Temperature compensation for an electronic thermostat

Patent metadata

Field	Value
Publication number	US-11385665-B2
Application number	US-202016867782-A
Country	US
Kind code	B2
Filing date	May 6, 2020
Priority date	May 6, 2020
Publication date	Jul 12, 2022
Grant date	Jul 12, 2022

Abstract

An aspect of the embodiments provides a compensation for the temperature rise effect on the printed circuit board (PCB) of an electronic thermostat to obtain better precision and performance. Once the measurements from the temperature sensors have stabilized, the compensated ambient temperature may be used by an associated system (for example, a Heating, Ventilation, and Air Conditioning (HVAC) system).

First claim

What is claimed is:

1. A method for compensating a measured temperature for an electronic thermostat, the method comprising:
thermally isolating a temperature compensation sensor and an ambient temperature sensor from a main compartment of the electronic thermostat, wherein the temperature compensation sensor and the ambient temperature sensor are located in a sensor chamber;
creating a first thermal pathway between the temperature compensation sensor and the ambient temperature sensor, wherein the first thermal pathway thermally connects from the main compartment to the sensor chamber and restricts heat flow to the temperature compensation sensor and the ambient temperature sensor;
obtaining a thermal parameter that characterizes a thermal characteristic of the electronic thermostat;
receiving a measured ambient temperature (T s ) and a compensation temperature (T c1 ) from the ambient temperature sensor and the compensation temperature sensor, respectively; and
determining a temperature indicator of a compensated ambient temperature (T ambient ) from the measured ambient temperature, the compensation temperature and the thermal parameter.

2. The method of claim 1 , wherein the determining further comprises:
obtaining a compensation value based on a temperature difference between the compensation temperature and the measured ambient temperature; and
obtaining the compensated ambient temperature by subtracting the compensation value from the measured ambient temperature.

3. The method of claim 2 , wherein the thermal parameter comprises a thermal resistance ratio, and wherein the obtaining the compensation value comprises:
multiplying the thermal resistance ratio by the temperature difference.

4. The method of claim 1 , wherein the thermal parameter comprises a first thermal resistance ratio over a first ambient temperature range and a second thermal resistance ratio over a second ambient temperature range, wherein the first and second ambient temperature ranges are indicative of an ambient temperature of a proximate region around the electronic thermostat, and wherein the determining comprises:
using the first thermal resistance ratio over the first ambient temperature range and the second thermal resistance ratio over the second ambient temperature range.

5. The method of claim 1 further comprising: creating a second thermal pathway between the temperature compensation sensor and the ambient temperature sensor, wherein the temperature compensation sensor is located along both the first and second thermal pathways.

6. The method of claim 1 further comprising: waiting for the compensation temperature to stabilize before compensating the measured ambient temperature.

7. The method of claim 1 wherein a perimeter of the sensor chamber comprises at least one internal partition between the main compartment and the sensor chamber.

8. The method of claim 7 , wherein the perimeter further comprises one side of a housing of the electronic thermostat.

9. The method of claim 1 , comprising:
utilizing the temperature indicator by an associated heating, ventilation, and air conditioning (HVAC) system.

10. The method of claim 1 comprising:
limiting the heat flow from the main compartment to the temperature compensation sensor and the ambient temperature sensor through the first thermal pathway.

11. An electronic thermostat controlling a home Internet of Things (IoT) system, the electronic thermostat comprising:
a first printed circuit board;
a main compartment;
a sensor chamber;
at least one component that is located in the main compartment on the first printed circuit board;
a temperature compensation sensor and an ambient temperature sensor located in the sensor chamber;
the sensor chamber configured to thermally isolate the temperature compensation sensor and the ambient temperature sensor from the main compartment and configured to establish a first thermal pathway between the temperature compensation sensor and the ambient temperature sensor, wherein the first thermal pathway thermally connects to the main compartment to the sensor chamber and restricts heat flow to the temperature compensation sensor and the ambient temperature sensor from the main compartment; and
a compensation circuit configured to compensate a measured ambient temperature (T s ) based on a measured compensation temperature (T c1 ), configured to obtain a compensated ambient temperature (T ambient ), and configured to provide the compensated ambient temperature to the home IoT system.

12. The electronic thermostat of claim 11 , wherein the sensor chamber comprises a second printed circuit board and a mechanical structure having two or more support legs, wherein the second printed circuit board is separate from the first printed circuit board, wherein the ambient temperature sensor is mounted on the second printed circuit board via the mechanical structure, and wherein the two or more support legs serve as thermal pathways.

13. The electronic thermostat of claim 11 , wherein a perimeter of the sensor chamber comprises:
an internal partition thermally separating the main compartment from the sensor chamber.

14. The electronic thermostat of claim 13 , wherein the perimeter of the sensor chamber further comprises:
one side of a housing of the electronic thermostat.

15. The electronic thermostat of claim 11 , wherein the at least one component located in the main compartment includes a processing device and the compensation circuit also includes the processing device and wherein the processing device is configured to:
obtain a thermal parameter that characterizes a thermal characteristic between of the electronic thermostat;
receive the measured ambient temperature (T s ) and the measured compensation temperature (T c1 ) from the ambient temperature sensor and the compensation temperature sensor, respectively; and
determine a temperature indicator of the compensated ambient temperature (T ambient ) from the measured ambient temperature, the measured compensation temperature, and the thermal parameter; and
provide the temperature indicator to the home IoT system.

16. The electronic thermostat of claim 15 , there in the processing device is further configured to:
obtain a compensation value based on a temperature difference between the measured compensation temperature and the measured ambient temperature; and
obtain the compensated ambient temperature by subtracting the compensation value from the measured ambient temperature.

17. The electronic thermostat of claim 16 , wherein the thermal parameter comprises a thermal resistance ratio and the processing device is further configured to
multiply the thermal resistance ratio by the temperature difference.

18. The electronic thermostat of claim 11 , wherein a thermal resistance ratio is indicative of thermal characteristics of the electronic thermostat and wherein the compensation circuit includes an analog circuit configured to obtain a compensation amount based on a difference between the measured compensation temperature and the measured ambient temperature and on the thermal resistance ratio.

19. The electronic thermostat of claim 11 , comprising:
a printed circuit board (PCB), wherein the at least one component, the ambient temperature sensor, and the temperature compensation sensor are electrically mounted onto the PCB and wherein the PCB has at least one notch to further restrict the heat flow along the first thermal pathway.

20. One or more non-transitory compute

Assignees

• Computime Ltd

Inventors

• Ng Yau Wai
• Choi Hung Bun
• Chu Chun Kit

Classifications

• F24F2110/10

  Temperature · CPC title

• G05D23/32 Primary

  with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time · CPC title

• F24F11/30

  for purposes related to the operation of the system, e.g. for safety or monitoring · CPC title

• G05D23/193

  sensing the temperaure in different places in thermal relationship with one or more spaces · CPC title

• G05D23/1931 Primary

  to control the temperature of one space · CPC title