Hygroscopic packaging container

Patent metadata

Field	Value
Publication number	US-11400682-B2
Application number	US-201415021159-A
Country	US
Kind code	B2
Filing date	Sep 29, 2014
Priority date	Sep 30, 2013
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

Provided is a hygroscopic packaging container which eliminates the necessity of filling a moisture absorbent and which has satisfactory working efficiency and is highly effective in moisture absorption. The hygroscopic packaging container is obtained from two gas-barrier multilayer films each comprising a gas-barrier layer and a heat-sealable layer, by stacking the gas-barrier multilayer films so that the surface of one of the heat-sealable layers overlies that of the other and heat-sealing the peripheral parts of the layers, at least one heat-sealable layer of the two gas-barrier multilayer films being a hygroscopic heat-sealable layer.

First claim

The invention claimed is:

1. A hygroscopic packaging container for a blood glucose level measuring sensor, consisting of:
a first film consisting of a first gas-barrier multilayer structure and a first heat-sealable layer; and
a second film consisting of a second gas-barrier multilayer structure and a transparent second heat-sealable layer;
wherein the first and second films are laminated to each other such that the first heat-sealable layer and the second heat-sealable layer are in contact with each other and are heat-sealed at peripheral portions thereof;

the first heat-sealable layer consists of a first heat-sealable resin selected from the group consisting of low-density polyethylene and linear low-density polyethylene, and 1 to 50% by mass of calcium oxide, wherein the thickness of the first heat-sealable layer is from 50 to 200 μm,
the second heat-sealable layer consists of (i) 70-90% by mass of a heat-sealable resin that is compatible with the first heat-sealable resin and defines a matrix of the second heat-sealable layer, and (ii) 10-30% by mass of a resin that is incompatible with the first heat-sealable resin and defines domains which are dispersed in the matrix, wherein the thickness of the second heat-sealable layer is 50 to 200 μm, wherein
the second heat-sealable layer does not include any moisture absorbent compound;
the heat-sealable resin that is compatible with the first heat-sealable resin is selected from the group consisting of low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene; and
the resin that is incompatible with the first heat-sealable resin is selected from the group consisting of polypropylene, polystyrene, and polybutene;

the first and second gas-barrier multilayer structures each consist of a resin layer, a vapor deposition layer formed on the resin layer, and a gas-barrier coated layer on the vapor deposition layer,
wherein the gas-barrier coated layer is formed by coating and drying a gas-barrier composition on the vapor deposition layer, where the gas-barrier composition is obtained by a sol-gel method including hydrolysis and polycondensation of an alkoxide and a water-soluble polymer in the presence of a sol-gel catalyst, an acid, water, and an organic solvent other than water,
wherein the alkoxide is represented by the formula R 1 n M(OR 2 ) m , where R 1 and R 2 each represent a C 1 -C 8 organic group; M represents an atom selected from the group consisting of silicon, zirconium, titanium, and aluminum; n is an integer of 0 or greater; and m is an integer of 1 or greater;
wherein the water-soluble polymer is at least one selected from the group consisting of polyvinyl alcohol and ethylene-vinyl alcohol copolymer;
wherein the thickness of the gas-barrier coated layer is about 200 nm; and
wherein the gas-barrier composition optionally includes a silane coupling agent;

where the second gas-barrier multilayer structure is transparent, and the vapor deposition layer of the second gas-barrier multilayer structure is a silica deposited layer having a thickness of about 10 nm; and
where the relative humidity inside the hygroscopic packaging container after it has been sealed for at least 7 days is greater than 0% and 5% or less.

2. A hygroscopic packaging container for a blood glucose level measuring sensor, consisting of:
a first film consisting of a first gas-barrier multilayer structure and a heat-sealable multilayer structure; and
a second film consisting of a second gas-barrier multilayer structure and a transparent heat-sealable layer;
wherein the first and second films are laminated to each other such that the heat-sealable multilayer structure and the transparent heat-sealable layer are in contact with each other and are heat-sealed at peripheral portions thereof;

the heat-sealable multilayer structure consists of the following three layers:
(i) a first layer consisting of linear low-density polyethylene;
(ii) a second layer consisting of (a) one of low-density polyethylene and linear low-density polyethylene, and (b) 35 to 50% by mass of calcium oxide;
(iii) a third layer consisting of linear low-density polyethylene;
wherein the thickness of the heat-sealable multilayer structure is 50 to 80 μm, and wherein the second layer is interposed between the first layer and the third layer such that it is not in contact with the transparent heat-sealable layer of the second film;

the transparent heat-sealable layer consists of (i) 70-90% by mass of a heat-sealable resin that is compatible with linear low-density polyethylene and defines a matrix of the transparent heat-sealable layer, and (ii) 10-30% by mass of a resin that is incompatible with linear low-density polyethylene and defines domains which are dispersed in the matrix, wherein the thickness of the transparent heat-sealable layer is 50 to 200 μm, wherein
the transparent heat-sealable layer does not include any moisture absorbent compound;
the heat-sealable resin that is compatible with linear low-density polyethylene is selected from the group consisting of low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene; and
the resin that is incompatible with linear low-density polyethylene is selected from the group consisting of polypropylene, polystyrene, and polybutene;

the first and second gas-barrier multilayer structures each consist of a resin layer, a vapor deposition layer formed on the resin layer, and a gas-barrier coated layer on the vapor deposition layer,
wherein the gas-barrier coated layer is formed by coating and drying a gas-barrier composition on the vapor deposition layer, where the gas-barrier composition is obtained by a sol-gel method including hydrolysis and polycondensation of an alkoxide and a water-soluble polymer in the presence of a sol-gel catalyst, an acid, water, and an organic solvent other than water,
wherein the alkoxide is represented by the formula R 1 n M(OR 2 ) m , where R 1 and R 2 each represent a C 1 -C 8 organic group; M represents an atom selected from the group consisting of silicon, zirconium, titanium, and aluminum; n is an integer of 0 or greater; and m is an integer of 1 or greater;
wherein the water-soluble polymer is at least one selected from the group consisting of polyvinyl alcohol and ethylene-vinyl alcohol copolymer;
wherein the thickness of the gas-barrier coated layer is about 200 nm; and
wherein the gas-barrier composition optionally includes a silane coupling agent;

where the second gas-barrier multilayer structure is transparent, and the vapor deposition layer of the second gas-barrier multilayer structure is a silica deposited layer having a thickness of about 10 nm; and
where the relative humidity inside the hygroscopic packaging container after it has been sealed for at least 7 days is greater than 0% and 5% or less.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Takeuchi Naoya
• Kanamori Taeko
• Noto Tsutomu

Classifications

• B32B2307/412

  Transparent · CPC title

• B32B2255/20

  Inorganic coating · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B65D81/18

  providing specific environment for contents, e.g. temperature above or below ambient (with thermal insulation B65D81/38) · CPC title

• B32B3/28

  characterised by a layer comprising a deformed thin sheet {, i.e. the layer having its entire thickness deformed out of the plane}, e.g. corrugated, crumpled (B32B29/08 takes precedence) · CPC title