Systems and methods for minimizing vibration sensitivity for protected microphones

Patent metadata

Field	Value
Publication number	US-11363372-B2
Application number	US-202017018673-A
Country	US
Kind code	B2
Filing date	Sep 11, 2020
Priority date	Mar 23, 2018
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

Protected microphone systems may include one or more dampeners, one or more cavities, or a combination thereof to minimize the vibration sensitivity of a microphone of the protected microphone systems. The dampeners, when present, may be constructed of a foam material or a thin metal material.

First claim

What is claimed is:

1. An image capture device comprising:
a housing;
an audio capture device configured to obtain an audible sound;
a printed circuit board (PCB) coupled to the audio capture device;
a protective layer coupled to an internal portion of the housing; and
a dampener configured to absorb vibration energy, wherein a first surface of the dampener directly contacts the protective layer and a second surface of the dampener is coupled to the PCB.

2. The image capture device of claim 1 , wherein the protective layer is a membrane.

3. The image capture device of claim 2 , wherein the membrane comprises silicone or polytetrafluoroethylene (PTFE).

4. The image capture device of claim 1 , wherein a portion of the dampener defines a cavity.

5. The image capture device of claim 4 , wherein the dampener is flexible.

6. The image capture device of claim 1 , wherein the dampener comprises at least one of a foam material, a thin metal, or a rubber material.

7. The image capture device of claim 1 , wherein the first surface of the dampener is opposite the second surface of the dampener.

8. An audio capture device comprising:
a housing that includes a first port fluidly connected to an external environment relative to the image capture device and a second port spaced from and fluidly connected to the first port;
a protective layer disposed between the first port and the second port;
a circuit board comprising a microphone configured to obtain an audible sound via the second port;
a first cavity that extends between the first port and a first surface of the protective layer;
a second cavity that extends between a second surface of the protective layer, the second port, and the microphone; and
a dampener disposed between the circuit board and the protective layer, wherein a first surface of the dampener directly contacts the protective layer and a second surface of the dampener is coupled to the circuit board.

9. The audio capture device of claim 8 , wherein the protective layer is coupled to an internal portion of the housing.

10. The audio capture device of claim 8 , wherein a volume of the first cavity is substantially the same as a volume of the second cavity.

11. The audio capture device of any one of claim 8 , wherein the protective layer is a membrane.

12. The audio capture device of claim 8 , wherein the protective layer comprises silicone or polytetrafluoroethylene (PTFE).

13. The audio capture device of claim 8 , wherein a portion of the second cavity is defined by the dampener.

14. The audio capture device of claim 8 , wherein the dampener comprises at least one of a foam material, a thin metal, or a rubber material.

15. The audio capture device of claim 8 , wherein the dampener is flexible.

16. The audio capture device of claim 8 , wherein the first surface of the dampener is opposite the second surface of the dampener.

17. An image capture system comprising:
a housing;
a printed circuit board (PCB) disposed in the housing;
an audio capture device coupled to the PCB configured to obtain an audible sound;
a protective layer coupled to an internal portion of the housing;
a dampener configured to absorb vibration energy, wherein a first surface of the dampener is coupled to the PCB; and
an adhesive layer configured to attach the protective layer to a second surface of the dampener.

18. The image capture system of claim 17 , wherein the protective layer comprises silicone or polytetrafluoroethylene (PTFE).

19. The image capture system of claim 17 , wherein the dampener comprises at least one of a foam material, a thin metal, or a rubber material.

20. The image capture system of claim 17 , wherein the protective layer includes an active area and a non-active area.

Assignees

• Gopro Inc

Inventors

• Gorny Joyce
• Tisch Erich
• Hardin Mark
• Hansson Per Magnus Fredrik

Classifications

• G10K11/002 Primary

  Devices for damping, suppressing, obstructing or conducting sound in acoustic devices (G10K1/06 - G10K1/10 take precedence; for electro-mechanical transducers for communication H04R3/002) · CPC title

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51

  Housings · CPC title

• G03B31/06

  in which sound track is associated with successively-shown still pictures · CPC title