Capacitor with visual indicator

Patent metadata

Field	Value
Publication number	US-11340287-B2
Application number	US-201816045242-A
Country	US
Kind code	B2
Filing date	Jul 25, 2018
Priority date	Jul 25, 2018
Publication date	May 24, 2022
Grant date	May 24, 2022

Abstract

Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.

First claim

What is claimed is:

1. A method of stress testing an electronics package, comprising:
populating a plurality of components on an electronics package, wherein the plurality of components each comprise a visual indicator that is responsive to heat, wherein the visual indicator comprises a first visual indicator component having a first color change and second visual indicator component having a second color change, the second color change different from the first color change;
stress testing the electronics package;
categorizing the plurality of components based on the visual indicators; and
modifying the plurality of components.

2. The method of claim 1 , wherein the visual indicator comprises a first band and a second band, wherein the visual indicator changes from the first band to the second band at a first temperature.

3. The method of claim 2 , wherein the visual indicator further comprises a third band, wherein the visual indicator changes from the second band to the third band at a second temperature.

4. The method of claim 3 , wherein the first band corresponds to a component that is operating in a first performance band, wherein the second band corresponds to a component that is operating in a second performance band, and wherein the third band corresponds to a component that is operating in a third performance band.

5. The method of claim 4 , wherein the second performance band is an optimal performance band.

6. The method of claim 5 , wherein modifying the plurality of components comprises removing components that are operating in the first performance band.

7. The method of claim 5 , wherein modifying the plurality of components comprises adding additional components to the plurality of components proximate to components that are operating in the third performance band.

8. The method of claim 1 , further comprising:
stress testing the electronics package a second time after modifying the plurality of components.

9. The method of claim 1 , wherein the visual indicator comprises thermochromic thermal paint.

10. The method of claim 9 , wherein the thermochromic paint changes from a first color to a second color at a first temperature.

11. The method of claim 10 , wherein the thermochromic paint changes color from the second color to a third color at a second temperature.

12. The method of claim 1 , wherein the visual indicator is permanent, or wherein the visual indicator is reversible.

13. The method of claim 1 , wherein the plurality of components comprise one or more of capacitors, inductors, resistors, or any other power delivery component.

14. A capacitor comprising:
a capacitor body;
electrical contacts coupled to the capacitor body;
a visual indicator on the capacitor body, wherein the visual indicator changes from a first band to a second band when the capacitor body is heated to a first temperature, wherein the visual indicator comprises a first visual indicator component having a first color change and second visual indicator component having a second color change, the second color change different from the first color change.

15. The capacitor of claim 14 , wherein the visual indicator is formed over a surface of the capacitor body opposite from the electrical contacts.

16. The capacitor of claim 14 , wherein the visual indicator is integrated into the capacitor body.

17. The capacitor of claim 14 , wherein the visual indicator is thermochromic paint.

18. The capacitor of claim 14 , wherein the visual indicator is a sticker.

19. The capacitor of claim 14 , wherein the visual indicator is reversible.

20. The capacitor of claim 14 , wherein the visual indicator is permanent.

21. The capacitor of claim 14 , wherein the visual indicator changes from the second band to a third band when the capacitor body is heated to a second temperature.

22. The capacitor of claim 21 , wherein the first band is a first color, the second band is a second color, and the third band is a third color.

23. An electronics testing device, comprising:
a package substrate;
a semiconductor die, electrically coupled to the package substrate; and
a plurality of capacitors coupled to a power rail of the package substrate, wherein the plurality of capacitors each comprise a visual indicator, wherein the visual indicator comprises a first visual indicator component having a first color change and second visual indicator component having a second color change, the second color change different from the first color change.

24. The electronics testing device of claim 23 , wherein the visual indicator is a thermochromic paint.

25. The electronics testing device of claim 24 , wherein the thermochromic paint changes color at a first temperature and at a second temperature.

26. A method of stress testing an electronics package, comprising:
populating a plurality of components on an electronics package, wherein the plurality of components each comprise a visual indicator that is responsive to heat;
stress testing the electronics package;
categorizing the plurality of components based on the visual indicators; and
modifying the plurality of components, wherein the visual indicator comprises a first band and a second band, wherein the visual indicator changes from the first band to the second band at a first temperature, wherein the visual indicator further comprises a third band, wherein the visual indicator changes from the second band to the third band at a second temperature, wherein the first band corresponds to a component that is operating in a first performance band, wherein the second band corresponds to a component that is operating in a second performance band, and wherein the third band corresponds to a component that is operating in a third performance band, wherein the second performance band is an optimal performance band, and wherein modifying the plurality of components comprises removing components that are operating in the first performance band.

27. A method of stress testing an electronics package, comprising:
populating a plurality of components on an electronics package, wherein the plurality of components each comprise a visual indicator that is responsive to heat;
stress testing the electronics package;
categorizing the plurality of components based on the visual indicators; and
modifying the plurality of components, wherein the visual indicator comprises a first band and a second band, wherein the visual indicator changes from the first band to the second band at a first temperature, wherein the visual indicator further comprises a third band, wherein the visual indicator changes from the second band to the third band at a second temperature, wherein the first band corresponds to a component that is operating in a first performance band, wherein the second band corresponds to a component that is operating in a second performance band, and wherein the third band corresponds to a component that is operating in a third performance band, wherein the second performance band is an optimal performance band, and wherein modifying the plurality of components comprises adding additional components to the plurality of components proximate to components that are operating in the third performance band.

Assignees

• Intel Corp

Inventors

• Parthasarathy Ramaswamy
• Rao Vikas
• Pai Praveen

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G01R31/2874 Primary

  related to temperature · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2203/161

  Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection · CPC title