Induction welding using a heat sink and/or cooling

US11364688B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11364688-B2
Application numberUS-201916532941-A
CountryUS
Kind codeB2
Filing dateAug 6, 2019
Priority dateAug 6, 2019
Publication dateJun 21, 2022
Grant dateJun 21, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) includes inductively heating a weld interface area between the first TPC and the second TPC, and cooling a surface of the first TPC opposite the weld interface area while inductively heating the weld interface area.

First claim

Opening claim text (preview).

The following is claimed: 1. A method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC), the method comprising: flexing a heat sink during placement onto a surface of the first TPC opposite a weld interface area, wherein flexing the heat sink includes flexing a flexible joint between a number of thermally conductive and electrically non-conductive tiles; inductively heating the weld interface area between the first TPC and the second TPC; cooling the surface of the first TPC opposite the weld interface area while inductively heating the weld interface area; and wherein the heat sink includes fluid channels disposed within the flexible joints, and further comprising pumping a coolant through the fluid channels. 2. The method of claim 1 , wherein cooling the surface of the first TPC includes dissipating the heat on the surface of the first TPC via the heat sink. 3. The method of claim 1 , wherein cooling the surface of the first TPC includes actively cooling the surface of the first TPC with a coolant. 4. The method of claim 1 , wherein inductively heating includes moving an induction coil along a weld line. 5. The method of claim 1 , wherein the heat sink is infused with PTFE where in contact with the first TPC to act as a release film. 6. The method of claim 1 , wherein the heat sink has a thermal diffusivity of greater than about 25 mm 2 /sec. 7. The method of claim 1 , wherein the tiles are comprised of Aluminum nitride. 8. The method of claim 1 , wherein the tiles are comprised of Beryllium Oxide. 9. The method of claim 1 , wherein the flexible joint is comprised of a silicone. 10. The method of claim 1 , further comprising: inserting the first TPC, the second TPC, and the heat sink within a vacuum bag; and filling the vacuum bag with an inert gas. 11. The method of claim 1 , further comprising: inserting the first TPC, the second TPC, and the heat sink within a vacuum bag; and applying a vacuum to the vacuum bag to compress the first TPC and the second TPC together. 12. The method of claim 1 , further comprising cooling a surface of the second TPC opposite the weld interface area while inductively heating the weld interface area. 13. The method of claim 12 , further comprising flexing a second heat sink during placement onto the surface of the second TPC opposite the weld interface area. 14. The method of claim 13 , wherein cooling the surface of the second TPC includes dissipating the heat on the surface of the second TPC via the second heat sink. 15. A method of dissipating heat from a surface of a first thermoplastic composite (TPC) being inductively welded in a weld interface area to a second thermoplastic composite (TPC), the method comprising: flexing a heat sink during placement above the weld interface area to conform to the surface of the first TPC, wherein flexing the heat sink includes flexing a flexible joint between a number of thermally conductive and electrically non-conductive tiles; flexing a second heat sink during placement to conform to a surface of the second TPC, wherein the second heat sink is thermally conductive and electrically non-conductive; applying inductive heat to the weld interface area between the first TPC and the second TPC; drawing off heat via the heat sink from the surface of the first TPC; and wherein the heat sink includes fluid channels disposed within the flexible joints, and further comprising pumping a coolant through the fluid channels. 16. The method of claim 15 , further comprising drawing off heat via the second heat sink from the surface of the second TPC. 17. The method of claim 15 , wherein flexing the heat sink includes conforming the heat sink to a contoured surface of the first TPC. 18. The method of claim 15 , wherein applying inductive heat includes moving and induction coil along a weld line. 19. The method of claim 15 , further comprising: inserting the first TPC, the second TPC, the heat sink, and the second heat sink within a vacuum bag; and filling the vacuum bag with an inert gas. 20. The method of claim 15 , further comprising: inserting the first TPC, the second TPC, the heat sink, and the second heat sink within a vacuum bag; and applying a vacuum to the vacuum bag to compress the first TPC and the second TPC together.

Assignees

Inventors

Classifications

  • Joining profiled elements · CPC title

  • with hinged connections · CPC title

  • Movable elements, e.g. being pivotable · CPC title

  • for electrical insulation · CPC title

  • of ceramic; of concrete; of natural stone · CPC title

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Frequently asked questions

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What does patent US11364688B2 cover?
A method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) includes inductively heating a weld interface area between the first TPC and the second TPC, and cooling a surface of the first TPC opposite the weld interface area while inductively heating the weld interface area.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B29C65/3672. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 21 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).