Electrically insulating resin composition and laminate sheet

US11331876B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11331876-B2
Application numberUS-201615191683-A
CountryUS
Kind codeB2
Filing dateJun 24, 2016
Priority dateJul 16, 2010
Publication dateMay 17, 2022
Grant dateMay 17, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laminate sheet consisting of one resin composition layer and two sheet layers, wherein each of the sheet layers is disposed on opposing surfaces of the resin composition layer and the two sheet layers are bonded to each other with the resin composition layer interposed therebetween, wherein the resin composition layer comprising a polysulfone resin including a plurality of sulfonyl groups in a molecule and a polyamide resin, and the proportion of the polyamide resin is 10 to 40% by mass, the polysulfone resin is a polyether polyphenylsulfone resin that includes a plurality of ether bonds and a plurality of aromatic hydrocarbons in the molecule, the polyamide resin is a semi-aromatic polyamide resin obtained by polymerizing aliphatic diamine with aromatic dicarboxylic acid, each of the sheet layers comprises wholly aromatic polyamide, the laminate sheet meets a UL94 VTM-0 standard, and the laminate sheet exhibits a peel strength of 1.1 N/10 mm or higher and 2.2 N/10 mm or less. 2. The laminate sheet according to claim 1 , wherein at least one of the sheet layers is paper produced by a wet papermaking method. 3. The laminate sheet according to claim 1 , wherein at least one of the sheet layers is a non-woven fabric. 4. The laminate sheet according to claim 1 , wherein at least a surface of one of the sheet layers on a side of the resin composition layer is subjected to a corona treatment. 5. The laminate sheet according to claim 1 , wherein the laminate sheet is configured such that an interlayer adhesive force between the resin composition layer and one of the sheet layers is larger than a cohesive failure force of the resin composition layer and that of the one of the sheet layers. 6. The laminate sheet according to claim 1 , wherein a strength retention of tensile strength after 250 hours have passed at 240° C. is not less than 50%. 7. The laminate sheet according to claim 1 , wherein the sheet laminate is used in application of electrical insulation. 8. The laminate sheet according to claim 1 , wherein the semi-aromatic polyamide resin is a semi-aromatic polyamide resin obtained by polymerizing nonanediamine as the aliphatic diamine with terephthalic acid as the aromatic dicarboxylic acid. 9. The laminate sheet according to claim 1 , further comprising a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is disposed on at least one of topmost surfaces of the laminate sheet, and the pressure-sensitive adhesive layer has flame retardancy that meets a UL94 VTM-0 standard. 10. The laminate sheet according to claim 1 , wherein the resin composition layer is molded.

Assignees

Inventors

Classifications

  • of synthetic resin · CPC title

  • Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302 · CPC title

  • Of polythioether · CPC title

  • C08L81/06Primary

    Polysulfones; Polyethersulfones · CPC title

  • Insulating · CPC title

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What does patent US11331876B2 cover?
The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interpos…
Who is the assignee on this patent?
Nitto Shinko Corp, Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C08L81/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 17 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).