Method and apparatus for processing a substrate

Patent metadata

Field	Value
Publication number	US-11371155-B2
Application number	US-201916681492-A
Country	US
Kind code	B2
Filing date	Nov 12, 2019
Priority date	Dec 28, 2016
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

First claim

What is claimed is:

1. An apparatus for processing a surface of a substrate, comprising:
a substrate holder configured to hold the substrate between a first holding member and a second holding member, the second holding member having an opening through which the surface of the substrate can be exposed, the substrate holder having a sealing ridge to be pressed against a peripheral portion of the substrate to form an internal space in the substrate holder;
a sealing block having a larger shape than the sealing ridge;
an actuator configured to press the sealing block against the substrate holder;
a vacuum line coupled to the sealing block to create a pressure difference between the internal space and an external space, the external space being formed by the substrate holder, the exposed surface of the substrate, and the sealing block;
an on-off valve attached to the vacuum line;
a processing controller configured to perform a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space;
a pre-wetting liquid supply line coupled to the sealing block; and
a pre-wetting liquid supply valve attached to the pre-wetting liquid supply line,
wherein the processing controller is configured to keep the on-off valve and the pre-wetting liquid supply valve open simultaneously at least for a predetermined period of time.

2. The apparatus according to claim 1 , further comprising a pre-wetting tank in which the seal inspection is performed and to which a pre-wetting liquid is supplied.

3. The apparatus according to claim 1 , further comprising:
a drain line coupled to the sealing block, the drain line communicating with the external space; and
a pretreatment liquid supply line coupled to the sealing block, the pretreatment liquid supply line communicating with the external space.

4. The apparatus according to claim 1 , further comprising a plating tank configured to immerse the substrate, held by the substrate holder, in a plating solution to plate the substrate.

Assignees

• Ebara Corp

Inventors

• Okuzono Takahisa
• Fujikata Jumpei

Classifications

• C25D17/004

  Sealing devices · CPC title

• C25D5/34 Primary

  Pretreatment of metallic surfaces to be electroplated · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C23C18/1827

  only one step pretreatment · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title