Baking method, device and baking oven

US11400485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11400485-B2
Application numberUS-201816958857-A
CountryUS
Kind codeB2
Filing dateDec 28, 2018
Priority dateJan 3, 2018
Publication dateAug 2, 2022
Grant dateAug 2, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present application is applicable to the field of material making, and there is provided a baking method, device and baking oven including: acquiring a predetermined instruction, and starting timing and cycling the following steps: controlling a first set of pins to support a substrate from an initial position and recording the rising times of the first set of pins; raising the first set of pins to a first preset position, and controlling the first set of pins to move a first preset distance in a first preset direction, wherein the first preset distance is associated with the rising times of the first set of pins; controlling the lowering of the first set of pins such that a second set of pins supports the substrate; and controlling the first set of pins to return to the initial position, when the first set of pins drops to a second preset position.

First claim

Opening claim text (preview).

What is claimed is: 1. A baking method comprising the steps of: acquiring a predetermined instruction, and starting timing and cycling the following steps: controlling a first set of pins to support a substrate from an initial position and recording rising times of the first set of pins; raising the first set of pins to a first preset position, and controlling the first set of pins to move a first preset distance in a first preset direction, such that the substrate moves the first preset distance in the first preset direction, wherein the first preset distance is associated with the rising times of the first set of pins; controlling a lowering of the first set of pins such that a second set of pins supports the substrate; and controlling the first set of pins to return to the initial position, when the first set of pins drops to a second preset position. 2. The baking method according to claim 1 , wherein the predetermined instruction refers to an instruction of start baking, and the starting timing refers to start timing when acquired the instruction of start baking. 3. The baking method according to claim 1 , wherein a distance of the first set of pins raising from the initial position to the first preset position is equal to a dropping distance of the first set of pins dropping from the first preset position to the second preset position. 4. The baking method according to claim 1 , wherein after the first set of pins returning to the initial position, the method further comprises: acquiring a time record, when the time record is equal to or greater than a preset time, resetting the time record and the rising times of the first set of pins to an initial value, and restarting timing and cyclically performing the following steps: controlling the first set of pins to support the substrate from the initial position and recording the rising times of the first set of pins; raising the first set of pins to the first preset position, and controlling the first set of pins to move a second preset distance in a second preset direction, such that the substrate moves the second preset distance in the second preset direction, wherein the second preset distance is associated with the rising times of the first set of pins; controlling the lowering of the first set of pins such that the second set of pins supports the substrate; controlling the first set of pins to return to the initial position, when the first set of pins drops to the second preset position; acquiring the time record, and discharging the substrate when the time record is equal to or greater than the preset time. 5. The baking method according to claim 4 , wherein the initial value being 0 and the second preset distance associated with the rising times of the first set of pins is: R i =x ,( i= 1) R i =2 x ,( i= 2,3,4, . . . ) wherein R i represents the second preset distance, and i represents the rising times of the first set of pins. 6. The baking method according to claim 4 , wherein the preset time is ½ of a baking time. 7. The baking method according to claim 1 , wherein the first preset distance associated with the rising times of the first set of pins is: L i =x ,( i= 1) L i =2 x ,( i= 2,3,4, . . . ) wherein L i represents the first preset distance, and i represents the rising times of the first set of pins.

Assignees

Inventors

Classifications

  • G02F1/1333Primary

    Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) · CPC title

  • Polyimide, polyamide-imide · CPC title

  • characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment (for treating continuous lengths of work F27B9/28) · CPC title

  • Rigid substrates, e.g. inorganic substrates · CPC title

  • Furnaces through which the charge is moved mechanically, e.g. of tunnel type (rotary-drum furnaces with means for agitating or moving the charge F27B7/14); Similar furnaces in which the charge moves by gravity · CPC title

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What does patent US11400485B2 cover?
The present application is applicable to the field of material making, and there is provided a baking method, device and baking oven including: acquiring a predetermined instruction, and starting timing and cycling the following steps: controlling a first set of pins to support a substrate from an initial position and recording the rising times of the first set of pins; raising the first set of…
Who is the assignee on this patent?
Hkc Corp Ltd, Chongqing Hkc Optoelectronics Tech Co Itd, Chongqing Hkc Optoelectronics Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/1333. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 02 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).