Thermal excitation acoustic-wave-generating device and acoustic-wave-generating system

Patent metadata

Field	Value
Publication number	US-11350223-B2
Application number	US-202016886836-A
Country	US
Kind code	B2
Filing date	May 29, 2020
Priority date	Feb 19, 2018
Publication date	May 31, 2022
Grant date	May 31, 2022

Abstract

A thermal excitation acoustic-wave-generating device includes a first acoustic wave source that includes a first heating element and a substrate that includes a main surface along which the first heating element is disposed, a second acoustic wave source that includes a second heating element and a facing body that includes a main surface along which the second heating element is disposed, and a pair of electrodes connected to the first and second heating elements. The first and second acoustic wave sources are arranged such that the first and second heating elements are separated from each other and face each other. The pair of electrodes are disposed between the first and second acoustic wave sources.

First claim

What is claimed is:

1. A thermal excitation acoustic-wave-generating device comprising:
a first acoustic wave source that includes a first heating element and a substrate that includes a main surface along which the first heating element is disposed;
a second acoustic wave source that includes a second heating element and a facing body that includes a main surface along which the second heating element is disposed; and
a pair of electrodes that are connected to the first heating element and the second heating element; wherein
the first acoustic wave source and the second acoustic wave source are arranged such that the first heating element and the second heating element are separated from each other and face each other; and
the pair of electrodes are disposed between the first acoustic wave source and the second acoustic wave source.

2. The thermal excitation acoustic-wave-generating device according to claim 1 , wherein the first acoustic wave source and the second acoustic wave source are held with the pair of electrodes interposed therebetween.

3. The thermal excitation acoustic-wave-generating device according to claim 1 , wherein the main surface of the substrate and the main surface of the facing body are flat.

4. The thermal excitation acoustic-wave-generating device according to claim 1 , wherein
the first acoustic wave source, the second acoustic wave source, and the pair of electrodes define a path for an acoustic wave; and
a separation distance between the first acoustic wave source and the second acoustic wave source is less than a length of the path.

5. The thermal excitation acoustic-wave-generating device according to claim 4 , wherein the path has a quadrangular or substantially quadrangular prism shape.

6. The thermal excitation acoustic-wave-generating device according to claim 4 , wherein
both ends of the path are open ends; and
the length of the path is close to a whole number multiple of ½ of a wavelength of the acoustic wave.

7. The thermal excitation acoustic-wave-generating device according to claim 6 , wherein each of the open ends has a rectangular or substantially rectangular shape.

8. The thermal excitation acoustic-wave-generating device according to claim 4 , wherein
a first end of the path is an open end, and a second end thereof is a closed end; and
the length of the path is close to an odd number multiple of ¼ of a wavelength of the acoustic wave.

9. The thermal excitation acoustic-wave-generating device according to claim 8 , wherein the open end has a rectangular or substantially rectangular shape.

10. The thermal excitation acoustic-wave-generating device according to claim 1 , wherein the substrate and the facing body are made of Si or Al 2 O 3 .

11. An acoustic-wave-generating system comprising:
the thermal excitation acoustic-wave-generating device according to claim 1 that generates the acoustic wave; and
a driving device that supplies a driving signal to the acoustic-wave-generating device; wherein
a wavelength of an acoustic wave generated by the thermal excitation acoustic-wave-generating device is defined by the driving signal.

12. The acoustic-wave-generating system according to claim 11 , wherein the first acoustic wave source and the second acoustic wave source are held with the pair of electrodes interposed therebetween.

13. The acoustic-wave-generating system according to claim 11 , wherein the main surface of the substrate and the main surface of the facing body are flat.

14. The acoustic-wave-generating system according to claim 11 , wherein
the first acoustic wave source, the second acoustic wave source, and the pair of electrodes define a path for the acoustic wave; and
a separation distance between the first acoustic wave source and the second acoustic wave source is less than a length of the path.

15. The acoustic-wave-generating system according to claim 14 , wherein the path has a quadrangular or substantially quadrangular prism shape.

16. The acoustic-wave-generating system according to claim 14 , wherein
both ends of the path are open ends; and
the length of the path is close to a whole number multiple of ½ of the wavelength of the acoustic wave.

17. The acoustic-wave-generating system according to claim 16 , wherein each of the open ends has a rectangular or substantially rectangular shape.

18. The acoustic-wave-generating system according to claim 14 , wherein
a first end of the path is an open end, and a second end thereof is a closed end; and
the length of the path is close to an odd number multiple of ¼ of the wavelength of the acoustic wave.

19. The acoustic-wave-generating system according to claim 18 , wherein the open end has a rectangular or substantially rectangular shape.

20. The acoustic-wave-generating system according to claim 11 , wherein the substrate and the facing body are made of Si or Al 2 O 3 .

Assignees

• Murata Manufacturing Co

Inventors

• Sasaki Shinichi
• Asada Takaaki

Classifications

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R1/1091

  Details not provided for in groups H04R1/1008 - H04R1/1083 · CPC title

• B32B37/10

  characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• G01S7/521

  Constructional features · CPC title