Printed circuit heat exchanger and heat exchange device including the same

US11333448B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11333448-B2
Application numberUS-201916529814-A
CountryUS
Kind codeB2
Filing dateAug 2, 2019
Priority dateSep 18, 2018
Publication dateMay 17, 2022
Grant dateMay 17, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A printed circuit heat exchanger is provided. The printed circuit heat exchanger may include: a first bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels; and a second bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels, wherein the first bonding plate and the second bonding plate are alternately stacked.

First claim

Opening claim text (preview).

What is claimed is: 1. A printed circuit heat exchanger comprising: a first bonding plate formed of two plates bonded to each other; and a second bonding plate formed of two plates bonded to each other, wherein the first bonding plate and the second bonding plate are alternately stacked, and wherein the first bonding plate comprises: an upper plate including a flat surface in which a plurality of upper plate flow channels are formed, each of the plurality of upper plate flow channels including an upper plate inlet and an upper plate straight flow channel communicating with the upper plate inlet, the upper plate inlet extending in a longitudinal direction of the upper plate and including a first end extending to a first edge of the upper plate and a second end opposite to the first end, the upper plate straight flow channel extending from the second end of the upper plate inlet toward a second edge of the upper plate obliquely with respect to the longitudinal direction of the upper plate, the first and second edges of the upper plate being orthogonal to each other; and a lower plate bonded to the upper plate, the lower plate including a flat surface in which a plurality of lower plate flow channels are formed, each of the plurality of lower plate flow channels including a lower plate inlet and a lower plate straight flow channel communicating with the lower plate inlet, the lower plate inlet extending in a longitudinal direction of the lower plate and including a first end extending to a first edge of the lower plate and a second end opposite to the first end, the lower plate straight flow channel extending from the second end of the lower plate inlet toward a second edge of the lower plate obliquely with respect to the longitudinal direction of the lower plate, the first and second edges of the lower plate being orthogonal to each other, wherein the upper and lower plates are bonded to each other such that their flat surfaces face each other, such that the upper plate inlet coincides with the lower plate inlet in a stacking direction of the first and second bonding plates, and such that the upper plate straight flow channel forms an overlapping section with the lower plate straight flow channel, wherein the second bonding plate comprises an upper plate including a flat surface in which a plurality of upper plate flow channels are formed and a lower plate bonded to the upper plate and including a flat surface in which a plurality of lower plate flow channels are formed, each of the plurality of upper plate flow channels including an upper plate inlet, and each of the plurality of lower plate flow channels including a lower plate inlet, wherein each of the first and second bonding plates has a rectangular shape, inlets of the upper and lower plates of the first bonding plate are parallel to long sides of the first bonding plate, and inlets of the upper and lower plates of the second bonding plate are parallel to short sides of the second bonding plate. 2. The printed circuit heat exchanger according to claim 1 , wherein the plates of each of the first bonding plate and the second bonding plate are made of a heat resistant material including stainless steel and a nickel-base alloy, and wherein the plurality of flow channels are formed in respective flat surfaces by etching a fine pattern in the heat resistant material including stainless steel and a nickel-base alloy. 3. The printed circuit heat exchanger according to claim 1 , wherein the upper and lower plates bonded to each other form a flow channel pattern connecting each of the plurality of lower plate inlets and each of the plurality of upper plate inlets to each other. 4. The printed circuit heat exchanger according to claim 3 , wherein the flow channel pattern connects each of the plurality of lower plate inlets and each of the plurality of upper plate inlets to each other through a first zigzag-shaped flow channel formed by the overlapping section of each of the plurality of upper plate flow channels and each of the plurality of lower plate flow channels. 5. The printed circuit heat exchanger according to claim 4 , wherein the first zigzag-shaped flow channel is disposed adjacent to a second zigzag-shaped flow channel to form a rhombus flow channel in a plan view by overlapping the first and second zigzag-shaped flow channels at an intersection occurring at vertices of the first and second zigzag-shaped flow channels. 6. The printed circuit heat exchanger according to claim 1 , wherein each of the plurality of upper plate flow channels of the second bonding plate includes: a plurality of upper plate straight flow channels extending toward a first edge of the upper plate obliquely with respect to a longitudinal direction of the upper plate, and a plurality of upper plate inlets respectively communicating with an end of each of the plurality of upper plate straight flow channels, each of the plurality of upper plate inlets including a first end and a second end opposite to the first end, the first end respectively communicating with the end of each of the plurality of upper plate straight flow channels and the second end extending to the first edge of the upper plate, and wherein each of the plurality of lower plate flow channels of the second bonding plate includes: a plurality of lower plate straight flow channels extending toward a first edge of the lower plate obliquely with respect to a longitudinal direction of the upper plate, and a plurality of lower plate inlets respectively communicating with an end of each of the plurality of lower plate straight flow channels, each of the plurality of lower plate inlets including a first end and a second end opposite to the first end, the first end respectively communicating with the end of each of the plurality of lower plate straight flow channels and the second end extending to the first edge of the lower plate. 7. The printed circuit heat exchanger according to claim 1 , wherein the plurality of upper plate flow channels of the first bonding plate and the plurality of lower plate flow channels of the first bonding plate are configured to transmit a flow of high-temperature fluid including ethylene glycol (EG) or water, and wherein the plurality of upper plate flow channels of the second bonding plate and the plurality of lower plate flow channels of the second bonding plate are configured to transmit a flow of low-temperature fluid including a cryogenic fluid. 8. The printed circuit heat exchanger according to claim 7 , wherein the first bonding plate and the second bonding plate are stacked at a ratio of two first bonding plates for every one second bonding plate. 9. The printed circuit heat exchanger according to claim 1 , wherein each of the plurality of upper plate flow channels further includes an upper plate outlet and an upper plate straight flow channel communicating with the upper plate outlet, the upper plate outlet extending in the longitudinal direction of the upper plate and including a third end extending to a third edge of the upper plate and a fourth end opposite to the third end, the upper plate straight flow channel extending from the fourth end of the upper plate outlet toward a fourth edge of the upper plate obliquely with respect to the longitudinal direction of the upper plate, the third and fourth edges of the upper plate being orthogonal to each other, and wherein each of the plurality of lower plate flow channels further includes a lower plate outlet and a lower plate straight flow channel communicating with the lower plate outlet, the lower plate outlet extending in the longitudinal direction of the lower plate and including a third end extending to a third edge of the lower plate and a fourth end

Assignees

Inventors

Classifications

  • F28F3/048Primary

    in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels · CPC title

  • Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning · CPC title

  • by creating turbulence, e.g. by stirring, by increasing the force of circulation (F28F13/08 takes precedence) · CPC title

  • the deformations being linear, e.g. corrugations · CPC title

  • F28D9/005Primary

    the plates having openings therein for both heat-exchange media · CPC title

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What does patent US11333448B2 cover?
A printed circuit heat exchanger is provided. The printed circuit heat exchanger may include: a first bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels; and a second bonding plat…
Who is the assignee on this patent?
Doosan Heavy Ind & Construction Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28F3/048. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 17 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).