Plasma etching method using faraday box
US-2021027996-A1 · Jan 28, 2021 · US
US11331869B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11331869-B2 |
| Application number | US-201816635457-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2018 |
| Priority date | Aug 16, 2017 |
| Publication date | May 17, 2022 |
| Grant date | May 17, 2022 |
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The present invention relates to a method of manufacturing a mold substrate for a diffraction lattice light guide plate, and a method of manufacturing a diffraction lattice light guide plate.
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The invention claimed is: 1. A method of manufacturing a mold substrate for a diffraction lattice light guide plate, the method comprising: preparing a faraday cage with a mesh having a sheet resistance of 0.5 Ω/sq or more provided on an upper surface of the faraday cage; providing a sample substrate on a bottom surface of the faraday cage and carrying out flat plasma etching of the sample substrate; designating a high etching region inside the faraday cage by examining the sample substrate after etching; preparing a support having an inclined surface and positioning a base of the inclined surface in the high etching region of the faraday cage to align the support; providing a substrate for a mold on the inclined surface of the support; and plasma etching the substrate to simultaneously form a first inclined pattern portion at one side of the substrate and a second inclined pattern portion at the other side of the substrate, wherein an etch rate of the plasma etching decreases and then reversely increases from an upper region to a lower region of the substrate on the inclined surface of the support, wherein the first inclined pattern portion includes a first inclined recess pattern having a depth gradient, and wherein the second inclined pattern portion includes a second inclined recess pattern having a depth difference of 0 nm to 50 nm. 2. The method of claim 1 , wherein a depth of the second inclined recess pattern is 70% to 130% of a maximum depth of the first inclined recess pattern. 3. The method of claim 1 , wherein a difference between an etch speed at a highest point of the substrate on the inclined surface of the support and an etch speed at a lowest point of the substrate on the inclined surface of the support is 30% or less. 4. The method of claim 1 , wherein the mesh portion is a metal mesh having a fluorocarbon radical adsorbed thereon. 5. The method of claim 1 , wherein the high etching region is linearly represented on the sample substrate. 6. The method of claim 1 , further comprising: providing a mask including an opening pattern portion on the substrate for the mold. 7. The method of claim 1 , wherein a difference between a minimum depth and a maximum depth of the first inclined recess pattern is 100 nm or more and 200 nm or less. 8. The method of claim 1 , wherein the first inclined pattern portion is formed in the region where the etch rate decreases or the region where the etch rate reversely increases. 9. The method of claim 1 , wherein an etch direction during patterning is perpendicular to a lower surface of the faraday cage. 10. The method of claim 1 , wherein an angle of inclination of the support is 35° or more and 45° or less. 11. The method of claim 1 , wherein the support includes two inclined surfaces, and the base of each of the two inclined surfaces is positioned in a high etching region of the faraday cage. 12. A method of manufacturing a diffraction lattice light guide plate, the method comprising: preparing a mold substrate for a diffraction lattice light guide plate according to the method of claim 1 ; applying a resin composition on the mold substrate for the diffraction lattice light guide plate; forming a diffraction lattice pattern by hardening the resin composition; providing a transparent substrate on a surface opposite to a surface provided with a diffraction lattice pattern; and separating the mold substrate to form the diffraction lattice light guide plate.
Manufacturing aspects; Material aspects · CPC title
the radio frequency energy being inductively coupled to the plasma · CPC title
Light guides, optical cables · CPC title
2-D arrangement of prisms, protrusions, indentations or roughened surfaces · CPC title
Dipping a core {(B29C41/10 takes precedence)} · CPC title
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