Silicone composite for high temperature applications

Patent metadata

Field	Value
Publication number	US-11359094-B2
Application number	US-202016736947-A
Country	US
Kind code	B2
Filing date	Jan 8, 2020
Priority date	Jan 8, 2020
Publication date	Jun 14, 2022
Grant date	Jun 14, 2022

Abstract

A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

First claim

The invention claimed is:

1. An apparatus comprising: a first metal layer, a second metal layer, a polymeric layer, and an insulation layer, wherein the first and the second metal parts are separated from each other, and the polymeric layer is spatially in between the first and the second layer, and the insulation layer is spatially in between the polymer layer and one of the metal parts, wherein the insulation layer is a silicone composite comprising a silicone and an inorganic filler which is decomposable at a temperature no more than 500° C. and when said silicone composite is exposed to a high temperature it forms an inorganic composite having good dimensional stability, wherein said apparatus is a portion of a connector, circuit protection device, a relay device or a battery package.

2. The apparatus of claim 1 wherein the insulation layer when exposed to a temperature greater than 500° C. remains insulative and retains its shape under a load.

3. The apparatus of claim 1 , wherein the insulation layer remains insulative and retains its shape when exposed at a temperature of 500° C. for at least 15 minutes.

4. The apparatus of claim 1 , wherein the insulation layer remains insulative and retains its shape when exposed to a temperature of 1200° C. for at least 10 seconds.

5. The apparatus of claim 1 , wherein the insulation layer is directly over molded, cast, laminated, inserted or dispensed on the polymer layer.

6. The apparatus of claim 1 , wherein the insulation layer when exposed to high temperature maintains its dimensional stability with shrinkage of no more than 25%.

7. The apparatus of claim 1 , wherein the inorganic filler is chosen from the group comprising: magnesium hydroxide, magnesium carbonate, calcium hydroxide, sodium bicarbonate, potassium bicarbonate, aluminum hydroxide and mixtures thereof.

8. The apparatus of claim 1 , wherein the inorganic filler is from about 10 weight % to about 90 weight % of the silicone composite.

9. The apparatus of claim 1 , wherein the insulation layer has a thickness of less than 2 mm.

10. The apparatus of claim 1 , wherein the first metal layer or the second metal layer is made of aluminum or aluminum alloys.

11. The apparatus of claim 1 , wherein the silicone composite is capable of forming at least a portion of an inorganic composite at a temperature of no more than 500° C. and maintaining its dimensional stability.

Assignees

• TE Connectivity Services Gmbh
• Te Connectivity Germany Gmbh

Inventors

• Tao Dejie
• Wang Lei
• Wu Yiliang
• Gao Ting
• Dressel Andre Martin
• Wolf Marco
• Dong Mei

Classifications

• H01M50/505

  comprising a single busbar · CPC title

• B32B27/08

  of synthetic resin · CPC title

• C08K3/36

  Silica · CPC title

• C08K2003/267

  Magnesium carbonate · CPC title

• H01M50/143

  Fireproof; Explosion-proof · CPC title