Soft magnetic alloy powder and method for manufacturing same, as well as coil component made from soft magnetic alloy powder and circuit board carrying same
US-2020279676-A1 · Sep 3, 2020 · US
US11371122B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11371122-B2 |
| Application number | US-202016798828-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2020 |
| Priority date | Feb 28, 2019 |
| Publication date | Jun 28, 2022 |
| Grant date | Jun 28, 2022 |
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In an exemplary embodiment, a magnetic alloy powder is constituted by magnetic grains 100 whose alloy phase 1 is coated with an oxide film 2, wherein: the alloy phase 1 has a Fe content of 98 percent by mass or higher and also contains Si and at least one type of non-Si element that oxidizes more easily than Fe (element M); and the oxide film 2 is such that, at the location where the content of Si as expressed in percentage by mass is the highest according to the element distributions in the direction of film thickness, this content of Si is higher than the content of Fe, and also higher than the content of element M, at this location. The magnetic alloy powder has a high Fe content and also offers excellent insulating property.
Opening claim text (preview).
We claim: 1. A coil component that includes a coil part constituted by a metal conductor and a magnetic base body containing magnetic alloy grains, wherein the magnetic alloy grains are each constituted by an alloy phase coated with an oxide film which is constituted by an oxide of the alloy phase, wherein: a boundary between the alloy phase and the oxide film is formed wherein the oxide film covers the alloy phase, wherein, in a Fe-concentration distribution in a depth direction from a surface of each magnetic alloy grain, the oxide film has an Fe-concentration increase rate in the depth direction from the surface, which is high, and the alloy phase has an Fe-concentration increase rate in the depth direction from the boundary, which is low, as compared with each other, the alloy phase has a Fe content of 98 percent by mass or higher and also contains Si and at least one of non-Si elements that oxidize more easily than Fe wherein the non-Si elements are collectively referred to as element M; and the oxide film is constituted in a manner that, not throughout the oxide film entirely in a film thickness direction but at a location where a content of Si as expressed in percentage by mass in element distributions in a film thickness direction is highest, the content of Si is higher than a content of Fe, and also higher than a content of element M. 2. A circuit board on which the coil component of claim 1 is mounted. 3. The coil component according to claim 1 , wherein the oxide film is constituted in a manner that its total content of Si throughout the oxide film in the depth direction is higher than its total content of Fe, and also higher than its total content of element M throughout the oxide film in the depth direction. 4. The coil component according to claim 1 , wherein the oxide film contains element M. 5. The coil component according to claim 1 , wherein the oxide film contains Si, and all of element M that is contained in the alloy phase, throughout the film in its entirety. 6. The coil component according to claim 1 , wherein the at least one of element M is at least one of Cr, Al, Ti, Zr, and Mg. 7. The coil component according to claim 1 , wherein the at least one of element M includes Cr.
Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title
Chemical treatment, e.g. passivation or decarburisation · CPC title
Thermal or thermo-mechanical treatment · CPC title
containing titanium or zirconium · CPC title
Coils; Windings; Conductive connections · CPC title
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