Integrated millimeter wave antenna modules

Patent metadata

Field	Value
Publication number	US-11335992-B2
Application number	US-202016990879-A
Country	US
Kind code	B2
Filing date	Aug 11, 2020
Priority date	Sep 5, 2019
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

First claim

What is claimed is:

1. Apparatus comprising:
a logic board;
an antenna board surface-mounted to the logic board;
antennas on the antenna board and configured to radiate at a frequency greater than 10 GHz; and
a radio-frequency integrated circuit surface-mounted to the logic board and comprising radio-frequency front end circuitry for the antennas.

2. The apparatus defined in claim 1 , further comprising:
first solder balls that couple the antenna board to the logic board; and
second solder balls that couple the radio-frequency integrated circuit to the logic board.

3. The apparatus defined in claim 2 , wherein the logic board has opposing first and second surfaces, the antenna board is surface-mounted to the first surface using the first solder balls, and the radio-frequency integrated circuit is surface-mounted to the first surface using the second solder balls.

4. The apparatus defined in claim 3 , further comprising:
transmission line structures in the logic board that couple the first solder balls to the second solder balls.

5. The apparatus defined in claim 4 , wherein the transmission line structures comprise a first impedance matching segment at the first solder balls and a second impedance matching segment at the second solder balls.

6. The apparatus defined in claim 2 , wherein the logic board has opposing first and second surfaces, the antenna board is surface-mounted to the first surface using the first solder balls, and the radio-frequency integrated circuit is surface-mounted to the second surface using the second solder balls.

7. The apparatus defined in claim 6 , further comprising:
transmission line structures in the logic board that couple the first solder balls to the second solder balls.

8. The apparatus defined in claim 7 , wherein the transmission line structures comprise a first impedance matching segment at the first solder balls and a second impedance matching segment at the second solder balls.

9. The apparatus defined in claim 6 , further comprising:
a vertical passthrough that extends through the logic board to couple the first solder balls to the second solder balls.

10. The apparatus defined in claim 2 , wherein the antenna board comprises:
transmission line structures that couple the first solder balls to antenna resonating elements of the antennas.

11. The apparatus defined in claim 10 , wherein the transmission line structures comprise an impedance matching segment at the first solder balls that is configured to match an impedance of the first solder balls to an impedance of the antennas.

12. The apparatus defined in claim 11 , wherein the logic board further comprises additional transmission line structures that couple the first solder balls to the second solder balls and that comprise a first additional impedance matching segment at the first solder balls and a second additional impedance matching segment at the second solder balls.

13. The apparatus defined in claim 1 , wherein the antennas are arranged in a phased antenna array.

14. The apparatus defined in claim 13 , wherein the radio-frequency front end circuitry comprises phase and magnitude controllers for the phased antenna array that are configured to steer radio-frequency signals conveyed by the antennas at the frequency.

15. The apparatus defined in claim 1 , wherein the apparatus is an electronic device, the electronic device having opposing first and second faces, and the electronic device comprising:
a display at the first face; and
a dielectric cover layer at the second face, wherein the antennas are configured to radiate through the dielectric cover layer.

16. The apparatus defined in claim 15 , wherein the logic board comprises a main logic board for the electronic device.

17. The apparatus defined in claim 1 , wherein the radio-frequency integrated circuit comprises a system in package (SIP) surface-mounted to the logic board.

18. A logic-board-integrated antenna module comprising:
a logic board;
a printed circuit board mounted to the logic board;
an array of antenna resonating elements patterned on the printed circuit board and configured to radiate at a frequency between 10 GHz and 300 GHz;
a package mounted to the logic board, the package comprising radio-frequency front end circuitry for the array of antenna resonating elements; and
transmission line structures on the logic board, wherein the transmission line structures couple the radio-frequency front end circuitry to the array of antenna resonating elements patterned on the printed circuit board.

19. The logic-board-integrated antenna module defined in claim 18 , wherein the transmission line structures comprise an impedance matching segment configured to match an impedance of the radio-frequency front end circuitry to an impedance of the array of antenna resonating elements.

20. Apparatus comprising:
a logic board;
a package mounted to the logic board and having radio-frequency front end circuitry; and
an antenna board mounted to the logic board and having antennas configured to radiate at a frequency between 10 GHz and 300 GHz, wherein the logic board is configured to form a radio-frequency interface between the radio-frequency front end circuitry in the package and the antennas in the antenna board.

Assignees

• Apple Inc

Inventors

• Edwards Jennifer M
• Yong Siwen
• Wu Jiangfeng
• Rajagopalan Harish
• Avser Bilgehan
• Paulotto Simone
• Pascolini Mattia

Classifications

• H01Q1/243

  with built-in antennas · CPC title

• H01Q5/42

  using two or more imbricated arrays (H01Q5/49 takes precedence) · CPC title

• H01Q21/061 Primary

  Two dimensional planar arrays · CPC title

• H01Q5/335

  at the feed, e.g. for impedance matching · CPC title

• H01Q3/26

  varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture ({H01Q3/12,} H01Q3/22, H01Q3/24 take precedence) · CPC title