Bonded substrate, surface acoustic wave element, surface acoustic wave element device, and bonded substrate manufacturing method
US-2020127634-A1 · Apr 23, 2020 · US
US11356076B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11356076-B2 |
| Application number | US-202017134228-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 25, 2020 |
| Priority date | Jan 22, 2020 |
| Publication date | Jun 7, 2022 |
| Grant date | Jun 7, 2022 |
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In a surface acoustic wave filter according to an embodiment, a thickness of a piezoelectric crystal substrate bonded over a support substrate made of an oxide crystal is 0.05 to 0.5 μm, and an odd-order harmonic is used.
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What is claimed is: 1. A surface acoustic wave filter comprising: an oxide crystal substrate; a piezoelectric crystal substrate bonded over the oxide crystal substrate; and an IDT (Interdigital Transducer) electrode formed over the piezoelectric crystal substrate, wherein a thickness of the piezoelectric crystal substrate is 0.05 to 0.5 μm, and an odd-order harmonic is used. 2. The surface acoustic wave filter according to claim 1 , wherein the odd-order harmonic is a third harmonic. 3. The surface acoustic wave filter according to claim 1 , wherein a width w of each of electrode fingers of the IDT electrode is 0.2 to 1.5 μm, and a ratio w/p between the width w and a pitch p of the electrode fingers is 0.7 to 0.9. 4. The surface acoustic wave filter according to claim 1 , wherein the oxide crystal substrate is a quartz-crystal substrate, and the piezoelectric crystal substrate is a LiTaO 3 substrate. 5. The surface acoustic wave filter according to claim 4 , wherein the oxide crystal substrate is an AT-cut 0-90° X-propagation quartz-crystal substrate, and the piezoelectric crystal substrate is a 36-45° Y-cut X propagation LiTaO 3 substrate. 6. A method for manufacturing a surface acoustic wave filter, comprising the steps of: (a) bonding a piezoelectric crystal substrate having a thickness of 0.05 to 0.5 μm over an oxide crystal substrate; and (b) forming an IDT (Interdigital Transducer) electrode over the piezoelectric crystal substrate, wherein a thickness of the piezoelectric crystal substrate is 0.05 to 0.5 μm, and the surface acoustic wave filter uses an odd-order harmonic. 7. The method for manufacturing the surface acoustic wave filter according to claim 6 , wherein the odd-order harmonic is a third harmonic. 8. The method for manufacturing the surface acoustic wave filter according to claim 6 , wherein a width w of each of electrode fingers of the IDT electrode is 0.2 to 1.5 μm, and a ratio w/p between the width w and a pitch p of the electrode fingers is 0.7 to 0.9. 9. The method for manufacturing the surface acoustic wave filter according to claim 6 , wherein the oxide crystal substrate is a quartz-crystal substrate, and the piezoelectric crystal substrate is a LiTaO 3 substrate. 10. The method for manufacturing the surface acoustic wave filter according to claim 9 , wherein the oxide crystal substrate is an AT-cut 0-90° X-propagation quartz-crystal substrate, and the piezoelectric crystal substrate is a 36-45° Y-cut X propagation LiTaO 3 substrate.
of quartz substrates · CPC title
of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title
for the manufacture of resonators or networks using surface acoustic waves · CPC title
for networks using surface acoustic waves · CPC title
Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness · CPC title
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