Thermoformed film compositions with enhanced toughness after thermoforming processes

Patent metadata

Field	Value
Publication number	US-11384228-B2
Application number	US-201816647238-A
Country	US
Kind code	B2
Filing date	Sep 19, 2018
Priority date	Sep 22, 2017
Publication date	Jul 12, 2022
Grant date	Jul 12, 2022

Abstract

Embodiments of thermoformed monolayer or multilayer films are provided, wherein the thermoformed monolayer multilayer films comprise a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0−1.2×log (I2).

First claim

The invention claimed is:

1. A thermoformed multilayer film structure comprising:
a core layer and at least two outer layers disposed externally relative to the core layer,
wherein at least one layer of the thermoformed multilayer film structure comprises a first composition comprising at least one ethylene-based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 1.2, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥7.0−1.2×log (I 2 ).

2. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure comprises at least one of polyamide, ethylene vinyl alcohol (EVOH), and malleated polyolefins.

3. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure is substantially free of propylene-based polymers.

4. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure consists essentially of ethylene-based polymers.

5. The thermoformed multilayer film structure of claim 1 , wherein the core layer comprises the first composition.

6. The thermoformed multilayer film structure of claim 1 , wherein at least one of the outer layers comprises the first composition.

7. The thermoformed multilayer film structure of claim 6 , wherein the ethylene-based polymer is an ethylene-α-olefin interpolymer, where the α-olefin comprises one or more C 3 -C 12 olefins.

8. The thermoformed multilayer film structure of claim 1 , wherein at least one of the outer layers comprises propylene-based polymers.

9. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film structure has a total thickness of 50 to 250 μm.

10. An article comprising the thermoformed multilayer film structure of claim 1 .

11. The article of claim 10 , wherein the article is a flexible packaging material.

12. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film is a thermoformed blown film.

13. The thermoformed multilayer film structure of claim 1 , wherein the thermoformed multilayer film is a thermoformed cast film.

14. A thermoformed monolayer film comprising:
a first composition comprising at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 1.2, and a melt index ratio (I 10 /I 2 ) that meets the following equation: I 10 /I 2 ≥7.0−1.2×log (I 2 ),
wherein the thermoformed monolayer film demonstrates an increase in puncture resistance of at least 10% due to thermoforming applications.

15. The thermoformed monolayer film of claim 14 , wherein the thermoformed monolayer film structure consists essentially of ethylene based polymer.

16. The thermoformed monolayer film of claim 14 , wherein the thermoformed monolayer film structure has a total thickness of 50 to 250 μm.

17. An article comprising the thermoformed monolayer film structure of claim 14 .

18. The article of claim 17 , wherein the article is a flexible packaging material.

19. The thermoformed monolayer film structure of claim 14 , wherein the thermoformed monolayer film is a thermoformed blown film.

20. The thermoformed monolayer film structure of claim 14 , wherein the thermoformed monolayer film is a thermoformed cast film.

Assignees

• Dow Global Technologies Llc
• Pbb Polisur Srl

Inventors

• Perez Muñoz Maria Laura
• Gargalaka Jr João
• Mazzola Nicolas Cardoso
• Buaszczyk Gianna
• Perez Carmelo Declet
• Hansen Sydney E

Classifications

• C08F2410/04

  Dual catalyst, i.e. use of two different catalysts, where none of the catalysts is a metallocene · CPC title

• B32B2307/732

  Dimensional properties · CPC title

• B32B27/20

  using fillers, pigments, thixotroping agents · CPC title

• C08F210/16

  Copolymers of ethene with alpha-alkenes, e.g. EP rubbers · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title