Laser module for optical data communication system within silicon interposer

Patent metadata

Field	Value
Publication number	US-11394465-B2
Application number	US-202016995816-A
Country	US
Kind code	B2
Filing date	Aug 18, 2020
Priority date	Jul 14, 2016
Publication date	Jul 19, 2022
Grant date	Jul 19, 2022

Abstract

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

First claim

What is claimed is:

1. A mechanical transfer ferrule, comprising:
a top half member including a top alignment key that protrudes outward from the top half member; and
a bottom half member including a bottom alignment key formed as a recessed region within the bottom half member, the recessed region of the bottom alignment key configured to receive the top alignment key,
wherein the top and bottom alignment keys are configured to fit together to provide for alignment and fitting of the top half member with the bottom half member, wherein each of the top half member and the bottom half member is configured to receive a peripheral portion of a substrate of an interposer device between the top half member and the bottom half member, such that optical waveguides embedded within the substrate of the interposer device are exposed at a location between the top half member and the bottom half member when the top half member is fitted to the bottom half member.

2. The mechanical transfer ferrule as recited in claim 1 , wherein the top half member and the bottom half member are formed of silicon, glass, or plastic.

3. The mechanical transfer ferrule as recited in claim 1 , wherein the top half member includes at least one top partial hole and the bottom half member includes at least one bottom partial hole, wherein the at least one top partial hole and the at least one bottom partial hole are configured to respectively form at least one complete alignment hole when the top half member is fitted with the bottom half member with the peripheral portion of the substrate of the interposer device between the top half member and the bottom half member.

4. The mechanical transfer ferrule as recited in claim 3 , wherein the at least one alignment hole is configured to provide for alignment of the mechanical transfer ferrule with another connector structure.

5. The mechanical transfer ferrule as recited in claim 3 , wherein the at least one alignment hole is configured to provide for alignment of the mechanical transfer ferrule with another mechanical transfer ferrule.

6. The mechanical transfer ferrule as recited in claim 1 , wherein the top half member includes a first top partial hole positioned on a first side of the peripheral portion of the substrate of the interposer device and a second top partial hole positioned on a second side of the peripheral portion of the substrate of the interposer device, wherein the bottom half member includes a first bottom partial hole positioned on the first side of the peripheral portion of the substrate of the interposer device and a second bottom partial hole positioned on the second side of the peripheral portion of the substrate of the interposer device, wherein the first top partial hole aligns with the first bottom partial hole when the top half member is fitted with the bottom half member, and wherein the second top partial hole aligns with the second bottom partial hole when the top half member is fitted with the bottom half member.

7. The mechanical transfer ferrule as recited in claim 6 , wherein the substrate of the interposer device is configured so that a first complete alignment hole is formed by the first top partial hole and the first bottom partial hole and a second complete alignment hole is formed by the second top partial hole and the second bottom partial hole when the top half member is fitted with the bottom half member with the peripheral portion of the substrate of the interposer device positioned between the top half member and the bottom half member.

8. The mechanical transfer ferrule as recited in claim 6 , wherein the top alignment key is a first top alignment key, the first top alignment key positioned next to the first top partial hole, the top half member including a second top alignment key positioned next to the second top partial hole, wherein the second top alignment key protrudes outward from the top half member, wherein the bottom alignment key is a first bottom alignment key, the first bottom alignment key positioned next to the first bottom partial hole, the bottom half member including a second bottom alignment key positioned next to the second bottom partial hole, wherein the second bottom alignment key is formed as another recessed region within the bottom half member, the recessed region of the second bottom alignment key configured to receive the second top alignment key.

9. The mechanical transfer ferrule as recited in claim 1 , wherein the optical waveguides are positioned in a linear array within the substrate of the interposer device.

10. The mechanical transfer ferrule as recited in claim 1 , wherein the top half member and the bottom half member are collectively configured to index the optical waveguides within the substrate of the interposer device to a corresponding number of optical fibers external to the substrate of the interposer device.

11. The mechanical transfer ferrule as recited in claim 1 , wherein the top half member and the bottom half member are mounted to the substrate of the interposer device by an adhesive.

12. A method for forming a fiber-to-interposer connection, comprising:
having a top half member of a mechanical transfer ferrule, the top half member including a top alignment key that protrudes outward from the top half member;
having a bottom half member of the mechanical transfer ferrule, the bottom half including a bottom alignment key formed as a recessed region within the bottom half member, the recessed region of the bottom alignment key configured to receive the top alignment key;
securing the top half member to a top surface of a peripheral portion of a substrate of an interposer device; and
securing the bottom half member to a bottom surface of the peripheral portion of the substrate of the interposer device so that the top alignment key inserts into the recessed region of the bottom alignment key and so that optical waveguides embedded within the substrate of the interposer device are exposed at a location between the top half member and the bottom half member.

13. The method as recited in claim 12 , wherein the top half member and the bottom half member are formed of silicon, glass, or plastic.

14. The method as recited in claim 12 , wherein the top half member includes at least one top partial hole and the bottom half member includes at least one bottom partial hole, the at least one top partial hole and the at least one bottom partial hole respectively forming at least one complete alignment hole when the top half member is secured to the top surface of the peripheral portion of the substrate of the interposer device and the bottom half member is secured to the bottom surface of the peripheral portion of the substrate of the interposer device.

15. The method as recited in claim 14 , further comprising:
using the at least one complete alignment hole to align the mechanical transfer ferrule with another connector structure.

16. The method as recited in claim 14 , further comprising:
using the at least one complete alignment hole to align the mechanical transfer ferrule with another mechanical transfer ferrule.

17. The method as recited in claim 12 , wherein the top half member includes a first top partial hole positioned on a first side of the peripheral portion of the substrate of the interposer device and a second top partial hole positioned on a second side of the peripheral portion of the substrate of the interposer device, wherein the bottom half member includes a first bottom partial hole positioned on the first side of the peripheral portion of the substrate of the interposer d

Assignees

• Ayar Labs Inc

Inventors

• Sun Chen
• Meade Roy Edward
• Wade Mark
• Wright Alexandra
• Stojanovic Vladimir
• Ram Rajeev
• Popovic Milos
• Van Orden Derek
• Davenport Michael

Classifications

• H01S5/4012

  Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms · CPC title

• H01S5/4087

  emitting more than one wavelength · CPC title

• H01S5/02325 Primary

  Mechanically integrated components on mount members or optical micro-benches · CPC title

• G02B6/42

  Coupling light guides with opto-electronic elements · CPC title

• H01S5/50

  Amplifier structures not provided for in groups H01S5/02 - H01S5/30 · CPC title