Reducing resin squeeze-out

Patent metadata

Field	Value
Publication number	US-11345790-B2
Application number	US-201916539262-A
Country	US
Kind code	B2
Filing date	Aug 13, 2019
Priority date	Aug 13, 2019
Publication date	May 31, 2022
Grant date	May 31, 2022

Abstract

Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.

First claim

What is claimed is:

1. A method comprising:
receiving a first sub-laminate and a second sub-laminate, wherein the first sub-laminate is configured to be joined to the second sub-laminate at an overlap area using a prepreg layer to form a structure having a ledge;
selectively curing a portion of the prepreg layer adjacent to the ledge, wherein the portion of the prepreg layer that is adjacent to the ledge comprises a larger amount of dye-containing microcapsules relative to a remainder of the prepreg layer that is not adjacent to the ledge; and
forming the structure by combining the first sub-laminate, the second sub-laminate, and the prepreg layer and curing the remainder of the prepreg layer.

2. The method of claim 1 , wherein selectively curing the portion of the prepreg layer further includes:
selectively heating the portion of the prepreg layer using a laser.

3. The method of claim 1 , wherein selectively curing the portion of the prepreg layer further includes:
applying a mask to the remainder of the prepreg layer;
curing the prepreg layer in response to applying the mask; and
removing the mask in response to curing the prepreg layer.

4. The method of claim 3 , wherein the mask is configured to inhibit curing of the remainder of the prepreg layer.

5. The method of claim 1 , wherein the portion of the prepreg layer adjacent to the ledge is less than one inch.

6. The method of claim 1 , further comprising sizing the prepreg layer to approximate the overlap area by:
routing the prepreg layer according to the overlap area.

7. The method of claim 1 , further comprising sizing the prepreg layer to approximate the overlap area by:
undersizing the prepreg layer at the portion of the prepreg layer adjacent to the ledge.

8. The method of claim 1 , wherein the method further comprises:
applying the prepreg layer to the first sub-laminate, and wherein selectively curing the portion of the prepreg layer adjacent to the ledge is configured to cause the prepreg layer to bond to the first sub-laminate at the portion of the prepreg layer adjacent to the ledge.

9. A printed circuit board (PCB) comprising:
a first sub-laminate attached to a second sub-laminate at a contact area by a prepreg layer, wherein the PCB includes a ledge at a transition from the contact area to a non-contact area; and
wherein the prepreg layer comprises a portion of the prepreg layer that is adjacent to the ledge and a remainder of the prepreg layer that is not adjacent to the ledge, and wherein the portion of the prepreg layer that is adjacent to the ledge has a higher degree of cure and a larger amount of dye-containing microcapsules relative to the remainder of the prepreg layer that is not adjacent to the ledge.

10. The PCB of claim 9 , wherein the ledge includes an electrical contact.

11. The PCB of claim 9 , wherein the first sub-laminate and the second sub-laminate are configured to perform electrical signal processing.

12. The PCB of claim 9 , wherein the portion of the prepreg layer that is adjacent to the ledge is configured to function as a resin dam to reduce prepreg squeeze-out during assemblage of the first sub-laminate to the second sub-laminate using the prepreg layer.

13. The PCB of claim 9 , wherein an area of the prepreg layer is equal to the contact area.

14. The PCB of claim 9 , wherein an area of the prepreg layer is less than the contact area.

15. The PCB of claim 9 , wherein the portion of the prepreg layer that is adjacent to the ledge has a higher glass transition temperature relative to the remainder of the prepreg layer that is not adjacent to the ledge.

16. The PCB of claim 9 , wherein the portion of the prepreg layer that is adjacent to the ledge has a higher modulus relative to the remainder of the prepreg layer that is not adjacent to the ledge.

17. The PCB of claim 9 , wherein the portion of the prepreg layer that is adjacent to the ledge has a higher strength relative to the remainder of the prepreg layer that is not adjacent to the ledge.

18. The PCB of claim 9 , wherein the portion of the prepreg layer that is adjacent to the ledge has a lower toughness relative to the remainder of the prepreg layer that is not adjacent to the ledge.

19. A method comprising:
receiving a first component and a second component, wherein the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge;
applying the adhesive layer to the overlap area on the first component;
selectively curing a portion of the adhesive layer adjacent to the ledge, wherein the portion of the adhesive layer that is adjacent to the ledge comprises a larger amount of dye-containing microcapsules relative to a remainder of the adhesive layer that is not adjacent to the ledge; and
forming the structure by combining the first component, the second component, and the adhesive layer and curing the remainder of the adhesive layer.

Assignees

• IBM

Inventors

• Czaplewski-Campbell Sarah K
• Campbell Eric J

Classifications

• C08J5/24 Primary

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• B29C66/324

  Avoiding burr formation · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title

• B32B5/02

  characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title

• B29C65/1606

  Ultraviolet [UV] radiation, e.g. by ultraviolet excimer lasers · CPC title