Display device, display device production method, display device production apparatus, deposition apparatus, and controller
US-2020035768-A1 · Jan 30, 2020 · US
US11374196B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11374196-B2 |
| Application number | US-201916612381-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 6, 2019 |
| Priority date | May 27, 2019 |
| Publication date | Jun 28, 2022 |
| Grant date | Jun 28, 2022 |
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An organic light-emitting diode (OLED) display panel including a composite substrate including a first substrate, a barrier layer, a plurality of inorganic layers each interlaced therein with an organic material structure, and a second substrate interlaced therein with an organic material structure; a buffer layer disposed on the composite substrate; a thin film transistor layer disposed on the buffer layer; an OLED device layer disposed on the thin film transistor layer; and an encapsulation layer disposed on the OLED device layer.
Opening claim text (preview).
What is claimed is: 1. An organic light-emitting diode (OLED) display panel, comprising: a composite substrate comprising a first substrate, a barrier layer, a first inorganic layer, a second inorganic layer, a first organic material structure, a second organic material structure, a third organic material structure, and a second substrate, wherein the first organic material structure is inside the first inorganic layer, the second organic material structure is inside a lower portion of the second inorganic layer, a lower portion of the third organic material structure is inside an upper portion of the second inorganic layer, and an upper portion of the third organic material structure is inside the second substrate, wherein the first substrate and the second substrate are composed of polyimide, and wherein the first organic material structure, the second organic material structure, and the third organic material structure space apart from each other and each are grid-like structures; a buffer layer disposed on the composite substrate; a thin film transistor layer disposed on the buffer layer; an OLED device layer disposed on the thin film transistor layer; and an encapsulation layer disposed on the OLED device layer. 2. The OLED display panel according to claim 1 , wherein the first inorganic layer and the second inorganic layer are composed of silicon nitride. 3. The organic light-emitting diode display panel according to claim 1 , wherein the first inorganic layer and the second inorganic layer are formed by chemical vapor deposition. 4. The OLED display panel according to claim 1 , wherein the grid-like structures are formed by photolithography. 5. The OLED display panel according to claim 1 , wherein the thin film transistor layer is composed of indium tin oxide. 6. An organic light-emitting diode (OLED) display panel comprising: a composite substrate comprising a first substrate, a barrier layer, a first inorganic layer, a second inorganic layer, a first organic material structure, a second organic material structure, a third organic material structure, and a second substrate, wherein the first organic material structure is inside the first inorganic layer, the second organic material structure is inside a lower portion of the second inorganic layer, a lower portion of the third organic material structure is inside an upper portion of the second inorganic layer, and an upper portion of the third organic material structure is inside the second substrate, wherein the first substrate and the second substrate are composed of polyimide, and the barrier layer is composed of silicon dioxide, and wherein the first organic material structure, the second organic material structure, and the third organic material structure space apart from each other and each are grid-like structures; a buffer layer disposed on the composite substrate; a thin film transistor layer disposed on the buffer layer; an OLED layer disposed on the thin film transistor layer; and an encapsulation layer disposed on the organic light-emitting diode device layer. 7. The OLED display panel according to claim 6 , wherein the barrier layer has a thickness of 0.2-1 μm. 8. The OLED panel according to claim 6 , wherein the first inorganic layer and the second inorganic layer are composed of silicon nitride. 9. The OLED display panel according to claim 6 , wherein the first inorganic layer and the second inorganic layer are formed by chemical vapor deposition. 10. The OLED display panel according to claim 6 , wherein the grid-like structures are formed by photolithography. 11. The OLED display panel according to claim 6 , wherein the thin film transistor layer is composed of indium tin oxide. 12. An organic light-emitting diode (OLED) display panel, comprising: a composite substrate comprising a first substrate, a barrier layer, a first inorganic layer, a second inorganic layer, a first organic material structure, a second organic material structure, a third organic material structure, and a second substrate, wherein the first organic material structure is inside the first inorganic layer, the second organic material structure is inside a lower portion of the second inorganic layer, a lower portion of the third organic material structure is inside an upper portion of the second inorganic layer, and an upper portion of the third organic material structure is inside the second substrate, wherein the barrier layer has a thickness of 0.2-1 μm, and wherein the first organic material structure, the second organic material structure, and the third organic material structure space apart from each other and each are grid-like structures; a buffer layer disposed on the composite substrate; a thin film transistor layer disposed on the buffer layer; an OLED device layer disposed on the thin film transistor layer; and an encapsulation layer disposed on the organic light-emitting diode device layer.
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