High density bezel for patch panel

Patent metadata

Field	Value
Publication number	US-11356751-B2
Application number	US-201816624432-A
Country	US
Kind code	B2
Filing date	Jun 19, 2018
Priority date	Jun 19, 2017
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).

First claim

What is claimed is:

1. A multiport telecommunications bezel assembly comprising:
a. a first frame part defining a first peripheral wall and at least one first interior wall;
b. a second frame part defining a second peripheral wall and at least one second interior wall, the second frame part being secured to the first frame part such that the first and second peripheral walls and the at least one first and second interior walls define a two-row array of a plurality of jack receptacle openings extending from a first open end to a second open end; and
c. a metal bonding strip secured between the first and second frame parts and located between first and second rows of the two-row array, the bonding strip including a plurality of grounding contact elements extending into each of the plurality of jack receptacle openings.

2. The multiport telecommunications bezel assembly of claim 1 , wherein the first frame part includes a plurality of latches for removably securing jacks within the plurality of jack receptacle openings.

3. The multiport telecommunications bezel assembly of claim 1 , further including a rack panel to which the second frame part is secured.

4. The multiport telecommunications assembly of claim 3 , wherein the rack panel has a 1U rack height.

5. The multiport telecommunications bezel assembly of claim 1 , further including a plurality of jacks inserted into the plurality of jack receptacle openings.

6. The multiport telecommunications bezel assembly of claim 5 , wherein each of the plurality of jacks can be inserted into one of the plurality of jack receptacle openings from the first open end and from the second open end.

7. A telecommunications panel comprising:
a. a panel frame defining at least two frame openings; and
b. a plurality of multiport telecommunications bezel assemblies secured to the panel frame and extending through the frame openings, each multiport telecommunications bezel assembly comprising:
i. a first frame part defining a first peripheral wall and at least one first interior wall;
ii. a second frame part defining a second peripheral wall and at least one second interior wall, the second frame part being secured to the first frame part such that the first and second peripheral walls and the at least one first and second interior walls define a two-row array of a plurality of jack receptacle openings extending from a rear open end to a front open end; and
iii. a metal bonding strip secured between the first and second frame parts of each of the plurality of bezel assemblies, the bonding strip being located between first and second rows of the two-row array, the bonding strip including a plurality of grounding contact elements extending into each of the plurality of jack receptacle openings.

8. The telecommunications panel of claim 7 , further including a plurality of jacks inserted into the plurality of jack receptacle openings.

9. The telecommunications panel of claim 7 , wherein the first frame part includes a plurality of latches for removably securing jacks within the plurality of jack receptacle openings.

10. The telecommunications panel of claim 8 , wherein each of the plurality of jacks can be inserted into one of the plurality of jack receptacle openings from the first open end and from the second open end.

11. The telecommunications panel of claim 7 , wherein the panel frame has a 1U rack height.

12. The telecommunications panel of claim 7 , wherein the panel frame includes a plurality of frame openings.

13. The telecommunications panel of claim 7 , wherein each of the multiport telecommunications bezel assemblies includes twelve jack receptacle openings.

14. The telecommunications panel of claim 13 , wherein the plurality of telecommunications bezel assemblies includes four multiport telecommunications bezel assemblies.

15. A multiport telecommunications bezel assembly comprising:
a. a panel frame defining a plurality of openings;
b. a plurality of bezel frame assemblies, each being secured within one of the plurality of panel frame openings, wherein each of the plurality of bezel frame assemblies defines a plurality of jack receptacle openings; and
c. a metal bonding strip secured between the plurality of bezel frame assemblies, the metal bonding strip being located between an upper row of jack receptacle openings and a lower row of jack receptacle openings of each of the plurality of bezel frame assemblies, the bonding strip including a plurality of grounding contact elements extending into each of the plurality of jack receptacle openings in the upper and lower rows.

16. The multiport telecommunications bezel assembly of claim 15 , wherein the plurality of bezel frame assemblies are formed from a polymeric material.

Assignees

• Commscope Technologies Llc

Inventors

• White Gordon John
• Tobey Shawn Phillip
• Fitzpatrick Brian J

Classifications

• H01R13/518

  for holding or embracing several coupling parts, e.g. frames · CPC title

• H04Q1/02

  Constructional details · CPC title

• H04Q1/13 Primary

  Patch panels for monitoring, interconnecting or testing circuits, e.g. patch bay, patch field or jack field; Patching modules · CPC title

• H01R13/42

  Securing in a demountable manner · CPC title

• H01R13/10

  Sockets for co-operation with pins or blades · CPC title