Embedded processor-based three-dimensional acoustic imaging real-time signal processing device

Patent metadata

Field	Value
Publication number	US-11333759-B2
Application number	US-201816308401-A
Country	US
Kind code	B2
Filing date	Feb 12, 2018
Priority date	Mar 1, 2017
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

The present invention had disclosed an embedded processor based 3D acoustic imaging real-time signal processing device of modularized design; the system comprises an embedded GPU signal processing subsystem, a signal interaction subsystem and a signal acquisition subsystem. The system takes Tegra K1 embedded GPU processor as the core; Tegra K1 embedded GPU processor is provided with features of OpenGL4.4, OpenGL ES 3.1 and CUDA, which has high parallel image processing capability and abundant high-speed data interconnection interface; it is especially applicable to high-speed data transmission and effective calculation of image algorithm for 3D acoustic imaging real-time signal processing device. Meanwhile, it can realize high-speed data interaction between signal processing subsystem and numerous signal acquisition subsystems; the whole system has powerful data interaction capability and real-time parallel processing capability.

First claim

The invention claimed is:

1. An embedded processor based 3D real-time acoustic imaging signal processing device, comprising:
a signal acquisition system with a plurality of signal acquisition subsystems,
at least one signal interaction subsystem, and
at least one embedded GPU signal processing subsystem;
wherein the signal acquisition system collects and receives signal data from any channel in the acoustic array according to command from embedded GPU signal processing subsystem, and proceed with preliminary processing of signal data before sending the data as preliminarily processed to the embedded GPU signal processing subsystem via the signal interaction subsystem; the embedded GPU signal processing subsystem processes preliminarily processed data as received to obtain image data;
wherein each of the signal acquisition subsystems comprises:
a command interface for the signal acquisition subsystem, used to receive command from embedded GPU signal processing subsystem, and send the commend to a first FPGA chip;
the first FPGA chip, used to control opening or closure of any channel in the transducer array by the programmable switch according to the command received, receive preprocessing data among processed signal data from some channels in the transducer array, control programmable amplification chip according to preprocessing data to realize real-time gain control, and send preprocessing data to a LVDS interface;
a programmable switch, used to control opening or closure of ant channel in the transducer array to realize sparsification of 3D acoustic imaging transducer array;
an amplifying filter chip, used to receive and collect analog signals for amplification and filtering;
a programmable amplifying chip, used for real-time gain and amplification of analog signal data as received according to control signals from the first FPGA chip;
an AD chip, used to convert analog signals as processed into digital signal data to obtain preprocessing data, and send preprocessing data to the first FPGA chip; and
the LVDS interface, used to send preprocessing data in the first FPGA chip to signal interaction subsystem;
wherein the signal interaction subsystem comprises:
a command interface for the signal interaction subsystem, used to receive commands from embedded GPU signal processing subsystem, and send them to a second FPGA chip;
multi LVDS interfaces, used to the second FPGA chip for synchronous receiving of preprocessing data from numerous signal acquisition subsystems;
the second FPGA chip, used to control the multi LVDS interfaces for receiving of preprocessing data as well as synchronous buffering, sorting and packing of preprocessing data according to commands from signal acquisition subsystem; furthermore, it aims to transmit preprocessing data to PCIe bus according to commands from embedded GPU signal processing system; and
a first PCIe bus, used to send preprocessing data received by the second FPGA chip to the embedded GPU signal processing system;
wherein the embedded GPU signal processing subsystem comprises:
a command interface for the embedded GPU signal processing subsystem, used to receive commands from the embedded GPU signal processing subsystem, and send them to the signal interaction subsystem and the signal acquisition subsystem;
a second PCIe bus, used to receive preprocessing data from signal interaction subsystem, and send the preprocessing data to Tegra K1 embedded GPU processor; the second PCIe bus can realize the maximum data transmission rate of 20 Gbps to satisfy transmission bandwidth for 3D sonar preprocessing data;
a Tegra K1 embedded GPU processor, used to control data received by the second PCIe bus, and calculate preprocessing data as received to obtain image data, and control remote transmission of image data by Gigabit Ethernet chip, optical fiber transceiver as well as display of image data via a DSI display interface;
a transmission interface, used to control transmission of sonic wave in certain time sequence;
a Gigabit Ethernet chip and Gigabit Ethernet interface, used to realize remote transmission of image data;
a Gigabit transceiver chip and port, used to realize remote transmission of image data via the optical fiber;
the DSI display interface, used to transmit image data to the display screen for display of 3D data; and
a debugging interface, used to receive external command for debugging of embedded GPU signal processing subsystem.

Assignees

• Univ Zhejiang

Inventors

• Liu Xuesong
• Zhou Fan
• Zhao Dongdong
• Chen Yaowu

Classifications

• G06T1/20 Primary

  Processor architectures; Processor configuration, e.g. pipelining · CPC title

• G01S15/89 Primary

  for mapping or imaging · CPC title

• G01S7/6245

  Stereoscopic displays; Three-dimensional displays; Pseudo-three dimensional displays · CPC title

• G01S15/8993 Primary

  Three dimensional imaging systems · CPC title

• G01S15/8929

  using a three-dimensional transducer configuration · CPC title