Method of manufacturing display device with lateral wiring

Patent metadata

Field	Value
Publication number	US-11362246-B2
Application number	US-202016796221-A
Country	US
Kind code	B2
Filing date	Feb 20, 2020
Priority date	Feb 20, 2019
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.

First claim

The invention claimed is:

1. A method of manufacturing a display device, the method comprising:
providing a substrate and at least one light-emitting element, wherein
the substrate comprises sub-pixels, a first wiring disposed for the sub-pixels, and an electrode disposed between the sub-pixels, and
the at least one light-emitting element comprises a lower surface, a lateral surface, a first electrode disposed on the lower surface, and a second electrode disposed on at least a portion of the lateral surface;

mounting the at least one light-emitting element on the substrate and electrically connecting the first electrode to the first wiring;
forming a resin member on the substrate, the resin member covering the at least one light-emitting element and the electrode;
exposing an upper portion of the at least one light-emitting element from an upper surface of the resin member such that a portion of the second electrode is exposed by removing an upper portion of the resin member, and exposing at least a portion of the electrode from a lateral surface of the resin member by removing a portion of the resin member, the electrode being disposed at an elevation lower than the lower surface of the at least one light-emitting element; and
forming a second wiring on a region of the upper surface of the resin member excluding a portion of the at least one light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode and to the electrode.

2. The method of manufacturing a display device according to claim 1 ,
wherein the at least one light-emitting element includes a semiconductor member, and
wherein the second electrode is disposed around the semiconductor member in a top view.

3. The method of manufacturing a display device according to claim 2 , wherein the at least one light-emitting element has a quadrangular shape in a top view.

4. The method of manufacturing a display device according to claim 2 ,
wherein the at least one light-emitting element comprises a plurality of light-emitting elements, and
wherein two or more of the light-emitting elements are mounted on one of the sub-pixels.

5. The method of manufacturing a display device according to claim 4 , wherein the at least one light-emitting element comprises a defective light-emitting element, and the method further comprising,
disconnecting the defective light-emitting element from the second wiring.

6. The method of manufacturing a display device according to claim 1 ,
wherein the at least one light-emitting element includes a semiconductor member having an upper surface, and
wherein the second electrode is disposed also on a portion of the upper surface of the semiconductor member.

7. The method of manufacturing a display device according to claim 6 , wherein the at least one light-emitting element has a quadrangular shape in a top view.

8. The method of manufacturing a display device according to claim 6 ,
wherein the at least one light-emitting element comprises a plurality of light-emitting elements, and
wherein two or more of the light-emitting elements are mounted on one of the sub-pixels.

9. The method of manufacturing a display device according to claim 8 , wherein the at least one light-emitting element comprises a defective light-emitting element, and the method further comprising,
disconnecting the defective light-emitting element from the second wiring.

10. The method of manufacturing a display device according to claim 1 , wherein the at least one light-emitting element has a quadrangular shape in a top view.

11. The method of manufacturing a display device according to claim 1 ,
wherein the at least one light-emitting element comprises a plurality of light-emitting elements, and
wherein two or more of the light-emitting elements are mounted on one of the sub-pixels.

12. The method of manufacturing a display device according to claim 11 , wherein the at least one light-emitting element comprises a defective light-emitting element, and the method further comprising,
disconnecting the defective light-emitting element from the second wiring.

13. The method of manufacturing a display device according claim 1 ,
wherein the at least one light-emitting element comprises a plurality of light-emitting elements,
wherein in the step of forming the resin member, the resin member covers the plurality of light-emitting elements mounted on the plurality of sub-pixels, and
wherein in the step of exposing the upper portion, the resin member is divided into each of the sub-pixels.

Assignees

• Nichia Corp

Inventors

• Ichikawa Kinya
• Kadan Katsuyoshi
• Sano Masahiko
• Hirose Ryohei
• Yoneda Hiroshi

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/8312

  extending at least partially through the bodies · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title