Emulating parameters of a fluid ejection die

Patent metadata

Field	Value
Publication number	US-11400704-B2
Application number	US-201916772978-A
Country	US
Kind code	B2
Filing date	Feb 6, 2019
Priority date	Feb 6, 2019
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.

First claim

The invention claimed is:

1. An integrated circuit comprising:
thermal tracking logic to determine a temperature of a fluid ejection die;
control logic to define an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die;
an output interface to output the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die;
a plurality of input interfaces to measure a parameter of the fluid ejection die to be emulated;
a control interface; and
a multiplexer to select one of the plurality of input interfaces based on a control signal on the control interface,
wherein the control logic is to modify the measured parameter based on the temperature of the fluid ejection die to define the emulated parameter as the function of the temperature of the fluid ejection die.

2. The integrated circuit of claim 1 , wherein the thermal tracking logic is to measure the temperature of the fluid ejection die.

3. The integrated circuit of claim 1 , wherein the thermal tracking logic is to estimate the temperature of the fluid ejection die based on a thermal model.

4. The integrated circuit of claim 1 , wherein the emulated parameter comprises a resistance, a voltage, or a current.

5. The integrated circuit of claim 1 , further comprising:
a voltage mode digital to analog converter, a current mode digital to analog converter, a transconductance amplifier, or a digital potentiometer to output the emulated parameter on the output interface.

6. An integrated circuit comprising:
thermal tracking logic to determine a temperature of a fluid ejection die;
control logic to define an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die;
an output interface to output the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die;
a control interface; and
a multiplexer to output one of a plurality of emulated parameters on the output interface based on a control signal on the control interface.

7. The integrated circuit of claim 6 , wherein the emulated parameter comprises a resistance, a voltage, or a current.

8. The integrated circuit of claim 6 , wherein the thermal tracking logic is to measure the temperature of the fluid ejection die.

9. The integrated circuit of claim 6 , wherein the thermal tracking logic is to estimate the temperature of the fluid ejection die based on a thermal model.

10. The integrated circuit of claim 6 , further comprising:
a voltage mode digital to analog converter, a current mode digital to analog converter, a transconductance amplifier, or a digital potentiometer to output the emulated parameter on the output interface.

Assignees

• Hewlett Packard Development Co

Inventors

• Rossi John
• Ness Eric D
• Gardner James Michael
• Linn Scott A

Classifications

• B41J2/04586

  controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type · CPC title

• B41J2/04541

  Specific driving circuit · CPC title

• B41J2/04563

  detecting head temperature; Ink temperature · CPC title

• B41J2/04546

  Multiplexing · CPC title

• B41J2/0454 Primary

  involving calculation of temperature · CPC title