Silicon carbide substrate production method and silicon carbide substrate

US11346018B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11346018-B2
Application numberUS-201816489814-A
CountryUS
Kind codeB2
Filing dateMar 1, 2018
Priority dateMar 2, 2017
Publication dateMay 31, 2022
Grant dateMay 31, 2022

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A silicon carbide substrate production method includes: the step of providing covering layers 1 b, 1 b , each containing silicon oxide, silicon nitride, silicon carbonitride, or silicide, respectively on both surfaces of a base material substrate 1 a carbon, silicon or silicon carbide, and turning the surface of each of the covering layers 1 b, 1 b into a smooth surface to prepare a support substrate 1 ; a step of forming a polycrystalline silicon carbide film 10 on both surfaces of the support substrate 1 by a gas phase growth method or a liquid phase growth method; and a step of separating the polycrystalline silicon carbide films from the support substrate while preserving, on the surface thereof, the smoothness of the covering layer surfaces 1 b, 1 b by chemically removing at least the covering layers 1 b, 1 b , from the support substrate 1 . The silicon carbide substrate has a smooth surface and reduced internal stress.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a silicon carbide substrate, comprising steps of: providing covering layers each containing silicon oxide, silicon nitride, silicon carbonitride or silicide on both surfaces of a base substrate made of carbon, silicon or silicon carbide to prepare a support substrate having the covering layers each with a smooth surface that has an arithmetic mean roughness Ra of 0.3 nm or less; forming polycrystalline silicon carbide films on both surfaces, each being the smooth surface of a corresponding one of the covering layers, of the support substrate by a vapor deposition method or a liquid phase growth method; and chemically removing at least the covering layers in the support substrate to separate the polycrystalline silicon carbide films from the support substrate such that a newly exposed, uncovered surface of each polycrystalline silicon carbide film, which has been in contact with the smooth surface of the corresponding one of the covering layers, has an arithmetic mean roughness Ra of 0.3 nm or less, and obtaining the polycrystalline silicon carbide films as silicon carbide substrates each having a crystal grain size of 10 nm or more and 10 μm or less, and an arithmetic mean roughness Ra of at least one of its main surfaces, being the newly exposed, uncovered surface, of 0.3 nm or less. 2. The method for producing a silicon carbide substrate according to claim 1 , wherein the support substrate is prepared by smoothing the both surfaces of the base substrate, and forming the covering layers made of silicon oxide, silicon nitride, silicon carbonitride or silicide on the smoothed both surfaces of the base substrate, wherein the smoothed both surfaces of the base substrate exhibit an arithmetic mean roughness Ra of 0.1 nm or less. 3. The method for producing a silicon carbide substrate according to claim 1 , wherein the support substrate is prepared by forming covering layers made of phospho silicate glass or boro-phospho silicate glass on the both surfaces of the base substrate, and reflowing the covering layers so as to form the smooth surface of each of the covering layers. 4. The method for producing a silicon carbide substrate according to claim 1 , wherein the polycrystalline silicon carbide films are formed by a thermal CVD method.

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Classifications

  • used as a support during the manufacture of self-supporting substrates · CPC title

  • Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

  • Polycrystalline · CPC title

  • using temporarily an auxiliary support · CPC title

  • Silicon carbide · CPC title

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What does patent US11346018B2 cover?
A silicon carbide substrate production method includes: the step of providing covering layers 1 b, 1 b , each containing silicon oxide, silicon nitride, silicon carbonitride, or silicide, respectively on both surfaces of a base material substrate 1 a carbon, silicon or silicon carbide, and turning the surface of each of the covering layers 1 b, 1 b into a smooth surface to …
Who is the assignee on this patent?
Shinetsu Chemical Co, Cusic Inc
What technology area does this patent fall under?
Primary CPC classification H10P14/2904. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 31 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).