Memory arrays with vertical thin film transistors coupled between digit lines

US11380388B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11380388-B2
Application numberUS-202117140540-A
CountryUS
Kind codeB2
Filing dateJan 4, 2021
Priority dateAug 23, 2018
Publication dateJul 5, 2022
Grant dateJul 5, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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In the examples disclosed herein, a memory array can have a first group of memory cells coupled to a first digit line at a first level and a second group of memory cells coupled to a second digit line at the first level. A third digit line can be at a second level and can be coupled to a main sense amplifier. A first vertical thin film transistor (TFT) can be at a third level between the first and second levels can be coupled between the first digit line and the third digit line. A second vertical TFT can be at the third level and can be coupled between the second digit line and the third digit line. A local sense amplifier can be coupled to the first and second digit lines.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a hierarchical digit line structure comprising a first digit line at a first level, a second digit line at a second level that is different from the first level, and a third digit line at the first level; a bus at the first level between the first digit line and the third digit line; a memory cell comprising a planar transistor and a storage element, the planar transistor comprising a source and drain arranged horizontally and coupled between the first digit line and the storage element; a vertical transistor comprising source and drain arranged vertically and coupled between the first and second digit lines; and a local sense amplifier coupled to the first and third digit lines and the bus, wherein the local sense amplifier comprises a plurality of vertical thin film transistors at a third level between the first and second levels. 2. The apparatus of claim 1 , wherein the apparatus further comprises an additional memory cell comprising an additional planar transistor and an additional storage element. 3. The apparatus of claim 2 , wherein the additional planar transistor comprises a source and a drain arranged horizontally and coupled between the third digit line and the additional storage element. 4. The apparatus of claim 3 , wherein the additional planar transistor further comprises an additional vertical transistor comprising a source and drain arranged vertically and coupled between the second and third digit lines. 5. The apparatus of claim 1 , further comprising a main sense amplifier coupled to the second digit line. 6. The apparatus of claim 1 , wherein the storage element is between the first and second levels. 7. An apparatus comprising: a hierarchical digit line structure comprising a first digit line at a first level and a second digit line at a second level that is different from the first level; a memory array comprising a first group of memory cells coupled to the first digit line at the first level, wherein the first group of memory cells comprise planar transistors and storage elements, and a second group of memory cells coupled to the second digit line at the first level, wherein the second group of memory cells comprise planar transistors and storage elements; and a local sense amplifier comprising: a first vertical thin film transistor at a third level between the first and second levels, and a second vertical thin film transistor at the third level. 8. The apparatus of claim 7 , further comprising a third digit line at the second level. 9. The apparatus of claim 8 , further comprising a bus at the second level. 10. The apparatus of claim 9 , wherein the bus is located between the second digit line and the third digit line at the second level. 11. The apparatus of claim 7 , wherein the first vertical thin film transistor is configured to selectively couple the bus to the first digit line. 12. The apparatus of claim 7 , wherein the second vertical thin film transistor configured to selectively couple the bus to the first digit line. 13. A method of forming an apparatus, the method of forming comprising: forming a hierarchical digit line structure comprising a first digit line at a first level, a second digit line at a second level that is different from the first level, and a third digit line at the first level; forming a bus at the first level between the first digit line and the third digit line; forming a memory cell comprising a planar transistor and a storage element, the planar transistor comprising a source and drain arranged horizontally and coupled between the first digit line and the storage element; forming a vertical transistor comprising source and drain arranged vertically and coupled between the first and second digit lines; and forming a local sense amplifier coupled to the first and third digit lines and the bus, and wherein the local sense amplifier comprises a plurality of vertical thin film transistors at a third level between the first and second levels. 14. The method of forming of claim 13 , further comprising forming: a main sense amplifier coupled to the second digit line. 15. The method of forming of claim 13 , further comprising forming an additional memory cell comprising an additional planar transistor and an additional storage element. 16. The method of forming of claim 15 , wherein forming the additional planar transistor comprises forming: a source and a drain arranged horizontally and coupled between the third digit line and the additional storage element; and an additional vertical transistor comprising a source and drain arranged vertically and coupled between the second and third digit lines.

Assignees

Inventors

Classifications

  • Vertical TFTs · CPC title

  • Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate · CPC title

  • Bit-line organisation, e.g. bit-line layout, folded bit lines · CPC title

  • Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating · CPC title

  • with one charge-transfer gate, e.g. MOS transistor, per cell · CPC title

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What does patent US11380388B2 cover?
In the examples disclosed herein, a memory array can have a first group of memory cells coupled to a first digit line at a first level and a second group of memory cells coupled to a second digit line at the first level. A third digit line can be at a second level and can be coupled to a main sense amplifier. A first vertical thin film transistor (TFT) can be at a third level between the first …
Who is the assignee on this patent?
Micron Technology Inc
What technology area does this patent fall under?
Primary CPC classification G11C11/4097. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 05 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).