Sensor signal processing apparatus and sensor apparatus
US-2015358027-A1 · Dec 10, 2015 · US
US11333560B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11333560-B2 |
| Application number | US-201414895967-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 3, 2014 |
| Priority date | Jun 4, 2013 |
| Publication date | May 17, 2022 |
| Grant date | May 17, 2022 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A heat-sensitive resistor with a negative or positive temperature coefficient comprises respectively an antimony-doped tin oxide-based resistive element or a carbon black-based resistive element, containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50000 and 150000 g/mol, and a glass transition temperature Tg between 40 and 100° C.
Opening claim text (preview).
The invention claimed is: 1. A circuit comprising a support and, on the support, a heat-sensitive resistor of negative or positive temperature coefficient, respectively comprising a resistive element based on antimony tin oxide, said resistive element also containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50,000 and 150,000 g/mol, and a glass transition temperature Tg between 40 and 100° C., and wherein the polymer belongs to the family of styrenic polymers or to the family of fluorinated polymers. 2. The circuit of claim 1 , wherein the resistive element comprises from 5% to 40% by mass of dry extract of the polymer with respect to the total mass of the resistive element. 3. The circuit of claim 1 , wherein the heat-sensitive resistor further comprises a resistive element based on carbon black, said resistive element also containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50,000 and 150,000 g/mol, and a glass transition temperature Tg between 40 and 100° C. 4. The circuit of claim 3 , wherein the heat sensitive resistor is of positive temperature coefficient having an adjustable threshold temperature with a resistance which is constant below said threshold and which increases along with temperature above said threshold comprising a first resistive track made of a heat-sensitive paste of positive temperature coefficient, PTC, arranged in electrical series with a second resistive track made of a heat-sensitive paste of negative temperature coefficient, NTC. 5. A method of manufacturing a heat-sensitive resistor of negative or positive temperature coefficient, comprising the steps of: forming a first solution comprising antimony tin oxide, said first solution also containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50,000 and 150,000 g/mol, and a glass transition temperature Tg between 40 and 100° C., and wherein the polymer belongs to the family of styrenic polymers or to the family of fluorinated polymers; forming portions of the first solution on a support; and heating the portions. 6. The method of claim 5 , wherein the step of manufacturing the first solution comprises the step of: providing a second solution comprising antimony tin oxide or carbon black and a first solvent; providing a third solution comprising the polymer and a second solvent; and mixing the second and third solutions to provide the first solution. 7. The method of claim 6 , wherein the third solution is by a mass proportion smaller than 30%, preferably from 10 to 30% with respect to the total mass of the first solution. 8. The method of claim 6 , the third solution comprises from 15 to 30% by mass, for example, 25%, of the polymer in from 85 to 70% by mass, for example, 75%, of the second solvent. 9. The method of claim 6 , wherein the first solvent is selected from the group comprising cyclopentanone, ethyl acetate, tetrahydrofuran, acetone, 3-hexanone, and 2-pentanone for antimony tin oxide or the group comprising cyclopentanone, dibutyl carbitol, and ethylene glycol diacetate for carbon black. 10. The method of claim 6 , wherein the second solvent has an evaporation temperature in the range from 100 to 170° C. 11. The method of claim 6 , wherein the second solvent is selected from the group comprising toluene or butyl acetate for styrenic polymers or perfluorotributylamine (FC43) for fluorinated polymers. 12. The method of claim 6 , wherein the evaporation temperature of the first solvent is greater than the evaporation temperature of the second solvent. 13. The method of claim 5 , further comprising the steps of: forming a fourth solution comprising carbon black containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50,000 and 150,000 g/mol, and a glass transition temperature Tg between 40 and 100° C., and wherein the polymer belongs to the family of styrenic polymers or to the family of fluorinated polymers; forming portions of the fourth solution on a support; and heating the portions. 14. The method of claim 13 of manufacturing a heat-sensitive resistor of positive temperature coefficient having an adjustable temperature threshold with a resistance which is constant below said threshold and which increases along with temperature above said threshold, comprising the steps of: forming in series on the support a first portion made of a heat-sensitive paste of positive temperature coefficient, PTC, and a second portion made of a heat-sensitive paste of negative temperature coefficient, NTC, the first and/or the second portion being formed with the first solution; and heating the first and second portions to form first and second resistive tracks.
using resistive elements · CPC title
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.