Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product

Patent metadata

Field	Value
Publication number	US-11361876-B2
Application number	US-201916584825-A
Country	US
Kind code	B2
Filing date	Sep 26, 2019
Priority date	Mar 29, 2017
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

The present disclosure relates to an integrally formed product including a metal and a fiber of biological origin disposed in dispersed state in the metal. A proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 10 mass % or less.

First claim

What is claimed is:

1. An integrally formed product comprising a metal and a fiber of biological origin dispersed in the metal,
wherein a proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 10 mass % or less, and the metal is copper or tin.

2. The integrally formed product according to claim 1 , wherein the fiber of biological origin is a cellulose fiber.

3. The integrally formed product according to claim 1 , wherein the fiber of biological origin is a chitin or a chitosan fiber.

4. The integrally formed product according to claim 1 , wherein the fibers of biological origin are dispersed in the metal under a state of being oriented in one direction.

5. The integrally formed product according to claim 1 , wherein the fibers of biological origin are dispersed in the metal under a state of being arranged in random directions.

6. The integrally formed product according to claim 1 , wherein a decrease in conductivity of the integrally formed product is 30% or less compared to a conductivity of the metal.

7. The integrally formed product according to claim 1 , wherein an increase in tensile strength of the integrally formed product is 5% or more compared to a tensile strength of the metal.

8. The integrally formed product according to claim 1 , wherein a ratio of maximum value of dynamic friction coefficient of the integrally formed product is 0.8 less relative to that of the metal in a reciprocating sliding test in which a steel ball is used as a slider on a surface of the integrally formed product under a load of 100 gf and number of sliding of within 20 to 50.

9. The integrally formed product according to claim 1 , wherein a proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 7 mass % or less.

10. A method of manufacturing the integrally formed product according to claim 1 , wherein the integrally formed product is formed by electroplating method.

11. A composite material comprising the integrally formed product according to claim 1 and a substrate having a surface on which the integrally formed product is formed.

12. The composite material according to claim 11 , wherein the substrate is a conductive substrate.

13. The composite material according to claim 11 , wherein the substrate is an insulating substrate.

14. A terminal for electrical contact comprising an integrally formed product comprising a metal and a fiber of biological origin dispersed in the metal,
wherein a proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 10 mass % or less.

15. A printed wiring board comprising the integrally formed product according to claim 1 .

Assignees

• Furukawa Electric Co Ltd

Inventors

• Kasahara Masayasu
• Tachibana Akira

Classifications

• C25D7/00 Primary

  Electroplating characterised by the article coated · CPC title

• H01B1/02 Primary

  mainly consisting of metals or alloys · CPC title

• H05K2201/0278

  Polymeric fibers · CPC title

• H05K2201/0293

  Non-woven fibrous reinforcement · CPC title

• C23C18/1662 Primary

  Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title