Polymer-polymer fiber composite for high thermal conductivity

Patent metadata

Field	Value
Publication number	US-11365336-B2
Application number	US-201916664779-A
Country	US
Kind code	B2
Filing date	Oct 25, 2019
Priority date	Oct 26, 2018
Publication date	Jun 21, 2022
Grant date	Jun 21, 2022

Abstract

In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.

First claim

The invention claimed is:

1. A thermally conductive composition comprising:
from 40 to 80 volume percentage of a thermoplastic; and
a hybrid thermally conductive filler material comprising:
from 5 to 30 volume percentage of a polymer fiber with an aspect ratio greater than 10, and a thermal conductivity in the axial direction greater than or equal to 1 W/m-K;
from 10 to 40 volume percentage of a filler with a thermal conductivity greater than or equal to 10 W/m-K in at least one direction; and
from 0.1 to 20 volume percentage of a binding agent;

wherein the hybrid thermally conductive filler material has a thermal conductivity of at least 3 W/m-K; and
wherein the thermally conductive composition is characterized by a thermal conductivity of at least 1 W/m-K.

2. The composition of claim 1 , wherein the thermoplastic comprises a thermoplastic polymer selected from the group consisting of polyamide, polystyrene, polyester, acrylonitrile butadiene styrene, polyphenylene sulfide, polyphenylsulfone, polycarbonate, polyolefin, thermoplastic polyurethane, polyetherimide, liquid crystal polymer, poly(methyl methacrylate), polyaryletherketone, ethylene-vinyl acetate, acrylic styrene acrylonitrile and any combination thereof.

3. The composition of claim 1 , wherein the polymer fiber comprises polyethylene terephthalate, polybutylene terephthalate, poly(p-phenylene-2,6-benzobisoxazole), polyester, polyamide, polythiophene, poly(vinyl alcohol), polyaniline, polyacrylonitrile, aramid, natural, cellulose, or any combination thereof.

4. The composition of claim 1 , wherein the binding agent comprises aniline, polyaniline, poly(vinyl alcohol), thermoplastic polyurethane, epoxy, ethylene-vinyl acetate, polyethylene oxide, maelic anhydride grafted olefins, or any combination thereof.

5. The composition of claim 1 , wherein the binding agent comprises a block or graft copolymer containing monomers from the thermoplastic and polymer fibers.

6. The composition of claim 1 , wherein the filler has a maximum dimension less than or equal to 0.5 mm.

7. The composition of claim 1 , wherein the polymer fiber has a diameter less than 0.1 mm.

8. The composition of claim 1 , wherein the polymer fiber has a melting temperature greater than or equal to 20° C. above a melt processing temperature of the thermoplastic.

9. The composition of claim 1 , wherein the filler comprises a thermally conductive filler selected from the group consisting of aluminum nitride, aluminum oxide, boron nitride, silicon carbide, graphite, graphene, graphite oxide, expanded graphite, carbon fibers, carbon nanotubes, metal wires, diamond particles, zinc oxide, magnesium hydroxide, silicon nitride, and any combination thereof.

10. A thermally conductive composition comprising:
a thermoplastic; and
a hybrid thermally conductive filler material comprising:
a polymer fiber;
a filler; and
a binding agent;

wherein the thermoplastic is selected from the group consisting of a thermoplastic polymer, a thermoplastic elastomer, and a combination thereof;
wherein the hybrid thermally conductive filler material has a thermal conductivity of at least 3 W/m-K; and
wherein the thermally conductive composition has a thermal conductivity of at least 1 W/m-K.

11. The composition of claim 10 , wherein:
the thermoplastic is the thermoplastic polymer comprises one or more of polyamide, polystyrene, polyester, acrylonitrile butadiene styrene, polyphenylene sulfide, polyphenylsulfone, polycarbonate, polyolefin, thermoplastic polyurethane, polyetherimide, liquid crystal polymer, poly(methyl methacrylate), polyaryletherketone, ethylene-vinyl acetate, and acrylic styrene acrylonitrile;
the polymer fiber:
comprises one or more of polyethylene terephthalate, polybutylene terephthalate, poly(p-phenylene-2,6-benzobisoxazole), polyester, polyamide, polythiophene, poly(vinyl alcohol), polyaniline, polyacrylonitrile, aramid, natural, and cellulose;
has an aspect ratio greater than 10; and
a thermal conductivity in the axial direction greater than or equal to 1 W/m-K;

the filler:
comprises one or more of aluminum nitride, aluminum oxide, boron nitride, silicon carbide, graphite, graphene, graphite oxide, expanded graphite, carbon fibers, carbon nanotubes, metal wires, diamond particles, zinc oxide, magnesium hydroxide, and silicon nitride; and
has a thermal conductivity greater than or equal to 10 W/m-K in at least one direction; and

the binding agent comprises one or more of aniline, polyaniline, poly(vinyl alcohol), thermoplastic polyurethane, epoxy, ethylene-vinyl acetate, polyethylene oxide, and maelic anhydride grafted olefins.

12. The composition of claim 11 , wherein the filler has a maximum dimension less than or equal to 0.5 mm; and
wherein the polymer fiber has a diameter less than 0.1 mm.

13. The composition of claim 10 , wherein the thermally conductive composition:
has a thermal conductivity of at least 5 W/m-K; and
has one or more of:
an Izod notched impact strength of approximately 200 J/m;
a bulk density of approximately 0.8 g/cm 3 ; and
an electrical resistivity greater than approximately 10 12 Ω-cm.

14. The composition of claim 13 , wherein:
the thermoplastic comprises polycarbonate/acrylonitrile butadiene styrene;
the polymer fiber comprises polyparaphenylene terephthalamide fibers; and
the filler comprises graphite flakes.

15. The composition of claim 14 , wherein:
the volume percentage of the polycarbonate/acrylonitrile butadiene styrene is approximately 63;
the volume percentage of the polyparaphenylene terephthalamide fibers is approximately 12; and
the volume percentage of the graphite flakes is approximately 25.

16. The composition of claim 13 , wherein:
the polymer fiber comprises poly(phenylene benzobisthiazole) fibers;
the filler comprises graphite flakes; and
the thermoplastic binding agent comprises thermoplastic polyurethane.

17. The composition of claim 16 , wherein:
the volume percentage of the poly(phenylene benzobisthiazole) fibers is approximately 20;
the volume percentage of the graphite flakes is approximately 40; and
the volume percentage of the thermoplastic polyurethane is approximately 40.

18. The composition of claim 13 , wherein:
the thermoplastic comprises polycarbonate;
the polymer fiber comprises poly(p-phenylene-2,6-benzobisoxazole) fibers;
the filler comprises boron nitride flakes; and
the thermoplastic binding agent comprises thermoplastic polyurethane.

19. The composition of claim 18 , wherein:
the volume percentage of the polycarbonate is approximately 66;
the volume percentage of the poly(p-phenylene-2,6-benzobisoxazole) fibers is approximately 12;
the volume percentage of the boron nitride flakes is approximately 15; and
the volume percentage of the thermoplastic polyurethane is approximately 7.

Assignees

• Georgia Tech Res Inst

Inventors

• Bougher Thomas L
• Smith Matthew K
• Cola Baratunde
• Kalaitzidou Kyriaki

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• B29B15/125

  by dipping · CPC title

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• B33Y70/10

  Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

• B29C64/118

  using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title