Conductive coating material and production method for shielded package using conductive coating material

Patent metadata

Field	Value
Publication number	US-11370926-B2
Application number	US-201716088163-A
Country	US
Kind code	B2
Filing date	Mar 27, 2017
Priority date	Mar 29, 2016
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

First claim

The invention claimed is:

1. A conductive coating material comprising at least:
(A) 100 parts by mass of a binder component including 5 to 30 parts by mass of a solid epoxy resin that is a solid at normal temperature and 20 to 90 parts by mass of a liquid epoxy resin that is a liquid at normal temperature, provided that the total amount of the solid and liquid epoxy resins does not exceed 100 parts by mass;
(B) 200 to 1800 parts by mass of silver-coated copper alloy particles which are copper alloy particles covered with a silver-containing layer, in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A); and
(C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

2. The conductive coating material according to claim 1 ,
wherein the liquid epoxy resin comprises 5 to 35 parts by mass of a liquid glycidyl amine type epoxy resin and 20 to 55 parts by mass of a liquid glycidyl ether type epoxy resin.

3. The conductive coating material according to claim 2 ,
wherein the liquid glycidyl amine type epoxy resin has a weight per epoxy equivalent of 80 to 120 g/eq and a viscosity of 1.5 Pa·s or less, and the liquid glycidyl ether type epoxy resin has a weight per epoxy equivalent of 180 to 220 g/eq and a viscosity of 6 Pa·s or less.

4. The conductive coating material according to claim 1 ,
wherein the binder component (A) further contains a (meth)acrylate compound.

5. The conductive coating material according to claim 2 ,
wherein the binder component (A) further contains a (meth)acrylate compound.

6. The conductive coating material according to claim 3 ,
wherein the binder component (A) further contains a (meth)acrylate compound.

7. The conductive coating material according to claim 1 ,
wherein the silver-coated copper alloy particles (B) is flake shape.

8. The conductive coating material according to claim 2 ,
wherein the silver-coated copper alloy particles (B) is flake shape.

9. The conductive coating material according to claim 3 ,
wherein the silver-coated copper alloy particles (B) is flake shape.

10. The conductive coating material according to claim 4 ,
wherein the silver-coated copper alloy particles (B) is flake shape.

11. The conductive coating material according to claim 1 , which is for use in shielding an electronic part package.

12. A method for producing a shielded package in which electronic parts are mounted on a substrate, and a package obtained by sealing the electronic parts with a sealing material is covered with a shield layer, the method comprising at least:
a step of mounting a plurality of electronic parts on the substrate and sealing the electronic parts by filling the substrate with a sealing material and curing thereof;
a step of forming a groove portion by cutting away the sealing material between the plurality of electronic parts and individualizing the package of each electronic part on the substrate by the groove portion;
a step of applying the conductive coating material according to claim 8 to a surface of the individualized package by spraying;
a step of forming the shield layer by heating the package to which the conductive coating material is applied and curing the conductive coating material; and
a step of obtaining a fragmented shielded package by cutting the substrate along the groove portion.

13. A method for producing a shielded package according to claim 12 ,
wherein the liquid epoxy resin comprises 5 to 35 parts by mass of a liquid glycidyl amine type epoxy resin and 20 to 55 parts by mass of a liquid glycidyl ether type epoxy resin.

14. A method for producing a shielded package according to claim 12 ,
wherein the liquid glycidyl amine type epoxy resin has a weight per epoxy equivalent of 80 to 120 g/eq and a viscosity of 1.5 Pa·s or less, and the liquid glycidyl ether type epoxy resin has a weight per epoxy equivalent of 180 to 220 g/eq and a viscosity of 6 Pa·s or less.

15. A method for producing a shielded package according to claim 12 ,
wherein the binder component (A) further contains a (meth)acrylate compound.

16. A method for producing a shielded package according to claim 12 ,
wherein the silver-coated copper alloy particles (B) is flake shape.

Assignees

• Tatsuta Electric Wire & Cable Co Ltd

Inventors

• Umeda Hiroaki
• Matsuda Kazuhiro
• Yukawa Ken

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title