Mounting substrate

Patent metadata

Field	Value
Publication number	US-11367555-B2
Application number	US-201816175884-A
Country	US
Kind code	B2
Filing date	Oct 31, 2018
Priority date	Mar 1, 2017
Publication date	Jun 21, 2022
Grant date	Jun 21, 2022

Abstract

A mounting substrate includes a resin layer and a first conductor including a contact surface in contact with the resin layer. The first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface. The first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface. The resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side, and the first conductor includes an exposed portion defining a mounting electrode.

First claim

What is claimed is:

1. A mounting substrate comprising:
a resin layer; and
a first conductor including a contact surface in contact with the resin layer; wherein
the resin layer has a smooth mounting surface;
the first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface;
the first conductor has a non-uniform thickness varying a distance between the first surface and the second surface along an extending direction;
the first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface that is smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface;
the resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side;
the first conductor includes an exposed portion defining a mounting electrode.

2. The mounting substrate according to claim 1 , wherein the first surface of the first conductor is provided on a plane parallel or substantially parallel to the mounting surface.

3. The mounting substrate according to claim 1 , wherein the first conductor includes a first coil portion having a winding axis orthogonal or substantially orthogonal to the mounting surface and wound to define a contact surface with the resin layer.

4. The mounting substrate according to claim 3 , wherein the first coil portion has an average value of about 1 or more of a ratio of a thickness in a direction of the winding axis to a thickness in a width direction orthogonal or substantially orthogonal to the winding axis direction and the extending direction.

5. The mounting substrate according to claim 3 , wherein the first coil portion includes adjacent conductor portions and has an average value of about 0.5 or less of a ratio of a gap between the adjacent conductor portions to the thickness of one of the conductor portions.

6. The mounting substrate according to claim 3 , wherein the first coil portion has a planar spiral shape.

7. The mounting substrate according to claim 1 , further comprising:
a second conductor including a contact surface in contact with the resin layer and connected to the first conductor; wherein
the second conductor includes a first surface facing toward the mounting surface and a second surface on the side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface; and
the second conductor has a non-uniform thickness varying a distance between the first surface and the second surface along the extending direction.

8. The mounting substrate according to claim 7 , wherein a difference of a maximum value and a minimum value of a distance between the first surface of the second conductor and the mounting surface is smaller than a difference of a maximum value and a minimum value of a distance between the second surface of the second conductor and the mounting surface.

9. The mounting substrate according to claim 7 , wherein the first surface of the second conductor is provided on a plane parallel or substantially parallel to the mounting surface.

10. The mounting substrate according to claim 7 , wherein the second conductor includes a second coil portion having a winding axis orthogonal or substantially orthogonal to the mounting surface and wound to define a contact surface with the resin layer.

11. The mounting substrate according to claim 10 , wherein the second coil portion has an average value of about 1 or more of a ratio of a thickness in the winding axis direction to a thickness in a width direction orthogonal or substantially orthogonal to the winding axis direction and a winding direction.

12. The mounting substrate according to claim 10 , wherein the second coil portion includes adjacent conductor portions and has an average value of about 0.5 or less of a ratio of a gap between the adjacent conductor portions to the thickness of one of the conductor portions.

13. The mounting substrate according to claim 10 , wherein the second coil portion has a planar spiral shape.

14. The mounting substrate according to claim 1 , wherein an average value of the distance between the mounting surface and the first surface of the first conductor is smaller than a minimum value of the distance between the first surface of the first conductor and the second surface of the first conductor.

15. An electric element comprising:
the mounting substrate according to claim 1 ; and
a support substrate including a connection terminal; wherein
the mounting electrode of the mounting substrate is bonded via a bonding member to the connection terminal of the support substrate.

16. The electric element according to claim 15 , wherein the first surface of the first conductor is provided on a plane parallel or substantially parallel to the mounting surface.

17. A vibrating plate comprising:
the mounting substrate according to claim 1 .

18. An electric component comprising:
the mounting substrate according to claim 1 ;
a housing including a connection terminal; and
a magnet; wherein
the mounting electrode of the mounting substrate is bonded via a bonding member to the connection terminal; and
the magnet is provided on a side opposite to the mounting surface of the mounting substrate.

19. The electric component according to claim 18 , wherein the first surface of the first conductor is provided on a plane parallel or substantially parallel to the mounting surface.

Assignees

• Murata Manufacturing Co

Inventors

• Ito Shingo

Classifications

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F27/2804

  Printed windings · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title