Polyethylene resin composition

US11401406B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11401406-B2
Application numberUS-202016976179-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2020
Priority dateFeb 20, 2019
Publication dateAug 2, 2022
Grant dateAug 2, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a polyethylene resin composition exhibiting excellent processability and bubble stability, which can provide a film or fiber having excellent physical properties through various processes. The polyethylene resin composition includes a first polyethylene resin having a density of 0.950 g/cm3 to 0.960 g/cm3, a weight average molecular weight of 80000 g/mol to 100000 g/mol and a molecular weight distribution of 3.3 to 4.0; and a second polyethylene resin having a density of 0.950 g/cm3 to 0.960 g/cm3, a weight average molecular weight of 500000 g/mol to 600000 g/mol and a molecular weight distribution of 1.3 to 2.0.

First claim

Opening claim text (preview).

What is claimed is: 1. A polyethylene resin composition comprising a first polyethylene resin having a density of 0.950 g/cm 3 to 0.960 g/cm 3 , a weight average molecular weight of 80000 g/mol to 150000 g/mol and a molecular weight distribution of 3.9 to 6.0; and a second polyethylene resin having a density of 0.950 g/cm 3 to 0.960 g/cm 3 , a weight average molecular weight of 110000 g/mol to 300000 g/mol and a molecular weight distribution of 1.5 to 3.8. 2. The polyethylene resin composition of claim 1 , wherein a weight ratio of the first polyethylene resin:the second polyethylene resin is 80:20 to 90:10. 3. The polyethylene resin composition of claim 1 , wherein the composition has a density of 0.950 g/cm 3 to 0.960 g/cm 3 , and a melt index (MI 2.16 ) of 0.5 to 0.9 measured at a temperature of 230° C. under a load of 2.16 kg in accordance with ISO 1133. 4. The polyethylene resin composition of claim 3 , wherein the composition has a MI 5 /MI 2.16 value of 3.5 to 4.0, which is obtained by dividing a melt index (MI 5 ) measured at a temperature of 230° C. under a load of 5.0 kg in accordance with ISO 1133 by the MI 2.16 . 5. The polyethylene resin composition of claim 3 , wherein the composition has a weight average molecular weight of 110000 g/mol to 150000 g/mol. 6. The polyethylene resin composition of claim 3 , wherein the composition has a molecular weight distribution of 4.5 to 5.3. 7. A polyethylene resin film comprising the polyethylene resin composition according to claim 1 . 8. The polyethylene resin film of claim 7 , which is a cast film or a blown film. 9. A fiber comprising the polyethylene resin composition according to claim 1 . 10. A method of preparing a fiber comprising the step of cutting and stretching the polyethylene resin film of claim 7 . 11. The polyethylene resin composition of claim 1 , wherein each of the first and second polyethylene resins is a copolymer of ethylene and an alpha olefin having 3 or more carbon atoms. 12. The polyethylene resin composition of claim 11 , wherein the alpha olefin is propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-heptene, 1-octene, 1-decene, 1-undecene, 1-dodecene, 1-tetradecene, 1-hexadecene, or a mixture thereof.

Assignees

Inventors

Classifications

  • Manufacture of films or sheets · CPC title

  • C08L23/06Primary

    Polyethylene · CPC title

  • containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

  • by cutting films · CPC title

  • HDPE · CPC title

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What does patent US11401406B2 cover?
The present disclosure relates to a polyethylene resin composition exhibiting excellent processability and bubble stability, which can provide a film or fiber having excellent physical properties through various processes. The polyethylene resin composition includes a first polyethylene resin having a density of 0.950 g/cm3 to 0.960 g/cm3, a weight average molecular weight of 80000 g/mol to 100…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification C08L23/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 02 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).