Electronic device having heat dissipation function

Patent metadata

Field	Value
Publication number	US-11399445-B2
Application number	US-202016934426-A
Country	US
Kind code	B2
Filing date	Jul 21, 2020
Priority date	Sep 6, 2019
Publication date	Jul 26, 2022
Grant date	Jul 26, 2022

Abstract

An electronic device having a heat dissipation function is proposed. The electronic device includes: a heating element (20); a shield can (30) covering the heating element (20) to block electromagnetic waves; and a heat dissipation means (50) provided to be adjacent to the heating element (20) and causing an ionic wind to flow into a shielded space (32) of an inner part of the shield can (30). Here, the heat dissipation means (50) includes: a wire electrode (70) provided to be adjacent to an entrance of the shielded space (32) of the shield can (30) and becoming an emitter electrode; and a power module (80) connected to the wire electrode (70) and applying voltage to the wire electrode (70), wherein the shield can (30) is grounded at the same time of being connected to the power module (80) and becomes a collector electrode.

First claim

What is claimed is:

1. An electronic device having a heat dissipation function, the electronic device comprising:
a heating element;
a shield can covering the heating element to block electromagnetic waves; and
a heat dissipation means provided to be adjacent to the heating element and causing an ionic wind to flow into a shielded space of an inner part of the shield can,
wherein the heat dissipation means comprises:
a wire electrode provided to be adjacent to an entrance of the shielded space and becoming an emitter electrode; and
a power module connected to the wire electrode and applying voltage to the wire electrode,
wherein the shield can is grounded at the same time of being connected to the power module and becomes a collector electrode such that the ionic wind is generated into the inner part of the shield can,
wherein the shield can comprises:
a cover body covering an upper part of the heating element, and
mounting legs extending from the cover body and mounted to a circuit board to be grounded,
wherein a heat discharge opening open to the outside is provided in the mounting legs to discharge the ionic wind.

2. The electronic device of claim 1 , wherein an electrode mounting part of a non-conductive material is provided at a front of the entrance of the shield can, wherein the wire electrode is mounted to the electrode mounting part.

3. The electronic device of claim 2 , wherein the wire electrode is mounted to the electrode mounting part in a direction crossing the entrance of the shielded space of the shield can from left to right.

4. The electronic device of claim 2 , wherein the electrode mounting part extends from the entrance of the shield can and is arch-shaped, and an inlet space of the electrode mounting part communicates with the shielded space of the shield can.

5. The electronic device of claim 2 , wherein the electrode mounting part is in close contact with the entrance of the shield can and has the same sectional shape as a sectional shape of the shield can, so an inlet space of the electrode mounting part and the shielded space of the shield can define a continuous heat dissipation space of the same shape.

6. The electronic device of claim 2 , wherein opposite ends of the wire electrode are fixed to opposite fixing legs of the electrode mounting part mounted to the circuit board, so the wire electrode is provided to cross an inlet space of the electrode mounting part from left to right.

7. The electronic device of claim 2 , wherein the wire electrode is provided at a position inner from an entrance of the electrode mounting part toward the shield can to cross an inlet space of the electrode mounting part.

8. The electronic device of claim 2 , wherein a sloping surface is provided on an inner surface of the electrode mounting part and guides the ionic wind in a direction of the heating element.

9. The electronic device of claim 2 , wherein the electrode mounting part is configured to be integrated with the shield can or is mounted to a circuit board as a component separated from the shield can at a position adjacent to the shield can.

10. The electronic device of claim 1 , wherein the heating element is mounted to the circuit board, and the shield can is mounted to the circuit board while covering the heating element and is open to the wire electrode.

11. The electronic device of claim 1 , wherein the heat discharge opening is provided at an opposite side of the entrance of the shield can and is open toward the wire electrode such that the ionic wind passing the heating element is discharged.

12. The electronic device of claim 1 , wherein the mounting legs of the shield can comprise:
a pair of left and right legs covering sides of the heating element by being bent from opposite sides of the cover body; and
a rear leg connecting the left and right legs to each other and covering a rear surface of the heating element by being bent from a rear of the cover body,
wherein the left and right legs and the rear leg are spaced apart from each other and the heat discharge opening is provided therebetween.

13. The electronic device of claim 1 , wherein a height at which the wire electrode is installed is smaller than or the same as a thickness of the heating element.

14. The electronic device of claim 1 , wherein the heating element is located at a position withdrawing from the entrance of the shield can to an opposite side of the wire electrode.

15. The electronic device of claim 1 , wherein the wire electrode is multiply provided in the electrode mounting part to be parallel to each other.

16. The electronic device of claim 1 , wherein the wire electrode is multiply provided and the wire electrodes are installed to be adjacent to at least two surfaces of four surfaces of the shield can, with the shield can disposed therebetween.

17. An electronic device having a heat dissipation function, the electronic device comprising:
a heating element mounted to a circuit board;
a power module mounted to the circuit board;
a shield can mounted to the circuit board to block electromagnetic waves by covering the heating element and grounded at the same time of being connected to the power module to become a collector electrode; and
a wire electrode provided to be adjacent to an entrance of a shielded space of the shield can and becoming an emitter electrode when the wire electrode receives power by being connected to the power module such that an ionic wind is generated in a direction of the shield can,
wherein the shield can comprises:
a cover body covering an upper part of the heating element, and
mounting legs extending from the cover body and mounted to the circuit board to be grounded,
wherein a heat discharge opening open to the outside is provided in the mounting legs to discharge the ionic wind.

18. The electronic device of claim 17 , wherein a connection wire provided in the power module is connected to the wire electrode and supplies power thereto, or the connection wire and the power module are electrically connected to each other by a pattern of the circuit board.

19. The electronic device of claim 17 , wherein a ground wire is provided in the power module and is electrically connected to the shield can, or the shield can and the power module are electrically connected to each other by a pattern of the circuit board.

Assignees

• Lg Electronics Inc

Inventors

• Park Minjae
• Kim Sehyeon
• Kim Bongjun
• Jeong Minwoo
• Lee Keunsun

Classifications

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/20136 Primary

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H01T23/00

  Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere · CPC title

• G06F1/20

  Cooling means · CPC title