Method for connecting molded bodies by injecting a single-component heat-curing epoxy resin composition into cavities

US11359119B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11359119-B2
Application numberUS-201816614714-A
CountryUS
Kind codeB2
Filing dateJun 22, 2018
Priority dateJun 22, 2017
Publication dateJun 14, 2022
Grant dateJun 14, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH2)x′—OH the value of x′=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH2)y′—COOH and derivatives of dicarboxylic acid, value of y′=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of bonding two shaped bodies S 1 and S 2 , said method comprising the steps of: a) providing a shaped body S 1 , b) arranging a shaped body S 2 with respect to the shaped body S 1 , forming a cavity between the two shaped bodies S 1 and S 2 , c) introducing a one-component thermosetting epoxy resin compositions into the cavity, wherein the one-component thermosetting epoxy resin composition is a one-component thermosetting epoxy resin composition comprising at least one epoxy resin A having an average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins which is activated by elevated temperature; and at least one polyester polyol PP obtainable by the reaction of at least one diol having the structure HO—(CH 2 ) x′ —OH where the value of x′=2 to 10, and at least one dicarboxylic acid having the structure HOOC—(CH 2 ) y′ —COOH and derivatives of this dicarboxylic acid, where the value of y′=8 to 18, and wherein the proportion of the polyester polyol PP is 1.5% to 20% by weight, based on the total weight of the one-component thermosetting epoxy resin composition. 2. The method as claimed in claim 1 , wherein the cavity is an open cavity. 3. The method as claimed in claim 1 , wherein there is essentially no change in the distance in the cavity between the two shaped bodies after the step b) of arranging a shaped body S 2 with respect to the shaped body S 1 . 4. The method as claimed in claim 1 , wherein any change in distance between the two shaped bodies alongside the cavity after step b) is 0-100 mm. 5. The method as claimed in claim 1 , wherein the one-component thermosetting epoxy resin composition is introduced through at least one introduction opening in at least one of the two shaped bodies. 6. The method as claimed in claim 1 , wherein the cavity is a bonding site for a composite of the two shaped bodies. 7. The method as claimed in claim 1 , wherein the cavity is a material recess in at least one of the two shaped bodies. 8. The method as claimed in claim 1 , wherein the method additionally comprises step d) of curing the one-component thermosetting epoxy resin composition for at least 10 min. 9. The method as claimed in claim 1 , wherein the one-component thermosetting epoxy resin composition on introduction in step c) is at a temperature of 40-100° C. 10. The method as claimed in claim 1 , wherein the one-component thermosetting epoxy resin composition on introduction in step c) is at a temperature of not more than 20° C., below the melting point of the polyester polyol PP. 11. The method as claimed in claim 1 , wherein the one-component thermosetting epoxy resin composition on introduction in step c) has a viscosity of <3,000 Pas, determining the viscosity by oscillography by means of a rheometer with a heatable plate (Anton Paar MCR 302) (1000 μm gap, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz). 12. The method as claimed in claim 1 , wherein the one-component thermosetting epoxy resin composition has a viscosity at 23° C. of >5,000 Pas, determining the viscosity by oscillography by means of a rheometer with a heatable plate (Anton Paar MCR 302) (1000 μm gap, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz). 13. The method as claimed in claim 1 , wherein the proportion of the polyester polyol PP is 2-15% by weight, based on the total weight of the one-component thermosetting epoxy resin composition. 14. The method as claimed in claim 1 , wherein any change in distance between the two shaped bodies alongside the cavity after step b) is 0-30 mm. 15. A method comprising applying a one-component thermosetting epoxy resin composition into a cavity between two shaped bodies S 1 and S 2 arranged with respect to one another and bonding the two shaped bodies S 1 and S 2 to one another, wherein the one-component thermosetting epoxy resin composition comprises: at least one epoxy resin A having an average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins which is activated by elevated temperature; and at least one polyester polyol PP obtainable by the reaction of at least one diol having the structure HO—(CH 2 ) x′ —OH where the value of x′=2 to 10, and at least one dicarboxylic acid having the structure HOOC—(CH 2 ) y′ —COOH and derivatives of this dicarboxylic acid, where the value of y′=8 to 18, and wherein the proportion of the polyester polyol PP is 1.5% to 20% by weight, based on the total weight of the one-component thermosetting epoxy resin composition. 16. A method comprising applying a polyester polyol PP in a one-component thermosetting epoxy resin compositions for reducing escape characteristics through lateral openings in cavities on introduction of the one-component thermosetting epoxy resin compositions into cavities having lateral openings, wherein the at least one polyester polyol PP is obtainable by the reaction of at least one diol having the structure HO—(CH 2 ) x′ —OH where the value of x′=2 to 10, and at least one dicarboxylic acid having the structure HOOC—(CH 2 ) y′ —COOH and derivatives of this dicarboxylic acid, where the value of y′=8 to 18, and wherein the proportion of the polyester polyol PP is 1.5% to 20% by weight, based on the total weight of the one-component thermosetting epoxy resin composition.

Assignees

Inventors

Classifications

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • characterised by the type of adhesives · CPC title

  • involving heating of the applied adhesive · CPC title

  • Alcohols or phenols · CPC title

  • Polyesters · CPC title

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What does patent US11359119B2 cover?
A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition includ…
Who is the assignee on this patent?
Sika Tech Ag
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 14 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).