Heat sink and communications product

Patent metadata

Field	Value
Publication number	US-11330737-B2
Application number	US-202017079408-A
Country	US
Kind code	B2
Filing date	Oct 23, 2020
Priority date	Dec 30, 2016
Publication date	May 10, 2022
Grant date	May 10, 2022

Abstract

A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

First claim

What is claimed is:

1. A heat sink, comprising:
a base; and
a plurality of fins disposed on the base to form a cooling fin structure, wherein each of the plurality of fins comprises:
a root connected to the base;
a tip located on a side opposite to the base;
a heated area located between the root and a spacing strip;
a dropping pipe located between the spacing strip and the tip, wherein the spacing strip separates the heated area from the dropping pipe in the fin,
a first passage; and
a second passage, wherein the first passage and the second passage are formed between the heated area and the dropping pipe,

wherein the heated area is configured to heat a working medium in the heated area to form a gas-liquid plug flow flowing toward the first passage and into the dropping pipe through the first passage, and
wherein the heat sink is configured by configuring a hydraulic diameter of a pipeline in the heated area and a hydraulic diameter of a pipeline of the dropping pipe according to a critical dimension, wherein the critical dimension is a maximum hydraulic diameter of a pipeline that can be used when the working medium in the heated area is heated in the pipeline to form the gas-liquid plug flow, so that a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area such that liquid in the dropping pipe flows toward the heated area through the second passage when the working medium is heated.

2. The heat sink according to claim 1 , wherein the pipeline in the heated area comprises a plurality of longitudinal pipelines and a transverse pipeline that is disposed between the plurality of longitudinal pipelines, wherein the longitudinal pipelines extend in a direction from the second passage to the first passage, and wherein the transverse pipeline is configured to perform pressure balancing and temperature balancing of liquid and vapor.

3. The heat sink according to claim 2 , wherein the heated area comprises a plurality of spacing zones, and wherein each of the spacing zones separates the heated area to form the longitudinal pipelines and the transverse pipeline.

4. The heat sink according to claim 3 , wherein the plurality of spacing zones are arranged in two columns, and wherein the two columns of spacing zones are interlaced and form three longitudinal pipelines.

5. The heat sink according to claim 3 , wherein the plurality of spacing zones are in a shape of a polygon or circle.

6. The heat sink according to claim 3 , wherein each of the plurality spacing zones is bar-shaped, wherein each of the plurality of spacing zones comprises two straight-lined long sides, wherein the two straight-lined long sides are connected by curved sides, wherein the plurality of spacing zones are arranged in two adjacent columns, wherein a longitudinal pipeline is formed between the two adjacent columns of the plurality of spacing zones, and wherein the transverse pipeline is formed between two adjacent spacing zones in one column.

7. The heat sink according to claim 2 , wherein each of the longitudinal pipelines extend in a shape of a wave line.

8. The heat sink according to claim 1 , wherein a side adjacent to the heated area of the spacing strip is in a shape of a wave line, and wherein a side adjacent to the dropping pipe of the spacing strip is straight-lined.

9. The heat sink according to claim 1 , wherein both a side adjacent to the heated area of the spacing strip and a side adjacent to the dropping pipe of the spacing strip are straight-lined.

10. The heat sink according to claim 1 , further comprising at least one column of dropping pipes, and wherein at least one column of dropping pipes are in two adjacent columns communicated with each other through a transverse pipeline.

11. The heat sink according to claim 1 , wherein the first passage is honeycombed, and wherein the first passage comprises at least two crisscrossed pipelines.

12. The heat sink according to claim 1 , wherein a range of the critical dimension is between 0.5 millimeters (mm) to 20 mm.

13. The heat sink according to claim 1 , wherein the fin is structured as a plate.

14. The heat sink according to claim 1 , further comprising a connecting piece connecting tips of two adjacent fins.

15. The heat sink according to claim 14 , wherein a plurality of holes are disposed on the connecting piece.

16. The heat sink according to claim 14 , wherein a quantity of the plurality fins is twice a quantity of connecting pieces.

17. The heat sink according to claim 16 , wherein a passage is disposed between two adjacent fins, and wherein two adjacent connecting pieces are isolated by the passage.

18. The heat sink according to claim 1 , further comprising a cover plate, wherein the plurality of fins are fastened between the cover plate and the base.

19. The heat sink according to claim 18 , wherein the base is a circuit board, and wherein a heat emitting element is disposed on a side opposite of the fins.

20. A communications product, comprising:
a heat emitting element, and heat of the heat emitting element is conducted from a side, which backs on a side of the fin, of the base of the heat sink to the base; and
a heat sink, comprising:
a base; and
a plurality of fins disposed on the base to form a cooling fin structure, wherein each of the plurality of fins comprises:
a root connected to the base; and
a tip located on a side opposite to the base;
a heated area located between the root and a spacing strip;
a dropping pipe located between the spacing strip and the tip, wherein the spacing strip separates the heated area from the dropping pipe in the fin;
a first passage; and
a second passage, wherein the first passage and the second passage are formed between the heated area and the dropping pipe,
wherein the heated area is configure to heat a working medium in the heated area to form a gas-liquid plug flow flowing toward the first passage and into the dropping pipe through the first passage, and
wherein the heat sink is configured by configuring a hydraulic diameter of a pipeline in the heated area and a hydraulic diameter of a pipeline of the dropping pipe according to a critical dimension, wherein the critical dimension is a maximum hydraulic diameter of a pipeline that can be used when the working medium in the heated area is heated in the pipeline to form the gas-liquid plug flow, so that a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area such that liquid in the dropping pipe flows toward the heated area through the second passage when the working medium is heated.

Assignees

• Huawei Tech Co Ltd

Inventors

• Hui Xiaowei
• Hong Yuping
• Chen Wei

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20281 Primary

  Thermal management, e.g. liquid flow control · CPC title

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title