and reliability of a transistor including an oxide semiconductor film are improved. Provided is a semiconductor device including an oxide semiconductor film. The semiconductor device includes a first insulating film, an oxide semiconductor film over the first insulating film, a second insulating film and a third insulating film over the oxide semiconductor film, and a gate electrode over the second insulating film. The second insulating film comprises a silicon oxynitride film. When excess oxygen is added to the second insulating film by oxygen plasma treatment, oxygen can be efficiently supplied to the oxide semiconductor film.

First claim

The invention claimed is:

1. A manufacturing method of a semiconductor device comprising the steps of:
forming a first semiconductor film over a substrate;
forming an insulating layer over the first semiconductor film using an apparatus;
performing a plasma treatment using the apparatus after forming the insulating layer; and
forming a gate electrode on the insulating layer after performing the plasma treatment.

2. The manufacturing method of a semiconductor device according to claim 1 , further comprising the step of performing a heat treatment at a temperature higher than or equal to 150° C. and lower than or equal to 450° C. after forming the gate electrode.

3. The manufacturing method of a semiconductor device according to claim 1 , wherein the first semiconductor film is an oxide semiconductor film comprising indium, gallium, and zinc.

4. The manufacturing method of a semiconductor device according to claim 1 , wherein the insulating layer is formed at a substrate temperature lower than or equal to 350° C.

5. The manufacturing method of a semiconductor device according to claim 1 , wherein the plasma treatment is performed at a substrate temperature lower than or equal to 350° C.

6. The manufacturing method of a semiconductor device according to claim 1 , wherein the gate electrode is formed using a sputtering apparatus.

7. The manufacturing method of a semiconductor device according to claim 3 , wherein the gate electrode comprises a second oxide semiconductor film.

8. The manufacturing method of a semiconductor device according to claim 7 , wherein the second oxide semiconductor film comprises indium, gallium, and zinc.

9. A manufacturing method of a semiconductor device comprising the steps of:
forming a first oxide semiconductor film;
forming a gate insulating layer over the first oxide semiconductor film using an apparatus, the gate insulating layer comprising silicon;
performing a plasma treatment using the apparatus after forming the gate insulating layer;
forming a second oxide semiconductor film on the gate insulating layer after performing the plasma treatment; and
forming a gate electrode by etching the second oxide semiconductor film.

10. The manufacturing method of a semiconductor device according to claim 9 , further comprising the step of performing a heat treatment at a temperature higher than or equal to 150° C. and lower than or equal to 450° C. after forming the gate electrode.

11. The manufacturing method of a semiconductor device according to claim 9 , wherein the first oxide semiconductor film comprises indium, gallium, and zinc.

12. The manufacturing method of a semiconductor device according to claim 9 , wherein the gate insulating layer is formed at a substrate temperature lower than or equal to 350° C.

13. The manufacturing method of a semiconductor device according to claim 9 , wherein the plasma treatment is performed at a substrate temperature lower than or equal to 350° C.

14. The manufacturing method of a semiconductor device according to claim 9 , wherein the second oxide semiconductor film comprises indium, gallium, and zinc.

15. A manufacturing method of a semiconductor device comprising the steps of:
forming a first electrode;
forming a first insulating layer over the first electrode;
forming a first semiconductor film over the first insulating layer;
forming a second insulating layer over the first semiconductor film using an apparatus, the second insulating layer comprising silicon;
performing a plasma treatment in an atmosphere comprising oxygen using the apparatus after forming the second insulating layer; and
forming a second electrode over the second insulating layer after performing the plasma treatment.

16. The manufacturing method of a semiconductor device according to claim 15 , further comprising the step of performing a heat treatment at a temperature higher than or equal to 150° C. and lower than or equal to 450° C. after forming the second electrode.

17. The manufacturing method of a semiconductor device according to claim 15 , wherein the first semiconductor film is an oxide semiconductor film comprising indium, gallium, and zinc.

18. The manufacturing method of a semiconductor device according to claim 15 , wherein the second insulating layer is formed at a substrate temperature lower than or equal to 350° C.

19. The manufacturing method of a semiconductor device according to claim 15 , wherein the plasma treatment is performed at a substrate temperature lower than or equal to 350° C.

20. The manufacturing method of a semiconductor device according to claim 15 , wherein the second electrode is formed using a sputtering apparatus.

21. The manufacturing method of a semiconductor device according to claim 15 , wherein the second electrode comprises a second oxide semiconductor film.

22. The manufacturing method of a semiconductor device according to claim 21 , wherein the second oxide semiconductor film comprises indium, gallium, and zinc.

Assignees

• Semiconductor Energy Lab

Inventors

• Jintyou Masami
• Koezuka Junichi
• Hamochi Takashi
• Hosaka Yasuharu

Classifications

• H10P50/28

  of insulating materials · CPC title

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/6927 Primary

  the material being a silicon oxynitride, e.g. SiON or SiON:H · CPC title

• H10P14/6532

  by exposure to a plasma · CPC title

• H10P14/6522

  introduced into a nitride material, e.g. changing SiN to SiON · CPC title