Flexible display panel and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11355574-B2
Application number	US-201916624796-A
Country	US
Kind code	B2
Filing date	Oct 21, 2019
Priority date	Jul 5, 2019
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

The present invention provides a display panel and a manufacturing method thereof. The display panel includes a flexible substrate, a buffer layer, a combination insulation layer, recess, an organic insulation layer, and a first wire changing layer. The first wire changing layer is disposed on an upper surface of the organic insulation layer and extends to the combination insulation layer. The present invention removes a through hole in a conventional organic insulation layer, on one hand mitigates the issue of broken lines in the first wire changing layer, and on the other hand mitigates the issue of shorting of adjacent two of wires in the first wire changing layer because of square waveform, sawtooth waveform, triangular waveform, and sinusoidal waveform of an edge line on a side of the first wire changing layer such that stability of the display panel is improved.

First claim

What is claimed is:

1. A display panel, comprising:
a flexible substrate;
a buffer layer disposed on a surface of a side of the flexible substrate;
a combination insulation layer disposed on a surface of a side of the buffer layer away from the flexible substrate;
a recess defined through the combination insulation layer and the buffer layer, and recessed in the surface of the side of the flexible substrate;
an organic insulation layer filled in the recess, and bonded to a surface of a side of the combination insulation layer away from the flexible substrate, wherein the organic insulation layer is formed without a through hole defined through the organic insulation layer; and
a first wire changing layer disposed on a surface of a side of the organic insulation layer away from the flexible substrate, and extending to the surface of the side of the combination insulation layer away from the flexible substrate;
wherein the flexible substrate comprises:
a first flexible substrate;
a first barrier layer disposed on a surface of a side of the first flexible substrate;
a second flexible substrate disposed on a surface of a side of the first barrier layer away from the first flexible substrate; and
a second barrier layer disposed on a surface of a side of the second flexible substrate away from the first flexible substrate;

wherein the recess is defined through the second barrier layer and connected to the second flexible substrate.

2. The display panel as claimed in claim 1 , wherein
an edge line of a side of the organic insulation layer is square waveform, sawtooth waveform, triangular waveform, or sinusoidal waveform.

3. The display panel as claimed in claim 1 , wherein the combination insulation layer comprises:
a first insulation layer disposed on the surface of the side of the buffer layer away from the flexible substrate;
a second insulation layer disposed on a surface of a side of the first insulation layer away from the flexible substrate; and
a combination dielectric layer disposed on a surface of a side of the second insulation layer away from the flexible substrate;
wherein a first wiring layer is disposed in the second insulation layer;
wherein a second wiring layer is disposed in the combination dielectric layer.

4. The display panel as claimed in claim 3 further comprising:
a first through hole defined through the combination dielectric layer; and
a second through hole defined through the combination dielectric layer and the second insulation layer;
wherein the first wire changing layer is connected to the second wiring layer through the first through hole;
wherein the first wire changing layer is connected to the first wiring layer through the second through hole.

5. The display panel as claimed in claim 3 , wherein
the combination dielectric layer comprises:
a first dielectric layer disposed on the surface of the side of the second insulation layer away from the flexible substrate; and
a second dielectric layer disposed on a surface of a side of the first dielectric layer away from the flexible substrate;
wherein the second wiring layer is disposed in the first dielectric layer.

6. The display panel as claimed in claim 1 further comprising:
a first planarization layer disposed on a surface of a side of the first wire changing layer away from the flexible substrate, disposed on the surface of the side of the combination insulation layer away from the flexible substrate, and disposed on the surface of the side of the organic insulation layer away from the flexible substrate;
a third through hole defined through the first planarization layer;
a second wire changing layer disposed on a surface of a side of the first planarization layer away from the flexible substrate, and connected to the first wire changing layer through the third through hole;
a second planarization layer disposed on a surface of a side of the second wire changing layer away from the flexible substrate; and
a pixel definition layer disposed on a surface of a side of the second planarization layer away from the flexible substrate.

7. A display panel manufacturing method, comprising:
a flexible substrate providing step providing a flexible substrate;
a buffer layer manufacturing step manufacturing a buffer layer on the flexible substrate upper surface;
a combination insulation layer manufacturing step manufacturing a combination insulation layer on an upper surface of the buffer layer;
a recess manufacturing step manufacturing a recess, wherein the recess is defined through the combination insulation layer and the buffer layer and is recessed in an upper surface of the flexible substrate;
an organic insulation layer manufacturing step depositing organic material in the recess and on a portion of an upper surface of the combination insulation layer to form an organic insulation layer, wherein the organic insulation layer is formed without a through hole defined through the organic insulation layer; and
a first wire changing layer manufacturing step manufacturing a first wire changing layer on the organic insulation layer and a portion of the upper surface of the combination insulation layer;
wherein the flexible substrate comprises:
a first flexible substrate;
a first barrier layer disposed on a surface of a side of the first flexible substrate;
a second flexible substrate disposed on a surface of a side of the first barrier layer away from the first flexible substrate; and
a second barrier layer disposed on a surface of a side of the second flexible substrate away from the first flexible substrate;

wherein the recess is defined through the second barrier layer and connected to the second flexible substrate.

8. The display panel manufacturing method as claimed in claim 7 , wherein
the combination insulation layer manufacturing step comprises:
a first insulation layer manufacturing step manufacturing a first insulation layer on an upper surface of the buffer layer;
a second insulation layer manufacturing step manufacturing a second insulation layer on an upper surface of the first insulation layer, wherein the first wiring layer is disposed in the second insulation layer;
a combination dielectric layer manufacturing step manufacturing a combination dielectric layer on an upper surface of the second insulation layer, wherein the second wiring layer is disposed in the combination dielectric layer;
a first through hole manufacturing step manufacturing a first through hole, wherein the first through hole is defined through the combination dielectric layer and is connected to the second wiring layer; and
a second through hole manufacturing step manufacturing a second through hole, wherein the second through hole is defined through the combination dielectric layer and the second insulation layer and is connected to the first wiring layer;
wherein the first wire changing layer is connected to the second wiring layer through the first through hole;
wherein the first wire changing layer is connected to the first wiring layer through the second through hole.

9. The display panel manufacturing method as claimed in claim 7 further comprising:
a first planarization layer manufacturing step manufacturing a first planarization layer on the first wire changing layer and the upper surface of the combination insulation layer;
a third through hole manufacturing step manufacturing a third through hole, wherein the third through hole is defined through the first planarization layer;
a second wire changing layer manufacturing step manufacturing a second wire changing layer on an upper surface of the first planarization layer; and
a second planarization layer manufacturing step manufacturing a second p

Assignees

• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd
• Wuhan China Star Optoelectronics Technology Co Ltd

Inventors

• Ming Xing
• Cao Zhongtao

Classifications

• H01L2251/5338

  Electricity · mapped topic

• H01L27/3276 Primary

  Electricity · mapped topic

• H01L27/3258

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic