Device and method for contactless thickness measurement of a planar object

US11371832B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11371832-B2
Application numberUS-202117323463-A
CountryUS
Kind codeB2
Filing dateMay 18, 2021
Priority dateDec 21, 2018
Publication dateJun 28, 2022
Grant dateJun 28, 2022

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  5. First independent claim

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Abstract

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A measuring device for measuring thickness of a planar object, where the measuring device comprises a first optical sensor module and a second optical sensor module that located on opposites of the measured planar object with mutual distance the optical sensor modules having at least one light source, a reference shade with two dimensional pattern and an imaging sensor and computing equipment, where the one light source is set to an angle towards measured object and the reference shade is set between the light and the object so that a shadow forms on the surface of the object and the imaging sensor is set so it can detect the reference shade and the shadow while the computing equipment calculates the distance between the surface of the object and sensor module from the distance between the detected shade and shadow of both optical modules and calculate the thickness of the object.

First claim

Opening claim text (preview).

The invention claimed is: 1. A measuring device for measuring a thickness of a planar object, the measuring device comprising: a first optical sensor module and a second optical sensor module that are located on opposite sides of the planar object and separated by a known mutual distance, each of the optical sensor modules comprising: a light source set to an angle towards the planar object; a reference shade with a two dimensional pattern, the reference shade being set between the light source and the planar object so that a shadow is formed on a surface of the planar object; and an imaging sensor set so that it can detect the reference shade and the shadow simultaneously; and computing equipment configured to: for each of the optical sensor modules, calculate a distance between the surface of the planar object and the optical sensor module from a distance between the detected reference shade and the detected shadow; and calculate the thickness of the planar object by subtracting the distances between each surface of the planar object and each optical sensor module from the known mutual distance between the optical sensor modules. 2. The device according to claim 1 , where the reference shades are comprised of elements that are located substantially parallel to the planar object. 3. The device according to claim 1 , where the light sources provide light pulses with intervals of 5-100 ms and durations of 0.1-100 μs. 4. The device according to claim 1 , wherein at least one of the first and second optical sensor modules comprises multiple light sources with different wavelengths arranged to light the reference shade and planar object from different orientations in an x,y plane. 5. The device according to claim 1 , wherein at least one of the first and second optical sensor modules comprises multiple light sources with different wavelengths arranged to light the reference shade and planar object from different angles. 6. The device according to claim 1 , further comprising an optical, magnetic, eddy current and/or ultrasonic mutual sensor pair for determining the known mutual distance between the optical sensor modules. 7. The device according to claim 1 , wherein for at least one of the optical sensor modules, the imaging sensor, with or without additional optical elements, is arranged so that it can detect the reference shade and the shadow simultaneously within its focus area. 8. A method for measuring a thickness of a planar object, the method comprising: providing a first optical sensor module having a first light source, a first shade, and a first imaging sensor; forming a first shadow on a first surface of the planar object using the first light source and the first shade; detecting simultaneously the first shadow and the first shade with the first imaging sensor; measuring a distance between the first shade and the first shadow using computing equipment; converting the distance between the first shade and the first shadow to a first distance between the first optical sensor module and the first surface of the planar object; providing a second optical sensor module having a second light source, a second shade, and a second imaging sensor; forming a second shadow on a second surface of the planar object using the second light source and the second shade; detecting simultaneously the second shadow and the second shade with the second imaging sensor; measuring a distance between the second shade and the second shadow using the computing equipment; converting the distance between the second shade and the second shadow to a second distance between the second optical sensor module and the second surface of the planar object; determining a distance between the first and second optical sensor modules; and determining the thickness of the planar object with the computing equipment by subtracting the first and second distances from the distance between the first and second optical sensor modules. 9. The method according to claim 8 , wherein the planar object is paper, tissue, board or web. 10. The method according to claim 8 , further comprising: determining the distance between the first and second optical sensor modules by means of at least one of electromagnetic, inductive or ultrasonic sensors. 11. The method according to claim 8 , wherein calibration data is used to convert the distance between the first shade and the first shadow to the first distance. 12. The method according to claim 8 , wherein the first optical sensor module has a laser, further comprising: using the laser to illuminate a dot on the planar object; and detecting a position of the dot with both the first and second imaging sensors. 13. The method according to claim 8 , wherein a focal length of the first imaging sensor, with or without additional optical elements, at least partly covers the first surface of the planar object.

Assignees

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Classifications

  • of objects while moving (G01B11/0616 takes precedence) · CPC title

  • by measuring lateral position of a boundary of the object (G01B11/022, G01B11/024, G01B11/04 take precedence) · CPC title

  • for measuring outlines by shadow casting · CPC title

  • of coating · CPC title

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What does patent US11371832B2 cover?
A measuring device for measuring thickness of a planar object, where the measuring device comprises a first optical sensor module and a second optical sensor module that located on opposites of the measured planar object with mutual distance the optical sensor modules having at least one light source, a reference shade with two dimensional pattern and an imaging sensor and computing equipment, …
Who is the assignee on this patent?
Valmet Automation Oy
What technology area does this patent fall under?
Primary CPC classification G01B11/0691. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 28 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).