Electronic device

Patent metadata

Field	Value
Publication number	US-11334124-B2
Application number	US-202117152794-A
Country	US
Kind code	B2
Filing date	Jan 20, 2021
Priority date	May 15, 2020
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

An electronic device including two bodies, at least one hinge assembly, and a hinge cover is provided. The two bodies are pivoted to each other through the hinge assembly. The hinge cover is connected between the two bodies and covers the hinge assembly. The hinge cover includes a plurality of shell parts, and the shell parts are movably connected to each other in sequence. The hinge cover has at least one first heat dissipation opening and at least one heat dissipation flow channel, and the at least one heat dissipation flow channel communicates the first heat dissipation opening and an inner space of at least one of the bodies.

First claim

What is claimed is:

1. An electronic device, comprising:
two bodies;
at least one hinge assembly, wherein the two bodies are pivoted to each other through the at least one hinge assembly; and
a hinge cover, connected between the two bodies and covering the at least one hinge assembly, the hinge cover comprising a plurality of shell parts movably connected to each other in sequence, at least one first heat dissipation opening, and at least one heat dissipation flow channel, wherein the at least one heat dissipation flow channel communicates with the at least one first heat dissipation opening and an inner space of at least one of the bodies.

2. The electronic device according to claim 1 , comprising a heat dissipation fan disposed in the inner space of the at least one of the bodies and adapted to provide a heat dissipation air flow, wherein at least a part of the heat dissipation air flow passes through the at least one heat dissipation flow channel and flows out of the electronic device from the at least one first heat dissipation opening.

3. The electronic device according to claim 2 , comprising a heat dissipation structure disposed in the inner space of the at least one of the bodies and located between the heat dissipation fan and the at least one heat dissipation flow channel, wherein at least a part of the heat dissipation air flow flows along the heat dissipation structure and arrives at the at least one heat dissipation flow channel.

4. The electronic device according to claim 2 , comprising a display module disposed in the inner space of the at least one of the bodies, wherein the at least one of the bodies comprises a second heat dissipation opening, and a part of the heat dissipation air flow flows along a surface of the display module and flows out of the electronic device from the second heat dissipation opening.

5. The electronic device according to claim 1 , wherein the number of the at least one first heat dissipation opening is plural, and the first heat dissipation openings are formed in at least a part of the shell parts, respectively.

6. The electronic device according to claim 1 , wherein an overlapping region exists between any two adjacent shell parts of the shell parts, and a size of the overlapping region is changed along with relative movement of the shell parts.

7. The electronic device according to claim 1 , wherein at least one retaining wall is arranged in the hinge cover, and the at least one retaining wall separates the at least one hinge assembly from the at least one heat dissipation flow channel.

8. The electronic device according to claim 7 , wherein each of the shell parts comprises at least one extending wall, and the extending walls of the shell parts are arranged in sequence to constitute the at least one retaining wall.

9. The electronic device according to claim 1 , wherein the hinge cover comprises a line channel, a line is suitable for extending from one of the bodies to the other one of the bodies through the line channel, at least one retaining wall is arranged in the hinge cover, and the at least one retaining wall separates the line channel from the at least one heat dissipation flow channel.

10. The electronic device according to claim 9 , wherein each of the shell parts comprises at least one extending wall, and the extending walls of the shell parts are arranged in sequence to constitute the at least one retaining wall.

11. The electronic device according to claim 1 , wherein the at least one hinge assembly comprises a plurality of rotating shafts movably connected to each other in sequence, and the shell parts are connected to the rotating shafts, respectively.

12. The electronic device according to claim 11 , comprising a plurality of buckle members installed on the rotating shafts, respectively, wherein each of the shell parts comprises at least one buckle part, and the buckle parts of the shell parts are buckled on the plurality of buckle members, respectively.

13. The electronic device according to claim 12 , wherein each buckle member of the plurality of buckle members comprises a receding notch, and when the rotating shafts move relatively, the receding notch provides space for another adjacent buckle member of the plurality of buckle members to move.

Assignees

• Chao Kai Cheng
• Chan Chia Huang
• Chen You Yu
• Hsu Chia Hao
• Compal Electronics Inc

Inventors

• Chao Kai-Cheng
• Chan Chia-Huang
• Chen You-Yu
• Hsu Chia-Hao

Classifications

• G06F1/1681 Primary

  Details related solely to hinges (hinge details related to the transmission of signals or power are classified in G06F1/1683) · CPC title

• G06F1/1616

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

• G06F1/1633

  Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626 · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F2200/202

  Air convective hinge · CPC title