Circuit board structure

Patent metadata

Field	Value
Publication number	US-11337303-B2
Application number	US-201916533808-A
Country	US
Kind code	B2
Filing date	Aug 7, 2019
Priority date	Jul 8, 2019
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

First claim

What is claimed is:

1. A circuit board structure suitable for carrying at least one heat source, comprising: a carrier; wherein the carrier is an insulating substrate, a patterned circuit layer, directly disposed on the carrier, wherein the patterned circuit layer is provided with at least one fluid channel therein; the at least one fluid channel is provided with a heat absorption section and a heat dissipation section relative to the heat absorption section, the at least one heat source is electrically connected to the patterned circuit layer, the heat absorption section is adjacent to the at least one heat source, and the heat generated by the at least one heat source is transferred from the patterned circuit layer to the heat absorption section of the at least one fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation; an adhesive material, disposed between the at least one heat source and the patterned circuit layer, and an orthographic projection of the adhesive material on the carrier is substantially equal to an orthographic projection of the heat source on the carrier; and a heat dissipation fin, wherein an orthographic projection of the heat dissipation fin on the carrier is overlapped with an orthographic projection of the heat dissipation section of the at least one fluid channel on the carrier, wherein an orthographic projection of the at least one heat source on the carrier is overlapped with an orthographic projection of the heat absorption section of the at least one fluid channel on the carrier, and wherein the at least one fluid channel comprises a plurality of fluid channels, and the plurality of fluid channels are separately positioned in the patterned circuit layer; and further comprising: a heat sink, embedded in the carrier and provided with a first surface and a second surface opposite to each other, wherein the first surface is in direct contact with the patterned circuit layer, and the second surface is aligned with a lower surface of the carrier.

2. The circuit board structure according to claim 1 , wherein a material of the insulating substrate comprises epoxy glass cloth laminate, epoxy resin, prepreg or ceramics.

3. The circuit board structure according to claim 1 , further comprising: a dielectric layer, disposed on the lower surface of the carrier, wherein the heat dissipation fin is disposed on the dielectric layer, and the dielectric layer is positioned between the carter and the heat dissipation fin.

4. The circuit board structure according to claim 1 , further including: a dielectric layer, disposed on the patterned circuit layer, wherein the heat dissipation fin is disposed on the dielectric layer, and the dielectric layer is positioned between the patterned circuit layer and the heat dissipation fin.

5. The circuit board structure according to claim 1 , wherein the carrier is a metal substrate, and a material of the metal substrate comprises copper, aluminum or alloy.

6. The circuit board structure according to claim 5 , further comprising:
a dielectric layer, disposed between the patterned circuit layer and the carrier.

7. The circuit board structure according to claim 6 , wherein a heat conductivity coefficient of the dielectric layer is greater than 1 W/(m·K).

8. The circuit board structure according to claim 5 , wherein
the heat dissipation fin, is disposed on the carrier, and the carrier is positioned between the patterned circuit layer and the heat dissipation fin.

9. The circuit board structure according to claim 1 , wherein the adhesive material comprises solder, conductive paste or dielectric paste.

10. The circuit board structure according to claim 1 , wherein the at least one fluid channel is filled with a heat dissipation fluid, and the heat dissipation fluid circulates between the heat absorption section and the heat dissipation section.

11. The circuit board structure according to claim 10 , wherein the heat dissipation fluid is a dielectric fluid, and the dielectric fluid comprises liquid or gas.

12. The circuit board structure according to claim 1 , wherein a thickness of the patterned circuit layer is between 10 microns and 75 microns.

13. The circuit board structure according to claim 12 , wherein a pore size of the at least one fluid channel is between 5 microns and 50 microns.

14. The circuit board structure according to claim 1 , wherein the at least one heat source comprises at least one chip or at least one package.

15. The circuit board structure according to claim 1 , wherein the at least one heat source is electrically connected to the patterned circuit layer by at least one wire.

Assignees

• Unimicron Technology Corp

Inventors

• Tain Ra-Min
• Po Chi-Chun
• Wang Po-Hsiang

Classifications

• H05K1/05 Primary

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K1/0272 Primary

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title